Browse "School of Electrical Engineering(전기및전자공학부)" by Author 1380

Showing results 108 to 167 of 214

108
Impact of interfacial layer control in high-K gate dielectrics on GaAs for advanced CMOS devices

Cho, Byung Jin, 2007 MRS Spring Meeting, pp.0 - 0, MRS, 2007-04-09

109
Improved current drivability and gate stack integrity using buried SiC layer for strained Si/SiGe channel devices

Cho, Byung Jin; Zang, H; Loh, WY; Oh, HJ; Choi, KJ; Nguyen, HS; Lo, GQ, 211th Electrochemical Society Meeting, pp.0 - 0, 2007-05-06

110
Improvement in Contact Resistance of Screen-printed Bi2Te2.7Se0.3 Thick Films by Annealing in a Reduction Ambient

Kim, Yongjun; Kim, Sun Jin; Choi, Hyeongdo; We, Ju Hyung; Shin, Ji Seon; Yi, Kevin K.; Cho, Byung Jin, The 35th International Conference & The 1st Asian Conference on Thermoelectrics (ICT/ACT 2016), Wuhan University of Technology, 2016-06-02

111
Improvement of Data Retention and Erase Speed using Cubic-Structured HfO2 for Charge-trap type flash memory device

조병진, 17th Korean Conference on Semiconductors, 17th Korean Conference on Semiconductors, 2010-02-25

112
Improvement of retention and Vth window in Flash memory device through optimization of floating gate doping

Cho, Byung Jin; Shen, C; Pu, J; Li, MF, IEEE 2nd International conference on memory technology and design, pp.99 - 101, 2007-03-07

113
Improving electrical properties of CVD HfO2 by multi-step deposition and annealing in a gate cluster tool

Cho, Byung Jin; Yeo, CC; Joo, MS; Whoang, SJ; Kwong, DL; Bera, LK; Mathew, S, International Conf. on Solid State Devices and Materials (SSDM), pp.0 - 0, 2003-09-19

114
In-Depth Study on Mechanism of the Performance Improvement by High Temperature Annealing of the Al2O3 in a Charge-Trap Type Flash Memory Device

Cho, Byung Jin, 2010 International Conference on Solid State Devices and Materials, SSDM 2010, 2010-09-23

115
Inorganic-based High-Performance Flexible Thermoelectric Power Generator for Wearable Electronics Application

Cho, Byung Jin; Kim, Sun Jin; We, Ju Hyung; Choi, Hyeongdo; Kim, Yongjun; Shin, Ji Sun, The 18th International Symposium on the Physics of Semiconductors and Applications, Semiconductor Physics Division of the Korean Physical Society, 2016-07-05

116
Integration of Dual Channels MOSFET on Defect-Free, Tensile-Strained Germanium on Silicon

Cho, Byung Jin; Zang, H; Loh, WY; Ye, JD; Loh, TH; Lo, GQ, 2007 International Conference on Solid State Devices and Materials(SSDM), pp.0 - 0, 2007-09-18

117
Integration of Dual Metal Gate/High-K dielectric Stacks for Fermi-Level Pinning Free

Cho, Byung Jin, The 2nd International Workshop on Nanoscale Semiconductor Devices, pp.253 - 279, 2005-06-02

118
Integration of high-K gate dielectric into high mobility substrate

Cho, Byung Jin; Loh, WP; Zang, H; Dalapati, GK; Tong, Y; Choi, KJ, 2006 International Workshop on DIELECTRIC THIN FILMS FOR FUTURE ULSI DEVICES SCIENCE AND TECHNOLOGY, pp.8 - 10, 2006-11-10

119
Integration of Tensile-Strained Ge p-i-n Photodetector on Advanced CMOS Platform

Cho, Byung Jin; Wang, J; Loh, WY; Zang, H; Yu, MB; Chua, KT; Loh, TH, 4th International Conference on Group IV Photonics, pp.0 - 0, 2007-09-19

120
Integrity of gate oxides irradiated under electron-beam lithography conditions

Cho, Byung Jin; Chong, PF; Chor, EF; Joo, MS; Yeo, IS, Extended Abstract of the 1999 International Conf. on Solid State Devices and Materials (SSDM), pp.182 - 182, 1999-09-08

121
Interfacial adhesion and diffusion barrier characteristics of synthesized graphene

Yoon, Taeshik; Cho, Byung Jin; Kim, Taek-Soo, 2014 The World Conference on Carbon, Carbon, 2014-07-03

122
Interpretation of rapid thermal diffusion of phosphorus into silicon

조병진; Kim, CK, Semiconductor Workshop for Young Engineers, pp.0 - 0, 1991-03-05

123
Investigation of process dependence of graphene growth on nickel thin film

Cho, Byung Jin; Mun, JH; Hwang, C; Lim, SK, 56th AVS symposium, 2009-11-09

124
Investigation of PVD HfO2 MIM capacitors for Si RF and Mixed signal ICs application

Cho, Byung Jin; Hang, H; Ding, SJ; Zhu, C; Rustagi, RC; Lu, YF; Li, MF, International semiconductor device research symposium, pp.0 - 0, 2003-12-10

125
Investigation of quasi-breakdown mechanism in ultrathin gate oxides

Cho, Byung Jin; He, YD; Guan, H; Li, MF; Dong, Z, Materials Research Society (MRS) 1999 Fall Meeting Symp. Proc., pp.0 - 0, 1999-11-29

126
Investigation of the gate oxide integrity of the nitrided gate oxide using nitrogen implantation into polysilicon gate

Cho, Byung Jin; Ko, LH; Nga, YA; Chan, LH, Abstract Proc. of the Asia-Pacific SIA'98 Conf., pp.0 - 0, 1998-11-30

127
Investigation on Material Properties of Screen-printed Thermoelectric Thick films

Choi, Hyeongdo; Kim, Sun Jin; Kim, Yongjun; We, Ju Hyung; Shin, Ji Seon; Yi, Kevin K.; Cho, Byung Jin, The 35th International Conference & The 1st Asian Conference on Thermoelectrics (ICT/ACT 2016), Wuhan University of Technology, 2016-06-01

128
Issues on Metal Contact and Gate Electrode of Graphene Based FET

Cho, Byung Jin; Song, SM; Park, JK, The 4th International Conference on Recent Progress in Graphene Research (RPGR 2012), Institute of Physics (IOP), 2012-10

129
Low Cost and Flexible Non-Volatile Memory Using Oxidized Graphene and Analysis of Its Switching Mechanism

Hong, Seul Ki; Cho, Byung Jin, Nature conference - Graphene : The Road to Applications, Nature Publishing Group, 2011-05

130
LOW-COST THERMOELECTRIC POWER GENERATOR USING SCREEN PRINTING TECHNIQUE

Cho, Byung Jin; We, Ju Hyung; Kim, Sun Jin, 4th Molecular Materials Meeting (M3), Institute of Materials Research and Engineering, 2014-01-16

131
Material and electrical characterization of HfO2 films for MIM capacitors applications

Cho, Byung Jin; Hu, H; Zhu, C; Lu, YF; Zeng, JN; Wu, YH; Liew, YF, MRS Spring meeting, pp.0 - 0, 2003-04-22

132
Mechanisms limiting EOT scaling and gate leakage currents of high-k/metal gate stacks directly on SiGe and a method to enable sub-1nm EOT

Huang, J.; Kirsch, P.D.; Oh, J.; Lee, S.H.; Price, J.; Majhi, P.; Harris, H.R.; et al, 2008 Symposium on VLSI Technology Digest of Technical Papers, VLSIT, pp.82 - 83, 2008-06-17

133
Metal Carbide Electrodes for Gate-First Metal Gate CMOS Process

Cho, Byung Jin; Hwang, WS; Chan, DSH, IEEE 4th International Symposium on Advanced Gate Stack Technology, pp.0 - 0, 2007-09-10

134
Metal Electrode (Panel Presentation)

Cho, Byung Jin, Proceedings on 2nd International Symposium on Advanced Gate Stack Technology, pp.15 - 19, 2005-09-05

135
Metal gate/high-K dielectric stack on Si cap/ultra-thin pure Ge epi/Si substrate

Cho, Byung Jin; Yeo, CC; Lee, MH; Liu, CW; Choi, KJ; Lee, TW, Proceedings on 2005 IEEE Conference on Electron Devices and Solid-State Circuits, pp.107 - 110, 2005-12-08

136
Metal-Germanium contacts with Graphene Interfacial Layer

서유진; 오중건; 김택용; 조병진; Lee, Seok-Hee, International Conference on Electronic Materials and Nanotechnlogy for Green Engvironment, Korean Institute of Metals and Materials, 2012-09-18

137
MIM capacitors with HfO2 and HfAlOx for Si RF and analog applications

Cho, Byung Jin; Yu, X; Zhu, C; Hu, H; Chin, A; Li, MF; Kwong, DL, MRS Spring meeting, pp.0 - 0, 2003-04-21

138
MOCVD HfAlxOy gate dielectrics deposited using single cocktail liquid source

Cho, Byung Jin; Joo, MS; Yeo, CC; Whoang, SJ; Matthew, S; Bera, LK; Balasubramanian, N, 2003 International Conf. on Solid State Devices and Materials (SSDM), pp.0 - 0, 2003-09-19

139
Modeling of Thermal Conductivity Extraction of Thin Film Thermoelectric Materials Using a Screen Printing Technique

We, Ju Hyung; Kim, Sun Jin; Cho, Byung Jin, 6th Annual Energy Harvesting Workshop, 2011-08

140
Multiple-pulse laser annealing of boron-implanted preamorphized silicon and the process optimization

Cho, Byung Jin; Poon, D; Tan, LS; Bhat, M; See, A, IEEE 4th International Workshop on Junction Technology (IWJT-2004), pp.22 - 26, 2004-03-15

141
N-doped graphene aerogel loudspeaker

Kim, Choong Sun; Lee, Kyung Eun; Kim, Sang Ouk; Choi, Jung Woo; Cho, Byung Jin, The 8th International Conference on Recent Progress in Graphene/2D Research, SKKU Advanced Institute of Nano Technology, 2016-09-27

142
New breakdown mechanism of ultra thin gate oxides under ballistic transport

Cho, Byung Jin; Lee, SH; Joo, MS; Park, YJ; Kim, JC, 1st Korean Semiconductor Tech. Symp., pp.0 - 0, 1994-02-15

143
New reliability issues of CMOS transistors with 1.3 nm gate oxide

Cho, Byung Jin; Li, MF; Chen, G; Loh, WY; Kwong, DL, 7th International Symposium on Silicon Nitride and Silicon Dioxide Thin Insulating Films, pp.0 - 0, 2003-04-28

144
New Substrate Platform for Metal-Gate/High-k Gate Dielectric MOSFET Integration and RF Technology up to 100 GHz

Cho, Byung Jin; Chin, A; Mei, P; Zhu, C; Li, MF; Lee, S; Yoo, WJ, Advanced Crystal Growth Conference and 2003 International Symposium on Substrate Engineering, pp.0 - 0, 2003-11-13

145
Niobium oxide (Nb2O5) as a high-K dielectric for RF IC application

Cho, Byung Jin; Kim, SJ; Li, MF; Zhu, C; Chin, A; Yu, MB; Xiong, YZ, 3rd International Conference on Materials for Advanced Technologies, pp.10 - 10, 2005-07-03

146
Non-volatile Flexible ReRAM based on graphene oxide

조병진, IEEK Summer Conference 2010, IEEK Summer Conference 2010, 2010-06-16

147
Non-Volatile Memory Using Graphene Oxide for Flexible Electronics

Cho, Byung Jin, 10th International Conference on Nanotechnology (IEEE NANO 2010), IEEE, 2010-08-18

148
Novel oxynitridation technology for highly reliable thin dielectrics

Cho, Byung Jin; Joo, MS; Lee, SH; Lee, SK; KIm, JC; Choi, SH, Symp. on VLSI Tech., pp.107 - 107, 1995-06-07

149
Novel ZrO2/Si3N4 Dual Charge Storage Layer to Form Step-Up Potential Wells for Highly Reliable Multi-Level Cell Application

Cho, Byung Jin; Zhang, G; Hwang, WS; Bobade, SM; Lee, SH; Yoo, WJ, International Electron Device Meeting (IEDM) 2007, pp.0 - 0, 2007-12-01

150
Optimization of Annealing Process of Screen Printed Sb2Te3 and Bi2Te3 Thick Films for Power Generator

Kim, Sun Jin; We, Ju Hyung; Kim, Gyung Soo; Cho, Byung Jin, The 31st International & 10th European Conference on Thermoelectrics, ICT/ECT2012, Int'l Thermoelectrics Society, 2012-07-09

151
Organic/inorganic hybrid gate dielectric for high-performance and low-power organic thin-film transistors

Shin, W.C.; Moon, H.; Yoo, S.; Cho, Byung Jin, 2010 10th IEEE Conference on Nanotechnology, NANO 2010, pp.936 - 939, IEEE, 2010-08-17

152
p+ n shallow junction formation from BN source using RTP

조병진; Kim, KT; Kim, CK, Conf. on CAD, Semiconductor Material and Components, pp.77 - 77, 1987-05-12

153
Pentacene Thin-Film Transistors with PVP/HfLaO Hybrid Gate Dielectric for Low Voltage Operation

Cho, Byung Jin, 2010 Material Research Society Spring Meeting, 2010 Material Research Society Spring Meeting, 2010-04-08

154
Photoluminescene from silicon nanocrystals formed by pulsed laser deposition

Cho, Byung Jin; Chen, XY; Lu, YF; Wu, YH; Song, WD; Hu, H, MRS Symposium, pp.13 - 13, 2003-04-22

155
Physical and electrical properties of MOCVD HfAlxOy gate dielectric and their composition ratio dependence

Cho, Byung Jin; Joo, MS; Yeo, CC; Ching, YL; Loh, WY; Whoang, SJ; Mathew, S, International Conference on Materials for Advanced Technologies, pp.517 - 517, 2003-12-11

156
Predicting plasma charging damage in ultra thin gate oxide by using nondestructive DCIV technique

Cho, Byung Jin; Guan, H; Li, MF; Zhang, Y; Jie, BB; Xie, J; Wang, JLF, 1999 IEEE International Integrated Reliability Workshop (IRW) Final Report, pp.20 - 20, 1999-10-15

157
Process and Structural Optimization of a Planar-Type Thermoelectric Power Generator by Screen-Printing Technique

We, Ju Hyung; Kim, Sun Jin; Kim, Gyung Soo; Cho, Byung Jin, The 31st International & 10th European Conference on Thermoelectrics, Int'l Thermoelectrics Society, 2012-07-09

158
Process Control and Uniformity Improvement in Synthesis of Large-scale Graphene Layers on Metal Thin Films.

Cho, Byung Jin, 2010 Material Research Society Spring Meeting, 2010 Material Research Society Spring Meeting, 2010-04-09

159
Process optimization for multiple-pulse laser annealing of boron implanted silicon with germanium pre-amorphization

Cho, Byung Jin; Poon, D; Lu, YF; Bhat, M; See, A, MRS Spring Meeting, pp.0 - 0, 2003-04-22

160
Process Optimization of Screen-printed Thermoelectric Thick-films for Flexible Thermoelectric Devices

Choi, Hyeongdo; Kim, Sun Jin; Kim, Yongjun; We, Ju Hyung; Shin, Ji Seon; Yi, Kevin K; Cho, Byung-Jin, The 4th International Conference on Electronic Materials and Nanotechnology for Green Environment, The Korean Institute of Metals and Materials, 2016-11-07

161
Progressive breakdown statistics in ultra-thin silicon dioxides

Cho, Byung Jin; Loh, WY; Li, MF; Chan, DSH; Ang, CH; Zhen, ZJ; Kwong, DL, 10th International Symp. on the Physical and Failure Analysis of Integrated Circuits (IPFA), pp.157 - 157, 2003-07-08

162
Properties of graphene on different dielectrics and graphene oxide based flexible resistive memory

Cho, Byung Jin, Recent Advances in Graphene and Related Materials 2010, Engineering Conferences International, Recent Advances in Graphene and Related Materials 2010, 2010-08-04

163
Properties of PVD Hafnium oxide films in metal-insulator-metal structure and the role of HfN barrier at dielectric/metal interface

Cho, Byung Jin; Kim, SJ; Lim, HF; Hu, H; Yu, XF; Yu, HY; Li, MF, 2nd International Conference on Materials for Advanced Technologies, pp.513 - 513, 2003-12-11

164
PVP/GO:Graphene/Polymer composite film as a Cu diffusion barrier

김재환; 윤성준; 봉재훈; 윤알렉산더; 조병진, The 3rd Korean Graphene Symposium, 한국그래핀연구회, 2016-04-14

165
PVP/GO:Graphene/polymer composite film as a Cu diffusion barrier

Kim, Jae Hwan; Yoon, Seong Jun; Bong, Jae Hoon; Yoon, Alexander; Cho, Byung Jin, The 8th International Conference on Recent Progress in Graphene/2D Research, SKKU Advanced Institute of Nano Technology, 2016-09-27

166
Quasi-breakdown of ultra thin gate oxide under high field stress

Cho, Byung Jin; Lee, SH; Kim, JC; Choi, SH, IEEE International Electron Devices Meeting (IEDM), pp.605 - 605, 1994-12-11

167
Radiation -induced leakage current of ultra-thin gate oxide under X-ray lithography condictions

Cho, Byung Jin; Kim, SJ; Ling, CH; Joo, MS; Yeo, IS, Proc. of the 7th International Symp. on the Physical and Failure Analysis of Integrated Circuits (I, pp.30 - 30, 1999-07-05

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