Browse "School of Electrical Engineering(전기및전자공학부)" by Author 1094
Showing results 125 to 161 of 161
| Quarter-Circle Shaped Plane Cavity Resonator for Skew-Free and Low Jitter Clock Distribution Network Kim, Joungho; Lee, Woojin; Ryu, Chunghyun; Park, Jongbae, Presented at Proceeding of XXIX General Assembly of International Union of Radio Science (URSIGA 2008), 2008 |
| Radiated Electromagnetic Interference (EMI) Suppression from Plasma Display Panel by using Filtering Method based on Measurements Kim, Joungho; Lee, Heejae; Pak, Jun So; Shin, Minchul; Park, Hyunjeong; Shim, Jongjoo; Kim, Gawon; et al, 2009 Korea-Japan Joint Conference, pp.223 - 226, 2009 |
| Recent advances in electromagnetic compatibility of 3D-ICS - Part II Sicard, Etienne; Jianfei, Wu; Shen, Rongjun; Li, Er-Ping; Liu, En-Xiao; Kim, Joungho; Cho, Jeong-Hyeon; et al, IEEE Electromagnetic Compatibility Magazine, v.5, no.1, pp.65 - 74, 2016 |
| Reduction of multilayer PCB edge radiation excited by through-hole signal via with De-Cap Fence Kim, Joungho; Pak, J. S.; Lee, J., 2003 Asia-Pacific Microwave Conference, pp.870 - 873, 2003 |
| Reduction of RF-coils Loading Effects on Quadrature Coupler of 3-T MRI using 4-port Network Analysis Kim, Joungho; Ryu, WH; Sung, MH; Kim, HS; Lee, HK, Sixth Meeting of the Inter. Society for Magnetic Resonance, 1998-04 |
| RF Interconnect for Multi-Gbit/sec Board-Level Clock Distribution Kim, Joungho; Ryu, Woonghwan; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Namhoon; Choi, Baekkyu, 8th Topical Meeting on Electrical Performance of Electronic Packaging, 1999-10 |
| RF Phenomena in High-Speed VLSI Interconnections 김정호; 김형수; 류웅환; 김종훈, Semicon Korea, 1998-01 |
| Separation of Reflections and Noises from THz measurement Using Independent Component Analysis (ICA) Kim, Joungho; Jung, Youchul; Ryu, Jaeyoung; Lee, Jongjoo; Baek, Seungyong, International Terahertz workshop 2000, 2000 |
| Seperated Role of On-chip and On-PCB Decoupling Capacitors on reduction of radiated Emission on Printed Circuit Board Kim, Joungho; Kim, Jonghoon; Choi, Baekyu; Kim, Hyungsoo; Ryu, Woonghwan; Yun, Younghwan; Ham, Seog-heon; et al, 2001 IEEE International Symposium on Electromagnetic Compatibility, IEEE, 2001 |
| Signal quality test with 3-dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP) Yoon, C.; Kim, Joungho; Kim, J., 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009-12-02 |
| Slot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board Kim, Joungho; Kim, H.; Jeong, Y.; Lee, J.; Kim, J., 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.23 - 26, 2002-05-12 |
| Solution Space Analysis of Interconnects for Low voltage Differencial Signaling(LVDS)Applications Kim, Joungho; Ahn, S; Lu, A C W.; Fan, W; Wai, L L, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP2001), pp.297 - 330, 2001 |
| Spread spectrum clock generator with delay cell array to reduce the EMI from a high-speed digital system Kim, J.; Kam, D.G.; Kim, Joungho, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, v.3, pp.820 - 825, IEEE, 2004-08-09 |
| Suppression of radiated emission from an 8-bit micro-controller using gate-oxide filtering capacitors Kim, Hyungsoo; Kim, Jonghoon; Ryu, Woonghwan; Sung, Myunghee; Ahn, Seungyoung; Kim, Joungho, Proceedings of the 1999 IEEE EMC Symposium on 'Electromagnetic Compatibility', v.2, pp.811 - 815, IEEE, 1999-08-02 |
| Tapered Slot Shape on Slotted Reference Plane of Multi-layer PCB for Reduction of Crosstalk and Radiated Emission Kim, Joungho; Kim, Jingook; Kim, Hyungsoo; Jeong, Youchul, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.275 - 278, IEEE, 2002 |
| Terahertz Optoelectoonics: Applications using Photoconductive sampling 김정호; 이종주; 이희석; 김우평; 이재훈, '98 Femtosecond Science and Technology Workshop, 1998-02 |
| Terahertz Radiation Image from Photoconductive Dipole Antenna Kim, Joungho; Lee, H; Lee, J, Inter. Topical Works. on Contemporary Photonics Tech., 1998-01 |
| Terahertz Technology and applications Kim, Joungho, International Meeting on Optoelectronics and Photonic Instrumentation, 1999-12 |
| The improvement of Signal Integrity (SI) according to the location of via in the vicinity of a slot in the reference plane Kim, T.H.; Lee, J.; Kim, H.; Jun, P.J.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.185 - 188, IEEE, 2002-05-12 |
| Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity Lee, Manho; Cho, Jonghyun; Pak, Jun So; Lee, Hyungdong; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| Through Silicon Via (TSV) shielding structures Cho, J.; Kim, Joungho; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25 |
| Time-domain Network Analysis of MM-wave Circuits Based on a Photoconductive Probe Sampling technique Kim, Joungho; Son, J.; Wakana, S.; Nees, J.; Williamson, S.; Whitaker, J.; Kwon, Y.; et al, 1993 IEEE MTT-s Digest, pp.1359 - 1362, 1993 |
| Transient Response of Terahertz Emitter using Finite-Difference Time-Domain (FDTD) Method Kim, Joungho; Lee, Heeseok; Lee, Jaehoon, The Sixth IEEE International Conference on Terahertz Electronics, pp.208 - 210, 1998-09 |
| TSV modeling and noise coupling in 3D IC Kim, Joungho; Cho, J.; Kim, J., 3rd Electronics System Integration Technology Conference, ESTC 2010, ESTC 2010, 2010-09-13 |
| Ultrafast Single Mode Pulse Propagation on CPW with Air-bridges Observed by Photoconductive Pump-Probe Measurement Kim, Joungho; Lee, Jongjoo, SPIE Workshop on Terahertz and Gigahertz Photonics, pp.295 - 302, 1999-07 |
| Ultrafast/Terahertz Optoelectronics Kim, Joungho, , 1997-09 |
| Unit Cell Modeling of Interconnect Isolated by Metal-filled Via Array for High Crosstalk Immunity Kim, Joungho; Lee, Heeseok; Park, Bongcheol; Kam, Dong Gun, IEEE 6th Workshop on Signal Propagation on Interconnects, pp.41 - 43, IEEE, 2002 |
| Unit-cell modeling of high-speed interconnect with adjacent metal-filled via array using FDTD method Lee, Heeseok; Park C.; Kam D.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.41 - 43, IEEE, 2002-05-12 |
| Velocity overshoot dynamics in GaAs up to 200 kV/cm Observed Using Terahertz Radiation Kim, Joungho; Son, J.; Sha, W.; Norris, T. B.; Whitaker, J. F.; Mourou, G. A., Ultrafast Electronics and Optoelectronics, pp.134 - 137, 1993 |
| Verification of Picosecond Sampling for Electromagnetic Transient Scattering Experiment in Terahertz Spectrum Region Kim, Joungho; Lee, H.; Ryu, J.; Kim, W., 7th IEEE International Conference on Terahertz Electronics, pp.272 - 275, 1999 |
| Vertically Alternating Impedance Electromagnetic Bandgap (VAI-EBG) Structure for Noise Mitigation in Multi-layer PCBs Kim, myunghoi; Koo, Kyoungchoul; Kong, Sunkyu; Bae, Bumhee; Lee, Sangrok; Kim Joungho, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011-05-17 |
| Via: A Source of Simultaneous Switching Noise Generation, Coupling, and Edge Radiation in High-speed Multi-layer Digital PCB Kim, Joungho; Park, Jongbae; Pak, Jun So; Kim, Hyungsoo, 2004 Korea-Japan Joint Conference on AP/EMC/EMT (KJJC), pp.22 - 23, 2004-11 |
| 광전도 샘플링을 이용한 밀리미터 웨이브 수동 소자의 측정 김정호; 이재훈; 이종주, 91, 1998-05 |
| 다면 개구부를 갖는 함체 차폐효율의 회로적 계산 방법 연구 김정호; 심종주; 감동근, 한국군사과학기술학회 2004년 종합학술대회, pp.729 - 732, 한국군사과학기술학회, 2004-08-26 |
| 산소 플라즈마를 이용한 Photoresist의 제거 김정호; 황기웅; 김원규; 노영수; 이종덕, 1987년도 춘계 반도체 학술 발표회, pp.98 - 100, 1987-05 |
| 혼성 신호 시스템 인 패키지(SiP)에서의 전력 분배 구조 설계 김정호; 유충현; 구경철; 박종배, 한국군사과학기술학회 2006년 종합학술대회, pp.729 - 732, 한국군사과학기술학회, 2004 |
| 확장성을 가진 LTCC 기반의 Capacitor 모델 Kim, Joungho; Park, JB; Ryu, C; Shim, Y; Kim, Y; Lu, A.C.W.; Fan, W; et al, 한국군사과학기술학회 2006년 종합학술대회, 2006 |
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