Browse "School of Electrical Engineering(전기및전자공학부)" by Author 1094
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| Effect of decoupling capacitor on signal integrity in applications with reference plane change Lee, J.; Lu, A.C.W.; Fan, W.; Wai, L.L.; Kim, Joungho, 53rd Electronic Components and Technology Conference, 2003, pp.1283 - 1288, IEEE, 2003-05-27 |
| Effect of ground guard fence with via and ground slot on radiated emission in multi-layer digital printed circuit board Lee, H.; Kim, J.; Ahn, S.; Byun, J.-G.; Kang, D.-S.; Choi, C.-S.; Hwang, H.-J.; et al, 2001 IEEE International Symposium on Electromagnetic Compatibility, v.1, pp.653 - 656, IEEE, 2001-08-13 |
| Effect of power/ground partitioning and stitching capacitor placement on signal integrity and emi of multi-layer and multi power system Kim, Joungho; Kim, H.; Lee, H.; Kim, J.; Kim, J., Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.59 - 62, 2001-07-08 |
| Electrical Characteristics of Single/Coupled Stripline on Meshed Ground Plane in High-speed Package Kim, Joungho; Lee, Heeseok, International Symposium on Electronic Materials and Packagings, pp.19 - 22, 2001 |
| Electrical Performance of 3D TSV Channel and 3D Stacked PDN based on Hierarchical Models Pak, Jun So; Kim, Joohee; Cho, Jonghyun; Kim, Heegon; Kim, Joungho, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011-03-01 |
| electromagnetic Radiation from Power Line Resonance of High-Speed Digital VLSI Circuits Kim, Joungho; Kim, JH; Kim, HS; Joo, SY, 5th Inter. Conf. on VLSI and CAD561, 1997-10 |
| EMI Suppression Techniques in IC, Package and Module Designs Kim, Joungho; Kim, Jonghoon; Kim, Hyungsoo, 2nd International Academic Conference on Packaging, 1999 |
| EMI 를 고려한 IC 설계 기술 연구 김정호, Korea Electronic Packaging Conference '99, 1999-03 |
| Estimation of Vertical Noise Coupling on 900MHz Low Noise Amplifier from 200MHz On-chip Switching-mode Power Supply in 3D-IC Koo, Kyoungchoul; Kim, Myunghoi; Lee, Sangrok; Kim, Joungho, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011-05-17 |
| Experimental verification and analysis for noise isolation of analog and digital chip-package-PCB hierarchical power distribution network Park, H.; Shim, J.; Shim, Y.; Yoo, J.; Kim, Joungho, IEEE 9th VLSI Packaging Workshop in Japan, VPWJ 2008, pp.73 - 76, 2008-12-01 |
| Eye Diagram Estimation on Silicone Rubber Socket Park, Jun Yong; Kim, Hye Soo; Kim, Jong Hoon; Bae, Bum Hee; Ha, Dong Ho; Bae, Micahel; Kim, Joung Ho, 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 2015-11-23 |
| Far-field Pattern of Photoconductive Dipole Antenna using Finite-Difference Time-Domain Method Kim, Joungho; Lee, Heeseok; Lee, Jongjoo; Kim, Woopoung; Lee, Jaehoon, 5th International Workshop on Femtosecond Technology Conference, pp.129 - 130, 1998-02 |
| Fast and Efficient Method for Impedance of System Power/Ground Network Including Package-Board Structure Kim, Joungho; Kim, Jaemin; Jeong, Yucheol, 8th VLSI Packaging Workshop, pp.31 - 34, 2006-12 |
| GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises Kam, D.G.; Lee, H.; Baek, S.; Park, B.; Kim, Joungho, 52nd Electronic Components and Technology Conference, pp.1058 - 1065, 2002-05-28 |
| Graphene-based EMI Shielding for Vertical Noise Coupling Reduction in 3D Mixed-Signal System_revised Kim, Kiyeong; Koo, Kyoungchoul; Hong, Seulki; Kim, Jonghoon; Cho, Byungjin; Kim, Joungho, Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23 |
| Growth and Properties of InAsSb, AlGaSb, and InAsSb/AlGaSb Heterostructures Kim, Joungho; Yang, D.; Bhattacharya, P. K., Sixth International Conference on Molecular Beam Epitaxy, 1990 |
| Guard ring effect for Through Silicon Via (TSV) noise coupling reduction Cho, J.; Yoon, K.; Pak, J.S.; Kim, J.; Lee, J.; Lee, H.; Park, K.; et al, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24 |
| High dielectric constant thin film embedded capacitor for suppression of simultaneous switching noise and radiated emission Kim, H.; Park, H.; Jeong, Y.; Kim, Joungho; Lee, Kyu S.; Hong, Kuk J.; Hong, Y., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, v.2, pp.588 - 591, 2004-08-09 |
| High frequency electrical circuit model of chip-to-chip vertical via iterconnection for 3-D chip stacking package Ryu, C.; Chung, D.; Lee, J.; Lee, K.; Oh, T.; Kim, Joungho, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, v.2005, pp.151 - 154, 2005-10-24 |
| High Speed and Low Noise Packaging Design Methodologies for 40 Gbps SerDes Channel with PBGA Type Package Kam, DG; Yu, J; Choi, H; Bae, K; Kim, J; Jeong, D.-K; Lee, C; et al, PIERS2006 conference, pp.128 - 128, PIERS, 2006-03-26 |
| High-frequency Electrical Model of Chip-to-Chip Via Interconnection for 3-D Chip Stacking Package Kim, Joungho; Ryu, Chunghyun; Chung, Daehyun; Lee, Junho; Lee, Kwangyong; Oh, Taesung, IEEE 14th(13) Topical Meeting on Electrical Performance of Electronic Packaging, pp.151 - 154, IEEE, 2005-10 |
| Hybrid equalizer design for 12.5 Gbps serial data transmission Song, E.; Cho, J.; Kim, Joungho, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.53 - 56, 2009-10-19 |
| I/O power estimation and analysis of high-speed channels in Through-Silicon Via (TSV)-based 3D IC Kim, Joungho; Cho, J.; Pak, J.S.; Song, T.; Kim, J.; Lee, H.; Lee, J.; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.41 - 44, IEEE, 2010-10-25 |
| Impact of partial EBG PDN on PI, SI and lumped model-based correlation Lee, J.; Lee, H.; Park, K.; Chung, B.; Kim, J.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.168 - 171, 2008-05-19 |
| Impedance Characteristics of N2 Plasma and matching network design 김정호; 황기웅; 김원규, 1985년도 춘계 학술연구 발표회 논문집, pp.101 - 104, 1985 |
| Implementation of on-chip and on-package reactive equalizer to minimize inter-symbol interference (ISI) and jitter from frequency dependent attenuation Ahn, Seungyoung; Chun, Jongtae; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, 2007-07-09 |
| Improved Noise Isolation Design of UHF Mobile RFID Reader SiP Kim, Joungho; Shim, Yujeong, EPTC, 2006 |
| Inverted Embedding MicrostripStructure for 10GHz si Interconnection Line Kim, Joungho; Ryu, WH; Kim, HS; Baik, SH, 5th Inter. Conf. on VLSI and CAD, 1997-10 |
| Low noise THz Emitter Using Lift-off LT-GaAs Thin Film Sitch on Fused Silica Kim, Joungho; Baek, Seungyong; Lee, Jongjoo; Ryu, Jaeyoung; Jung, Yuchul; Lee, Heeseok, International Terahertz workshop 2000, 2000 |
| Measurement of Picosecond Pulse Propagation Characteristics on Coplanar Transmission Lines Kim, Joungho; Lee, Jongjoo; Yu, S., 5th IEEE Workshop on Signal Propagation on Interconnects, IEEE, 2001 |
| Methodology to Generate Frequency Domain Specifications from Eye Masks using Statistical Analysis Kim, Joungho; Kim, Nam Hoon; Yi, Ju Hwan; Lee, Eric; Sung, Baegin; Hwang, Seung Ho, DesignCon 2007, 2007 |
| Microwae Frequency Model and High-density design of Multiple Line Grid Array (MLGA) Package Kim, Joungho; Ahn, Seungyoung; Lee, Joonwoo; Kim, Jonghoon; Ryu, Woonghwan; Kim, Youngsoo; Choi, Hyun Seok; et al, IMAPS 2000, 2000 |
| Microwave Frequency Dielectric Constant and Loss Tangent Measurements of PCB materials Using Stripline Structure Kim, Joungho; Kim, Jingook; Lee, Junho; Kim, Namhoon; Lee, Junwoo, APACK2001, 2001 |
| Microwave Frequency Model of Flip-Chip interconnects using Anisotripic Conductive Film Kim, Joungho, HDP/MCM conference, 1999 |
| Microwave frequency model of water level package and increased loading effect on rambus memory module Lee, J.; Choi, B.; Ahn, S.; Ryu, W.; Kim, J.M.; Choi, K.S.; Hong, J.-K.; et al, 51st Electronic Components and Technology Conference, pp.128 - 132, 2001-05-29 |
| Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer Yoon, K.; Kim, G.; Lee, W.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.702 - 706, 2009-12-09 |
| Modeling and analysis of die-to-die vertical coupling in 3-D IC Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09 |
| Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC Kim, J.; Pak, J.S.; Cho, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24 |
| Modeling and Verification to Analyze Effect of Power/Ground Noises on CMOS Feedback Operational Amplifier Kim, Joungho; Shim, Yujeong; Park, Jongbae; Shim, Jongjoo, International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2007 |
| Modeling of Chip Level Power Distribution Network Based on Segmentation Method Kim, Joungho; Kim, Jaemin; Shim, Yujeong; Song, Eakhwan; Koo, Kyungchul, International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2007 |
| Multi-Chip Module (MCM) RF Transceiver For 1.8 GHz Cellular Phone Kim, Joungho; Kim, Namhoon; Ryu, Woonghwan; Kim, Jonghoon; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Sungil; et al, APACK99, Symposium on Advances in packaging, pp.440 - 443, 1999-12 |
| Multi-Stacking Through-Silicon-Via Effects on Signal Integrity and Power Integrity for Application of 3-Dimensional Stacked-Chip-Package Kim, Joungho; Pak, Jun So; Ryu, Chunghyun, Presented at XXIX General Assembly of International Union of Radio Science (URSIGA 2008), 2008 |
| Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications Choi, J.; Kam, D.G.; Chung, D.; Srinivasan, K.; Govind, V.; Kim, Joungho; Swaminathan, M., 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, v.2005, pp.69 - 72, IEEE, 2005-10-24 |
| Network-on-Chip and Network-in-Package for High-Performance SoC Kim, Joungho; Lee, Kangmin; Lee, Se-Joong; Kim, Donghyun; Kim, Kwanho; Kim, Gawon; Yoo, Hoi-Jun, IEEE 1st Asian-Solid State Circuits Conference, pp.485 - 488, 2005-11 |
| Novel High-impedance photoconductive sampling probe for ultra-high speed circuit characterization Kim, Joungho; Chan, Y. J.; Williamson, S.; Nees, J.; Wakana, S.; Whitaker, J.; Pavlidis, D., Technical Digest of 1992 IEEE GaAs IC Symposium, pp.19 - 22, 1992 |
| Novel time domain picosecond pulse sampling system for non-contact characterization of liquids, semiconductors, and metals Kim, Woopoung; Ryu, Jaeyoung; Lee, Heeseok; Kim, Joungho, Proceedings of the 1999 Pacific Rim Conference on Lasers and Electro-Optcis (CLEO/PACIFIC Rim '99), v.3, pp.791 - 792, 1999-08-30 |
| On-Chip PDN (Power Distribution Network) Comparison between Single Chip and Stacked Multi-Chips with TSV (Through Silicon Via) Park, Junso; Kim, Joungho, 2009 Korea-Japan Joint Conference, pp.139 - 142, IEEE, 2009-05-14 |
| On-Wafer Pump-Probe Photoconductive Sampling for Millimeter Wave Passive Device Testing Kim, Joungho; Lee, J; Lee, HS, 5th International Workshop on Femtosecond Technology, 1998-02 |
| Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls Ahn, Seung Young; Ryu, Woong Hwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Kim, Woo Poung; Paik, Kyung-Wook; et al, Proceedings of the 1999 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 1999), pp.421 - 425, 1999-10-18 |
| Over Giga Hertz Digital Interconnects Using Anisotropic Conductive Film(ACFs)Flip-Chip Kim, Joungho, , 1999 |
| Overview of Power/Ground Effect on Data Eye and Clock Jitter; from Board Resonance to Substrate Coupling Chung, Daehyun; Kim, Hyungsoo; Kim, Joungho, IEEE 5th Electronics Packaging Technology Conference, pp.30 - 32, IEEE, 2003-12-12 |
| Photoconductive Sampling Using Phase Retrieval algorithm Kim, Joungho; Kim, WP; Lee, JJ, Inter. Topical Workshop on Contemporary Photonics Technology231, 1998-01 |
| Picosecond characteristics of velocity overshoot in GaAs up to 200 kV/cm Kim, Joungho; Son, J.; Hsa, W.; Norris, T. B.; Whitaker, J. F.; Mourou, G. A., Quantum Electronics and Laser Science conference, pp.152 - 152, 1993 |
| Picosecond Detector, Optical Temporal Analyzer, and Free-Standing Circuit Probe Kim, Joungho; Nees, J.; Williamson, S.; Gupta, S., Ultrafast Electronics and Optoelectronics, pp.186 - 188, 1993-01 |
| Picosecond Pulse Propagation Measurement on CPW Using A Photoconductive Near-Field Probe Kim, Joungho; Lee, Jongjoo, 2th MINT Milimeter-wave International, pp.109 - 112, 2001 |
| Picosecond Time-Domain Characterization of Millimeter-Wave Antenna Using Fiber-Coupled Photoconductive Probe Antenna Kim, Joungho; Lee, Heeseok; Lee, Jongjoo; Kim, Woopoung; Ryu, Jaeyoung, Korea-China Joint Symposium on Semiconductor Physics and device Applications, pp.57 - 59, 1999-09-13 |
| Picosecond Time-Domain Photoconductive Sampling Method For Measuring Guided and Free-Space Pulse Propagation Kim, Joungho; Ryu, Jaeyoung; Lee, Jongjoo; Lee, Heeseok; Kim, Woopoung, 8th Topical Meeting on Electrical Performance of Electronic Packaging, 1999 |
| Power/Ground Noise Mitigation Using Z-shape Partial Electromagnetic Bandgap (ZP-EBG) Structure for Ultra-Wideband (UWB) System Kim, M; Yoon, C; Lee, W; Sung, H; Kim, Joungho, 2010 Asia-Pacific Radio Science Conference, 2010 Asia-Pacific Radio Science Conference, 2010-12-30 |
| Precise analysis and modeling of far-end crosstalk and far-end crosstalk saturation using mode analysis in coupled microstrip lines Kim, G.; Song, E.; Kim, Ji Seong; Kim, Joungho, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009-12-02 |
| Precise Analysis and Modeling of Far-end Crosstalk using Mode Analysis in Coupled Microstrip Lines Kim, Joungho; Kim, Gawon; Song, Eakhwan; Kim, Jiseong, Electrical Design Advanced Packaging & Systems, EDAPS 2009, 2009 |
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