Browse "School of Electrical Engineering(전기및전자공학부)" by Author Oh, T.
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| High frequency electrical circuit model of chip-to-chip vertical via iterconnection for 3-D chip stacking package Ryu, C.; Chung, D.; Lee, J.; Lee, K.; Oh, T.; Kim, Joungho, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, v.2005, pp.151 - 154, 2005-10-24 |
| High frequency electrical model of through wafer via for 3-D stacked chip packaging Ryu, C.; Lee, J.; Lee, H.; Lee, K.; Oh, T.; Kim, Joungho, ESTC 2006 - 1st Electronics Systemintegration Technology Conference, pp.215 - 220, IEEE, 2006-09-05 |
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