Browse "School of Electrical Engineering(전기및전자공학부)" by Author Liu, En-Xiao
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| Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects Li, Er-Ping; Wei, Xing-Chang; Cangellaris, Andreas C; Liu, En-Xiao; Zhang, Yao-Jiang; D'Amore, Marcello; Kim, Joungho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.52, pp.248 - 265, 2010-05 |
| Recent advances in electromagnetic compatibility of 3D-ICS - Part II Sicard, Etienne; Jianfei, Wu; Shen, Rongjun; Li, Er-Ping; Liu, En-Xiao; Kim, Joungho; Cho, Jeong-Hyeon; et al, IEEE Electromagnetic Compatibility Magazine, v.5, no.1, pp.65 - 74, 2016 |
| Recent advances in electromagnetic compatibility of 3D-ICS - Part II Sicard, Etienne; Jianfei, Wu; Shen, Rongjun; Li, Er-Ping; Liu, En-Xiao; Kim, Joungho; Cho, Jeong-Hyeon; et al, IEEE Electromagnetic Compatibility Magazine, v.5, no.1, pp.65 - 74, 2016 |
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