Browse "School of Electrical Engineering(전기및전자공학부)" by Author Liu, C
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| Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs Song, T; Liu, C; Kim, DH; Lim, SK; Cho, J; Kim, J; Pak, JS; et al, 12th International Symposium on Quality Electronic Design, ISQED 2011, pp.122 - 128, ISQED 2011, 2011-03-14 |
| PEN: Design and Evaluation of Partial-Erase for 3D NAND-Based High Density SSDs Liu, C; Kotra, J; Jung, Myoungsoo; Kandemir, M, 16th USENIX Conference on File and Storage Technologies (FAST), 2018, USENIX, 2018-02-13 |
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