Browse "School of Electrical Engineering(전기및전자공학부)" by Author Kam, D.G.
Showing results 1 to 12 of 12
| An evaluation of differential impedance in PCBs using two single-ended probes only Kam, D.G.; Lee, H.; Ryu, W.; Kim, J.; Park, B.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.169 - 171, IEEE, 2002-05-12 |
| Chip-package co-design of power distribution network for system-in-package applications Kim, G.; Kam, D.G.; Chung, D.; Kim, Joungho, 6th Electronics Packaging Technology Conference, EPTC 2004, pp.499 - 501, IEEE, 2005-12-08 |
| Co-modeling and co-simulation of package and on-chip decoupling capacitor for resonant free power/ground network design Park, H.; Kim, H.; Kam, D.G.; Kim, Joungho, 55th Electronic Components and Technology Conference, ECTC, pp.727 - 731, IEEE, 2005-05-31 |
| Enhanced immunity against crosstalk and EMI using GHz twisted differential line structure on PCB Kam, D.G.; Lee, H.; Baek, S.; Park, B.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, 2002, pp.643 - 647, IEEE, 2002-08-19 |
| Estimation of data-dependent jitter using single pulse analysis method in high-speed differential signaling Song, E.; Lee, J.; Kim, J.; Kam, D.G.; Ryu, C.; Kim, Joungho, ESTC 2006 - 1st Electronics Systemintegration Technology Conference, pp.741 - 746, IEEE, 2006-09-05 |
| GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises Kam, D.G.; Lee, H.; Baek, S.; Park, B.; Kim, Joungho, 52nd Electronic Components and Technology Conference, pp.1058 - 1065, 2002-05-28 |
| Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board Baek, S.; Kam, D.G.; Par,k B.; Kim, Joungho; Byun, J.-G.; Choi, C.-S., 2002 IEEE International Symposium on Electromagnetic Compatibility, pp.200 - 204, IEEE, 2002-08-19 |
| Modeling and measurement of simultaneous switching noise coupling through signal via transition Park, J.; Kim, H.; Jeong, Y.; Kim, J.; Pak, J.S.; Kam, D.G.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.548 - 559, 2006-08 |
| Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications Choi, J.; Kam, D.G.; Chung, D.; Srinivasan, K.; Govind, V.; Kim, Joungho; Swaminathan, M., 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, v.2005, pp.69 - 72, IEEE, 2005-10-24 |
| Spread spectrum clock generator with delay cell array to reduce the EMI from a high-speed digital system Kim, J.; Kam, D.G.; Kim, Joungho, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, v.3, pp.820 - 825, IEEE, 2004-08-09 |
| Suppressed carrier clock for reduction of electromagnetic radiated emission from high-speed digital system Kam, D.G.; Kim, Joungho; Kim, J.; Jun, P., 2003 IEEE Symposium on Electromagnetic Compatibility, pp.394 - 397, IEEE, 2003-08-18 |
| TDR/TDT analysis by crosstalk in single and differential meander delay lines for high speed PCB applications Kim, G.; Kam, D.G.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.657 - 662, IEEE, 2006-08-14 |
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