Browse "School of Electrical Engineering(전기및전자공학부)" by Author Jung, Daniel HY
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| Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC Lim, Jae Min; Lee, Man Ho; Jung, Daniel HY; Kim, Jong Hoon; Choi, Su Min; Lee, Hyun Suk; Kim, Joung Ho, 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015-11-11 |
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