Showing results 1 to 5 of 5
Analysis of coupling suppression methods on split power/ground planes using embedded capacitor in multi-layered package Jeong, Y.; Lu, A.C.W.; Wai, L.L.; Fan, W.; Lok, B.K.; Kim, Joungho, 2004 Proceedings - 54th Electronic Components and Technology Conference, pp.575 - 580, IEEE, 2004-06-01 |
Analysis of noise suppression techniques using embedded capacitor on split power bus in multi-layer package Jeong, Y.; Kim, Joungho; Lu, A.C.W.; Wai, L.L.; Fan, W.; Lok, B.K.; Wong, C.K., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.215 - 220, IEEE, 2004-08-09 |
Effect of decoupling capacitor on signal integrity in applications with reference plane change Lee, J.; Lu, A.C.W.; Fan, W.; Wai, L.L.; Kim, Joungho, 53rd Electronic Components and Technology Conference, 2003, pp.1283 - 1288, IEEE, 2003-05-27 |
Efficiency of differential signaling on cavity noise suppression in applications with refernce plane change Lee, J.; Kim, J.; Kim, Joungho; Lu, A.C.W.; Fan, W.; Wai, L.L., IEEE International Symposium on Electromagnetic Compatibility, 2004, pp.203 - 208, IEEE, 2004-08-09 |
The scalable modeling of multi-layer embedded capacitor based on LTCC substrate Park, J.; Lu, A.C.W.; Fan, W.; Wai, L.L.; Chua, K.M.; Shim, Y.; Kim, Joungho, IEEE 56th Electronic Components and Technology Conference, pp.1286 - 1289, IEEE, 2006-05-30 |
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