Browse "School of Electrical Engineering(전기및전자공학부)" byAuthorByun, J.-G.

Showing results 1 to 5 of 5

1
Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB

Pak, J.S.; Kim, J.; Lee, H.; Byun, J.-G.; Kim, Jounghoresearcher, 2003 IEEE Symposium on Electromagnetic Compatibility, v.1, pp.231 - 235, IEEE, 2003-08-18

2
Design guidelines of spread spectrum clock for suppression of radiation and interference from high-speed interconnection line

Kim, J.; Jun, P.; Byun, J.-G.; Kim, Jounghoresearcher, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.189 - 192, IEEE, 2002-05-12

3
Effect of ground guard fence with via and ground slot on radiated emission in multi-layer digital printed circuit board

Lee, H.; Kim, J.; Ahn, S.; Byun, J.-G.; Kang, D.-S.; Choi, C.-S.; Hwang, H.-J.; et al, 2001 IEEE International Symposium on Electromagnetic Compatibility, v.1, pp.653 - 656, IEEE, 2001-08-13

4
Experimental investigation of radiated emission from flexible printed circuit (FPC) cable

Ahn, S.; Kim, J.; Lee, H.; Kim, Jounghoresearcher; Byun, J.-G.; Choi, C.-S.; Hwang, H.-J., IEEE International Symposium on Electromagnetic Compatibility, 2002, v.2, pp.883 - 888, IEEE, 2002-08-19

5
Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board

Baek, S.; Kam, D.G.; Par,k B.; Kim, Jounghoresearcher; Byun, J.-G.; Choi, C.-S., 2002 IEEE International Symposium on Electromagnetic Compatibility, v.1, pp.200 - 204, IEEE, 2002-08-19

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