Browse "School of Electrical Engineering(전기및전자공학부)" by Author Bae, Bumhee
Showing results 1 to 34 of 34
| 30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via Jung, Daniel Hyunsuk; Kim, Hee-Gon; Kim, Suk Jin; Kim, Jonghoon J.; Bae, Bumhee; Kim, Jonghoon; Yook, Jong-Min; et al, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.24, no.11, pp.814 - 816, 2014-11 |
| A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels Park, Junyong; Choi, Sumin; Kim, Jonghoon J.; Kim, Youngwoo; Lee, Man Ho; Kim, Hee-Gon; Bae, Bumhee; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.5, pp.1510 - 1519, 2018-10 |
| An Investigation of Electromagnetic Radiated Emission and Interference From Multi-Coil Wireless Power Transfer Systems Using Resonant Magnetic Field Coupling Kong, Sunkyu; Bae, Bumhee; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Kim, Suk Jin; Song, Chiuk; Kim, Jonghoon; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.63, no.3, pp.833 - 846, 2015-03 |
| Analysis of external force dependent lumped RLGC model of high-bandwidth and high-density silicone rubber socket Park, Junyong; Kim, Hyesoo; Kim, Youngwoo; Kim, Jonghoon J; Bae, Bumhee; Kim, Joungho; Ha, Dongho; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.54 - 57, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Analysis of Wireless Power Transfer System Design on Active Silicon Interposer for Low Voltage Applications in 3D-IC Kim, Joung-Ho; Song, JW; Kim, Sukjin; Bae, Bumhee; Kim, Hongseok; Kim, Jonghoon J.; Kim, Dong-Hyun Bill, 23rd Conference on Electrical Performance of Electronic Packaging and Systems(EPEPS2014), 23rd Conference on Electrical Performance of Electronic Packaging and Systems(EPEPS2014), 2014-10-26 |
| Analytical Expressions for Maximum Transferred Power in Wireless Power Transfer Systems Kogn, Sunkyu; Kim, Myunghoi; Koo, Kyongchoul; Ahn, Seungyoung; Bae, Bumhee; Kim, Joungho, 2011 IEEE Electromagnetic Compatibility Symposium, 2011 IEEE Electromagnetic Compatibility Symposium, 2011-08-17 |
| Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems Park, Sung Joo; Bae, Bumhee; Kim, Joungho; Swaminathan, Madhavan, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, v.25, no.6, pp.1856 - 1865, 2017-06 |
Application of VSI-EBG Structure to High-Speed Differential Signals for Wideband Suppression of Common-Mode Noise Kim, Myunghoi; Kim, Sukjin; Bae, Bumhee; Cho, Jonghyun; Kim, Joungho; Kim, Jaehoon; Ahn, Do Seob, ETRI JOURNAL, v.35, no.5, pp.827 - 837, 2013-10 |
| Chip-Level Simultaneous Switching Current Measurement in Power Distribution Network Using Magnetically Coupled Embedded Current Probing Structure Kim, Jonghoon J.; Cho, Changhyun; Bae, Bumhee; Kim, Suk Jin; Kong, Sunkyu; Kim, Hee-Gon; Jung, Daniel Hyunsuk; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.12, pp.1963 - 1972, 2014-12 |
| Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test Kim, Jonghoon J; Kim, Joungho; Park, Junyong; Kim, Heegon; Bae, Bumhee; Jung, Daniel H; Ha, Dongho; et al, DesignCon 2016, DesignCon 2016, 2016-01-19 |
| Design of Contactless Wafer-level TSV Connectivity Testing Structure using Capacitive Coupling Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Kim, Sukjin; Bae, Bumhee; Jung, Daniel H; Kong, Sunkyu; et al, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.158 - 162, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 |
| Design of the PCB embedded active IC structure for ultra-thin wearable application with low-RFI Bae, Bumhee; Shim, JongWan; Kim, Younho; Kim, HyungGeun; Park, HarkByeong; Kim, Joungho, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2017, pp.325 - 327, Institute of Electrical and Electronics Engineers Inc., 2017-06 |
| Design, Implementation and Measurement of Board-to-Board Wireless Power Transfer (WPT) for Low Voltage Applications Kim, Joungho; Kim, Sukjin; Bae, Bumhee; Kong, Sunkyu; Jung, Daniel H; Kim, Jonghoon J, 22nd Conference on Electrical Performance of Electronic Packaging and Systems(EPEPS2013), 22nd Conference on Electrical Performance of Electronic Packaging and Systems, 2013-10-29 |
| Electromagnetic Interference on Analog-to-Digital Converters from High-Power Wireless Power Transfer System for Automotive Charger Kong, Sunkyu; Kim, Joungho; Bae, Bumhee; Kim, Dong-Hyun; Kim, Hongseok; Song, Chiuk, IEEE International Conference on Electromagnetic Compatibility (EMC 2016), IEEE International Conference on Electromagnetic Compatibility (EMC 2016), 2016-07-27 |
| Electromagnetic Interference Shielding Effects in Wireless Power Transfer using Magnetic Resonance Coupling for Board-to-Board Level Interconnection Kim, Joungho; Kim, Sukjin; Kim, Hongseok; Kim, Jonghoon J; Bae, Bumhee; Kong, Sunkyu, 2013 IEEE Electromagnetic Compatibility Symposium, pp.773 - 778, 2013 IEEE Electromagnetic Compatibility Symposium, 2013-08-08 |
| Electromagnetic noise effects on semiconductor system in electric vehicle Bae, Bumhee; Kim, Jonghoon J; Kim, Sukjin; Kong, Sunkyu; Jung, Daniel H; Kim, Joungho, DesignCon 2015, UBM Electronics, 2015-01 |
| Electromagnetic Radiated Emissions from a Repeating-Coil Wireless Power Transfer System using a Resonant Magnetic Field Coupling Kim, Joungho; Kong, Sunkyu; Bae, Bumhee; Kim, Jong Hun; Kim, Sukjin; Jeong, Hyunseok, IEEE Wireless Power Transfer Conference 2014 (WPTC 2014), IEEE Wireless Power Transfer Conference 2014, 2014-11-02 |
| Electroststic Discharge(ESD) Effects on Wireless Power Transfer using Magnetic Resonance Coupling Kim, Joung-Ho; Kim, Sukjin; Cho, Yeonje; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu, 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI), 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI), 2014-08-05 |
| High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling Kim, Sukjin; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu; Ahn, Seungyoung; Kim, Jonghoon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.7, pp.863 - 878, 2015-07 |
| High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test Park, Junyong; Kim, Hyesoo; Kim, Jonghoon J.; Kim, DongHyun; Son, Kyungjune; Kim, Subin; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.12, pp.2152 - 2162, 2018-12 |
| High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package Kim, Hyesoo; Kim, Jonghoon J.; Park, Junyong; Park, Shinyoung; Choi, Sumin; Bae, Bumhee; Ha, DongHo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1356 - 1368, 2017-08 |
| How to Improve Power Integrity on Analog-to-Digital Converter (ADC) with Chip-PCB Hierarchical Structure Kim, Joungho; Bae, Bumhee; Cho, Jonghyun; Kong, Sunkyu; Kim, Jonghoon J; Shim, Yujeing, 2013 Design Con, 2013 Design Con, 2013-01-31 |
| Magnetic Field Coupling on Analog-to-digital Converter from Wireless Power Transfer System in Automotive Environment Kim, Joungho; Bae, Bumhee; Kong, Sunkyu; Kim, Jonghoon J; Kim, Sukjin, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.238 - 242, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 |
| Measurement of High-bandwidth and High-density Silicone Rubber Socket up to 110GHz Park, Junyong; Kim, Joungho; Kim, Hyesoo; Kim, Jonghoon J; Bae, Bumhee; Ha, Dongho; Bae, Michael, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 |
| Modeling and analysis of a conductive rubber contactor for package test Kim, Hyesoo; Bae, Bumhee; Kim, Jonghoon J; Park, Junyong; Ha, Dongho; Bae, Michael; Kim, Joungho, 17th IEEE Electronics Packaging and Technology Conference, EPTC 2015, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Modeling and Analysis of Power Supply Noise Effects on Analog-to-Digital Converter in 3DIC Bae, Bumhee; Shim, Yujeong; Cho, Jonghyun; Kim, Joungho, 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2011, 2011-11-06 |
| Modeling and Measurement of Power Supply Noise Effects on an Analog-to-Digital Converter Based on a Chip-PCB Hierarchical Power Distribution Network Analysis Bae, Bumhee; Shim, Yujeong; Koo, Kyoungchoul; Cho, Jonghyun; Pak, Jun So; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.55, no.6, pp.1260 - 1270, 2013-12 |
| Modeling of Simultaneous Switching Noise Effects on Jitter Characteristics of Delay Locked Loop in a Hierarchical System of Chip-Package-PCB Shim, Yujeong; Bae, Bumhee; Koo, Koungchoul; Kim, Joungho, 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2011, 2011-11-07 |
| Noise Coupling Effects on CMOS Analog-to-Digital Converter in Magnetic Field Wireless Power Transfer System Using Chip-PCB Comodeling and Simulation Kim, Joung-Ho; Bae, Bumhee; Kim, Jonghoon; Kim, Suk Jin; Kong, Sunkyu, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.57, no.3, pp.329 - 338, 2015-06 |
| On-chip Design Technque for Reducing Power Supply Noise Coupling on ADC with Chip-PCB Hierarchical Structure Bae, Bumhee; Cho, Jonghyun; Kim, Joungho, 2012 IEEE Electromagnetic Compatibility Symposium, 2012 IEEE Electromagnetic Compatibility Symposium, 2012-08-15 |
| Shielding effectiveness of noise coupling on Analog-to-digital converter in magnetic field wireless power transfer system Bae, Bumhee; Kim, Sukjin; Kwon, YoungKun; Kim, HyungGeun; Park, HarkByeong; Kong, Sunkyu; Kim, Joungho, 11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMCCompo 2017, pp.50 - 53, Institute of Electrical and Electronics Engineers Inc., 2017-07 |
| Simultaneous switching noise coupling through via transition for a CMOS negative feedback Operational Amplifier in System-in-Package Bae, Bumhee; Shim, Yujeong; Cho, Jonghyun; Kim Joungho, 2011 IEEE 54th International Midwest Symposium on Circuits and Systems, 2011 IEEE 54th International Midwest Symposium on Circuits and Systems, 2011-08-10 |
| Through-Silicon Via Capacitance-Voltage Hysteresis Modeling for 2.5-D and 3-D IC Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jong-Hyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.6, pp.925 - 935, 2017-06 |
| Vertically Alternating Impedance Electromagnetic Bandgap (VAI-EBG) Structure for Noise Mitigation in Multi-layer PCBs Kim, myunghoi; Koo, Kyoungchoul; Kong, Sunkyu; Bae, Bumhee; Lee, Sangrok; Kim Joungho, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011-05-17 |
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