Showing results 1 to 48 of 48
10 GHz Differential Line Modeling of Leadframe-type TQFP Package for High-speed Serial Interconnection Systems Ahn, Seungyoung; Kim, Tae Hong; Kim, Joungho, IEEE 7th Workshop on Signal Propagation on Interconnects, pp.43 - 46, IEEE, 2003 |
A Frequency-Selective EMI Reduction Method for Tightly Coupled Wireless Power Transfer Systems Using Resonant Frequency Control of a Shielding Coil in Smartphone Application Hong, Seokwoo; Kim, Youngwoo; Lee, Seongsoo; Jeong, Seungtaek; Sim, Boogyo; Kim, Hongseok; Song, Jinwook; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.6, pp.2031 - 2039, 2019-12 |
A Low-Cost and High-density RF Multi-chip Module Tranceiver For 1.8 GHz Personal Communication Service Kim, Joungho; Ryu, Woonghwan; Kim, Jonghoon; Kim, Namhoon; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Sungil; et al, IEEE ECTC Conference, IEEE, 2000 |
A MLGA Connector for High speed and High Density Kim, Joungho; Kim, Young Soo; Choi, Hyung Seok; Ko, Youngwoo; Bang, Hyo Jae; Kim, Woo Kyung; Baek, Seungyong; et al, HD International 2001 (The International Conference and Exhibition on High Density Interconnect and Systems packaging), 2001 |
A Novel Twisted Differential Line for High-speed On-chip Interconnections with Reduced Crosstalk Kim, Joungho; Kam, Dong Gun; Ahn, Seungyoung; Baek, Seungyong; Park, Bongcheol; Sung, Myunghee, IEEE 4th Electronics Packaging Technology Conference, pp.180 - 183, IEEE, 2002 |
Analysis of EMF Noise from the Receiving Coil Topologies for Wireless Power Transfer Kim, Jong Hoon; Kim, Hongseok; Kim, Mijoo; Ahn, Seungyoung; Kim, Ji Seong; Kim Joungho, 2012 Asia-Pacific Symposium on Electromagnetic Compatibility, AP-EMC 2012, 2012 Asia-Pacific Symposium on Electromagnetic Compatibility, AP-EMC 2012, 2012-05-22 |
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs Song, T; Liu, C; Kim, DH; Lim, SK; Cho, J; Kim, J; Pak, JS; et al, 12th International Symposium on Quality Electronic Design, ISQED 2011, pp.122 - 128, ISQED 2011, 2011-03-14 |
Analytical Expressions for Maximum Transferred Power in Wireless Power Transfer Systems Kogn, Sunkyu; Kim, Myunghoi; Koo, Kyongchoul; Ahn, Seungyoung; Bae, Bumhee; Kim, Joungho, 2011 IEEE Electromagnetic Compatibility Symposium, 2011 IEEE Electromagnetic Compatibility Symposium, 2011-08-17 |
CHARGING UP THE ROAD Ahn, Seungyoung; Suh, Nam Pyo; Cho, Dong-Ho, IEEE SPECTRUM, v.50, no.4, pp.48 - 54, 2013-04 |
Coil Design and Measurements of Automotive Magnetic Resonant Wireless Charging System for High-Efficiency and Low Magnetic Field Leakage Kim, Hongseok; Song, Chiuk; Jung, Daniel Hyunsuk; Kim, DongHyun; Kim, In Myoung; Kim, Young Il; Kim, Jong Hoon; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.383 - 400, 2016-02 |
Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System Kim, Ji Seong; Kim, Jong Hoon; Kong, Sunkyu; Kim, Hongseok; Suh, In-Soo; Suh, Nam Pyo; Cho, Dong-Ho; et al, PROCEEDINGS OF THE IEEE, v.101, no.6, pp.1332 - 1342, 2013-06 |
Compensation of ESD and Device Input Capacitance by using Embedded Inductor on PCB Substrate for 3 Gbps SerDes Applications Ahn, Seungyoung; Baek, Seungyong; Lee, Junho; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, pp.499 - 504, IEEE, 2004-08-09 |
Compensation of ESD and Input Capacitance Effect by Using Package Bond-wire Inductance for Over Gbps Differential SerDes Devices Ahn, Seungyoung; Park, Jongbae; Chung, Daehyun; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.159 - 162, IEEE, 2003-10-27 |
Design and estimation of embedded passives in multiple line grid array (MLGA) package Kim, Joungho; Lee, Junho; Ahn, Seungyoung; Baek, Seungyong; Kim, Young-Soo; Yoon, Chong K., EMAP2000, EMAP, 2000-11 |
Design and Implementation of Shaped Magnetic-Resonance-Based Wireless Power Transfer System for Roadway-Powered Moving Electric Vehicles Shin, Jaegue; Shin, Seung Yong; Kim, Yangsu; Ahn, Seungyoung; Lee, Seokhwan; Jung, GuHo; Jeon, Seong-Jeub; et al, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.61, no.3, pp.1179 - 1192, 2014-03 |
Design Considerations of Electromagnetic Field from Wireless Power Transfer System for Portable Electronic Devices Kim, Hongseok; Choi, Chul-Seung; Park, Hyun Ho; Kim, Jonghoon; Chun, Yangbae; Kim, Joungho; Ahn, Seungyoung, 2012 Korea-Japan EMT/EMC/BE Joint Conference, 2012-05-18 |
Design of Electromagnectic Field (EMF) for a Novel On-Line Electric Vehicle (OLEV) Ahn, Seungyoung; Lee, Hee Jae; Junggun Byun; Deogsoo Kang; Taigon Song; CHUN, YANGBAE; Jae-Ha Yim; et al, BEMS 2010, BEMS 2010, 2010-06 |
Effects of Process Variation on Signal Integrity for High Speed Differential Signaling on Package Level Kim, Joungho; Ahn, Seungyoung; Lu, Albert Chee W.; Fan, Wei; Wai, Lai L., IEEE 4th Electronics Packaging Technology Conference, pp.249 - 252, IEEE, 2002-12 |
Electrical Performance Analysis of Low-Cost and Ultra-Thin Glass Interposer: Advantages, Challenges and Solutions Kim, Joungho; Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Park, Shinyoung; Ahn, Seungyoung, DesignCon 2018, DesignCon 2018, 2018-01-31 |
Electromagnetic Compatibility of Resonance Coupling Wireless Power Transfer in On-Line Electric Vehicle System Chun, Yangbae; Park, Seongwook; Kim, Jong Hoon; Kim, Ji Seong; Kim, Hongseok; Kim, Joungho; Kim, Nam; et al, IEICE TRANSACTIONS ON COMMUNICATIONS, v.E97B, no.2, pp.416 - 423, 2014-02 |
EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger using Tightly-coupled Three-phase Resonant Magnetic Field Song, Chiuk; Kim, Hongseok; Kim, Youngwoo; Kim, Dong-Hyun; Jeong, Seung Taek; Cho, Yeonje; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.65, no.9, pp.6839 - 6849, 2018-09 |
Future Wireless Power Transportation System Ahn, Seungyoung; Cho, Dong-Ho, Asia-Pacific Microwave Conference, pp.468 - 469, Asia-Pacific Microwave Conference, 2013-11-08 |
High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling Kim, Sukjin; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu; Ahn, Seungyoung; Kim, Jonghoon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.7, pp.863 - 878, 2015-07 |
High-frequency electrical performance of a new high-density Multiple Line Grid Array (MLGA) package Ahn, Seungyoung; Lee, Joon-Woo; Kim, Jonghoon; Ryu, Woongwhan; Kim, Young-Soo; Yoon, Chong K.; Kim, Joungho, 50th Electronic Components and Technology Conference, pp.497 - 501, Electronic Components and Technology Conference, 2000-05 |
High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoung; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wook; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09 |
Implementation of on-chip and on-package reactive equalizer to minimize inter-symbol interference (ISI) and jitter from frequency dependent attenuation Ahn, Seungyoung; Chun, Jongtae; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, 2007-07-09 |
Low EMF and EMI Design of a Tightly Coupled Handheld Resonant Magnetic Field (HH-RMF) Charger for Automotive Battery Charging Song, Chiuk; Kim, Hongseok; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Kong, Sunkyu; Kim, Jiseong; Ahn, Seungyoung; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.58, no.4, pp.1194 - 1206, 2016-08 |
Low frequency electromagnetic field reduction techniques for the On-Line Electric Vehicle (OLEV) Ahn, Seungyoung; Pak, Jun So; Taigon Song; Lee, Hee Jae; Jung-Gun Byun; Deogsoo Kang; Cheol-Seung Choi; et al, 2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010, pp.625 - 630, IEEE, 2010-07-25 |
Low Leakage Electromagnetic Field level and High Efficiency using A Novel Hybrid Loop-array Design for Wireless High Power Transfer System Lee, Seongsoo; Kim, Dong-Hyun; Cho, Yeonje; Kim, Hongseok; Song, Chiuk; Jeong, Seungtaek; Song, Jinwook; et al, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.66, no.6, pp.4356 - 4367, 2019-06 |
Magnetic Field Design for Low EMF and High Efficiency Wireless Power Transfer System in On-Line Electric Vehicle Ahn, Seungyoung; Lee, Ju Yong; Cho, Dong-Ho; Kim, Joungho, CIRP Design Conference 2011, CIRP Design Conference 2011, 2011-03 |
Microwae Frequency Model and High-density design of Multiple Line Grid Array (MLGA) Package Kim, Joungho; Ahn, Seungyoung; Lee, Joonwoo; Kim, Jonghoon; Ryu, Woonghwan; Kim, Youngsoo; Choi, Hyun Seok; et al, IMAPS 2000, 2000 |
Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoung; Kim, Joungho; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12 |
MINI-SPECIAL ISSUE ON 2014 IEEE WIRELESS POWER TRANSFER CONFERENCE (WPTC 2014) Kim, Joungho; Ahn, Seungyoung, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.63, no.3, pp.778 - 779, 2015-03 |
Multi-Chip Module (MCM) RF Transceiver For 1.8 GHz Cellular Phone Kim, Joungho; Kim, Namhoon; Ryu, Woonghwan; Kim, Jonghoon; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Sungil; et al, APACK99, Symposium on Advances in packaging, pp.440 - 443, 1999-12 |
New Opportunity in ITS - The OLEV, Wireless Charging Electric Vehicle Jang, Young Jae; Cho, Dong-Ho; Ahn, Seungyoung; Jang, In Gwun, IEEE International Conference on Intelligent Transportation System, IEEE Intelligent Transportation System Society, 2013-10-06 |
Optimal Electromagnetic Field Design of Wireless Power Transfer System in On-Line Electric Vehicle Ahn, Seungyoung; Lee, Ju Yong; Cho, Dong-Ho; Kim, Joungho, IEEE ISAP, IEEE, 2011-10 |
Over 20 GHz Microwave Frequency Model of Fine Pitch Ball Grid Array (FPBGA) Bonding Kim, Joungho; Lee, Junho; Ahn, Seungyoung; Ryu, Jaeyoung, IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP2000, IEEE, 2000-10 |
Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer Ahn, Seungyoung; Lee, Junho; Kim, Joungho; Ryu, Woonghwan; Kum, Byung-Hun; Choi, HS; Yoon, CK, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.26, pp.90 - 98, 2003-02 |
Power supply and pickup system capable of maintaining stability of transmission efficiency despite changes in resonant frequency Cho, Dong-Ho; Kim, Joungho; Chun, Yang Bae; Kim, Eun-Jung; Ryu, Ji-Yun; Kim, Mi-Joo; Han, Il Song; et al, 2019-03-12 |
Power supply and pickup system capable of maintaining stability of transmission efficiency despite changes in resonant frequency KAIST OLEV; Cho, Dong-Ho; Kim, Joungho; Ahn, Seungyoung; CHUN, YANGBAE; Kim, Eun-Jung; Ryu, Ji-Yun; et al |
POWER-SUPPLYING AND PICK-UP SYSTEM WITH STABLE TRANSMISSION-EFFICIENCY IN CONDITION OF VARIANCE OF RESONANT FREQUENCY KAIST OLEV; Cho, Dong-Ho; Kim, Joungho; Ahn, Seungyoung; CHUN, YANGBAE; Kim, Eun-Jung; Ryu, Ji-Yun; et al |
RF interconnect for multi-Gbit/s board-level clock distribution Ryu, Woonghwan; Lee, Junwoo; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Namhoon; Choi, Baekkyu; Kam, Donggun; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.3, pp.398 - 407, 2000-08 |
RF Interconnect for Multi-Gbit/sec Board-Level Clock Distribution Kim, Joungho; Ryu, Woonghwan; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Namhoon; Choi, Baekkyu, 8th Topical Meeting on Electrical Performance of Electronic Packaging, 1999-10 |
Small-Size Low-Cost Wideband Continuous-Time Linear Passive Equalizer With an Embedded Cavity Structure on a High-Speed Digital Channel Shin, Min-Chul; Kim, Myunghoi; Kim, Ji-Seong; Kim, Joungho; Ahn, Seungyoung, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.1, pp.94 - 99, 2014-01 |
Suppression of Leakage Magnetic Field from a Wireless Power Transfer System using Ferrimagnetic Material and Metallic Shielding Kim, Hongseok; Cho, Jonghyun; Ahn, Seungyoung; Kim, Jong Hoon; Kim, Joungho, 2012 IEEE Electromagnetic Compatibility Symposium, 2012 IEEE Electromagnetic Compatibility Symposium, 2012-08-15 |
Suppression of radiated emission from an 8-bit micro-controller using gate-oxide filtering capacitors Kim, Hyungsoo; Kim, Jonghoon; Ryu, Woonghwan; Sung, Myunghee; Ahn, Seungyoung; Kim, Joungho, Proceedings of the 1999 IEEE EMC Symposium on 'Electromagnetic Compatibility', v.2, pp.811 - 815, IEEE, 1999-08-02 |
Thin PCB-Type Metamaterials for Improved Efficiency and Reduced EMF Leakage in Wireless Power Transfer Systems Cho, Yeonje; Kim, Jonghoon; Kim, DongHyun; Lee, Seongsoo; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.353 - 364, 2016-02 |
Wireless Power Transfer System Design for Electric Vehicle Charging Considering A Wide Range of Coupling Coefficient Variation Depending on the Coil Misalignment Chu, Changyeob; Huh, Sungryul; Choi, Semin; Park, Jong-Hyeok; Ahn, Seungyoung; Lee, Sang-Gug; Park, Ki Bum, 2021 24th International Conference on Electrical Machines and Systems (ICEMS), pp.732 - 737, IEEE, 2021-10-31 |
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