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Showing results 1 to 5 of 5

1
Frequency domain optimization of equalizer for high-speed differential interconnection using active filter and reactive termination techniques = 능동필터와 리액티브 터미네이션을 이용한 고속 디퍼런셜 인터커넥션을 위한 이퀄라이저의 주파수 영역 최적화에 관한 연구link

Ahn, Seung-Young; 안승영; et al, 한국과학기술원, 2005

2
Microwave frequency modeling of next generation high-density packages = 차세대 고밀도 패키지의 마이크로 웨이브 주파수 영역에서의 모델링에 관한 연구link

Ahn, Seung-Young; 안승영; et al, 한국과학기술원, 2000

3
Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects

Cho, Jeonghyeon; Song, Eak-Hwan; Kim, Hee-Gon; Ahn, Seung-Young; Pak, Jun-So; Kim, Ji-Seong; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.53, no.3, pp.814 - 822, 2011-08

4
PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

Pak, Jun-So; Kim, Joo-Hee; Cho, Jong-Hyun; Kim, Ki-Yeong; Song, Tai-Gon; Ahn, Seung-Young; Lee, Jun-Ho; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.208 - 219, 2011-02

5
Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs

Kim, Myung-Hoi; Koo, Kyoung-Choul; Shim, Yu-Jeong; Hwang, Chul-Soon; Pak, Jun-So; Ahn, Seung-Young; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.55, no.2, pp.307 - 314, 2013-04

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