Browse "School of Electrical Engineering(전기및전자공학부)" by Author 37131
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| Basic Analysis of Signal and Power Integrity of TSV Applications Pak, Jun So; Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Kim, Joungho, 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012-05-18 |
| Electrical Performance of 3D TSV Channel and 3D Stacked PDN based on Hierarchical Models Pak, Jun So; Kim, Joohee; Cho, Jonghyun; Kim, Heegon; Kim, Joungho, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011-03-01 |
| Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity Lee, Manho; Cho, Jonghyun; Pak, Jun So; Lee, Hyungdong; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
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