Browse "School of Electrical Engineering(전기및전자공학부)" by Subject packaging
Showing results 1 to 5 of 5
| A Low Contact Resistance 4-Terminal Mems Relay: Theoretical Analysis, Design, and Demonstration Yoon, Yong Hoon; Jin, Yun Su; Kim, Chang-Keun; Hong, Songcheol; Yoon, Jun-Bo, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.27, no.3, pp.497 - 505, 2018-06 |
| Compact packaging of optical and electronic components for on-board optical interconnects Cho, HS; Chu, KM; Kang, S; Hwang, SH; Rho, BS; Kim, WH; Kim, JS; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.28, no.1, pp.114 - 120, 2005-02 |
| Electrical Characterization of Screen-Printed Circuits on the Fabric Kim, Yongsang; Kim, Hyejung; Yoo, Hoi-Jun, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, pp.196 - 205, 2010-02 |
| Fabrication of optical splitter and passive alignment technique with a femtosecond laser Sohn, IB; Lee, Man Seop; Chung, JY, IEEE PHOTONICS TECHNOLOGY LETTERS, v.17, pp.2349 - 2351, 2005-11 |
| 광섬유 자이로용 집적광학 칩의 제작과 신뢰성 시험 = Fabrication and reliability test of integrated optical chips for the fiber optic gyrolink 방규철; Bang, Kyu-Chul; et al, 한국과학기술원, 2003 |
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