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Showing results 1 to 11 of 11

1
3차원 구조의 MMIC를 위한 다층구조 전송선의 제작과 특성 분석 = Fabrication and characterization of multilayer transmission lines for the implementation of three-dimensional MMICslink

이수훈; Lee, Soo-Hoon; et al, 한국과학기술원, 2005

2
A 1.9-GHz cmos power amplifier using an interdigitated transmission line transformer

Park, Changkun; Baek, Sang-Hyun; Ku, Bon-Hyun; Hong, Songcheol, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.49, no.12, pp.3162 - 3166, 2007-12

3
A new twisted differential line structure on high-speed printed circuit boards to enhance immunity to crosstalk and external noise

Kam, DG; Lee, H; Kim, Joungho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.13, pp.411 - 413, 2003-09

4
Air-Cavity Transmission Lines on Anodized Aluminum for High-Performance RF Modules

Yook, Jong-Min; Kim, Kyoung-Min; Kwon, Young Se, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.19, no.10, pp.623 - 625, 2009-10

5
Desgign and fabrication of low phase noise VCOs utilizing MEMS structures = MEMS 구조를 이용한 낮은 위상 잡음을 갖는 집적화된 VCO의 설계 및 제작link

Park, Eun-Chul; 박은철; et al, 한국과학기술원, 2003

6
Low-power dynamic termination scheme using NMOS diode clamping

Shin, DH; Lee, YM; Kim, KH; Lee, Kwyro, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.34, no.8, pp.1171 - 1175, 1999-08

7
Monolithic implementation of coaxial line on silicon substrate

Jeong, In Ho; Kwon, Young-Se, IEEE MICROWAVE AND GUIDED WAVE LETTERS, v.10, no.10, pp.406 - 408, 2000-10

8
Monolithic implementation of coaxial line using BCB- or air-filled cavity for high isolation = 높은 신호 격리를 위한 BCB 및 공기층을 사용한 동축선의 일괄 공정 구현link

Jeong, In-Ho; 정인호; et al, 한국과학기술원, 2001

9
TEM wave mode-matching solution for tapered CTL-cell = 테이퍼된 CTL셀의 TEM파 모드매칭 해link

Auge, Adrien; Adrien AUGE; et al, 한국과학기술원, 2012

10
Tournament-shaped magnetically coupled power-combiner architecture for RF CMOS power amplifier

Park, Changkun; Lee, Dong Ho; Han, Jeonghu; Hong, Songcheol, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.55, no.10, pp.2034 - 2042, 2007-10

11
Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission

Kam D.G.; Lee H.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.27, no.4, pp.590 - 596, 2004-11

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