Browse "School of Electrical Engineering(전기및전자공학부)" by Author Kim, Sanghyeon
Showing results 1 to 60 of 67
| 200-mm Si CMOS Process-Compatible Integrated Passive Device Stack for Millimeter-Wave Monolithic 3-D Integration Park, Minsik; Song, Jonghyun; Jeong, Jaeyong; Lim, Jeong-Taek; Song, Jae-Hyeok; Lee, Won-Chul; Sim, Gapseop; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.70, no.10, pp.5257 - 5264, 2023-10 |
| 3D Stackable Broadband Photoresponsive InGaAs Biristor Neuron for a Neuromorphic Visual System with Near 1 V Operation Han, Joon-Kyu; Shim, Jaeho; Choi, Yang-Kyu; Geum, Dae-Myeong; Kim, Seongkwang; Yu, Ji-Man; Kim, Jongmin; et al, IEEE International Electron Devices Meeting, IEDM 2021, pp.1 - 4, 2021 IEEE International Electron Devices Meeting (IEDM), 2021-12-11 |
| 3D Stackable Cryogenic InGaAs HEMT-Based DC and RF Multiplexer/Demultiplexer for Large-Scale Quantum Computing Jeong, Jaeyong; Kim, Seong Kwang; Kim, Jongmin; Lee, Jisung; Kim, Joon Pyo; Kim, Bong Ho; Suh, Yoon-Je; et al, 2022 International Electron Devices Meeting, IEDM 2022, pp.451 - 454, Institute of Electrical and Electronics Engineers Inc., 2022-12 |
| 3D stackable cryogenic InGaAs HEMTs for heterogeneous and monolithic 3D integrated highly scalable quantum computing systems Jeong, Jaeyong; Kim, Seong Kwang; Kim, Jongmin; Geum, Dae-Myeong; Lee, Jisung; Park, Seung-Young; Kim, Sanghyeon, IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022, pp.328 - 329, Institute of Electrical and Electronics Engineers Inc., 2022-06 |
| A sub-micron-thick InGaAs broadband (400-1700 nm) photodetectors with a high external quantum efficiency (>70%) Geum, Dae-Myeong; Lim, Jinha; Jang, Junho; Ahn, Seungyeop; Kim, SeongKwang; Shim, Joonsup; Kim, Bong Ho; et al, 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022, pp.413 - 414, Institute of Electrical and Electronics Engineers Inc., 2022-06 |
| Analysis of temperature-dependent I-V characteristics of the Au/n-GaSb Schottky diode Jang, Junho; Song, Jaeman; Lee, Seung-Seob; Jeong, Sangkwon; Lee, Bong Jae; Kim, Sanghyeon, MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, v.131, 2021-08 |
| Atomic-scale mapper for superlattice photodetectors analysis Bidenko, Pavlo; Ahn, Seungyeop; Kang, Ko-Ku; Lee, Hyun-Jin; Kim, Young Ho; Kim, Sanghyeon, OPTICS EXPRESS, v.30, no.15, pp.27868 - 27883, 2022-07 |
| Biochemical spectroscopy based on germanium-on-insulator platform for mid-infrared optical sensor Lim, Jinha; Shim, Joonsup; Kim, Inki; Kim, Seong Kwang; Lim, Hyeongrak; Ahn, Seung-Yeop; Park, Juhyuk; et al, 2022 International Electron Devices Meeting, IEDM 2022, pp.2411 - 2414, Institute of Electrical and Electronics Engineers Inc., 2022-12 |
| Capacitor-Less 4F(2) DRAM Using Vertical InGaAs Junction for Ultimate Cell Scalability Kim, Joon Pyo; Sim, Jaeho; Bidenko, Pavlo; Geum, Dae-Myeong; Kim, Seong Kwang; Shim, Joonsup; Kim, Jongmin; et al, IEEE ELECTRON DEVICE LETTERS, v.43, no.11, pp.1834 - 1837, 2022-11 |
| Comparative advantages of a type-II superlattice barrier over an AIGaSb barrier for enhanced performance of InAs/GaSb LWIR nBn photodetectors Lee, Hyun-Jin; Jang, Ahreum; Kim, Young Ho; Jung, Han; Bidenko, Pavlo; Kim, Sanghyeon; Kim, Minje; et al, OPTICS LETTERS, v.46, no.16, pp.3877 - 3880, 2021-08 |
| Crosstalk suppression in germanium-on-insulator platform using subwavelength gratings for mid-infrared photonics Shin, Yosep; Lim, Jinha; Kim, Sanghyeon; Kim, Sangsik, Integrated Optics: Devices, Materials, and Technologies XXVIII 2024, SPIE, 2024-01-31 |
| Crosstalk suppression in germanium-on-insulator platform using subwavelength gratings for mid-infrared photonics Shin, Yosep; Lim, Jinha; Kim, Sanghyeon; Kim, Sangsik, Integrated Optics: Devices, Materials, and Technologies XXVIII 2024, SPIE, 2024-01-31 |
| Cryogenic RF Transistors and Routing Circuits Based on 3D Stackable InGaAs HEMTs with Nb Superconductors for Large-Scale Quantum Signal Processing Jeong, Jaeyong; Kim, Seongkwang; Suh, Yoon-Je; Lee, Jisung; Choi, Joonyoung; Park, Juhyuk; Kim, Joon Pyo; et al, 2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023, Institute of Electrical and Electronics Engineers Inc., 2023-06 |
| Design and fabrication of Ge-on-Si slot waveguide for mid- infrared optical gas sensor Lim, Jinha; Shim, Joonsup; Kim, Sanghyeon, OSA Optical Sensors and Sensing Congress 2021, Optical Society of America, 2021-07 |
| Development and analysis of GaN HEMT-On-Metal-On-Si wafer for 3D heterogeneous integration of GaN power devices and Si CMOS driver circuits = GaN 전력 Device와 Si CMOS 구동회로의 3차원 이종 집적을 위한 GaN HEMT-On-Metal-On-Si Wafer 공정 개발 및 분석link Choi, Sungjoon; 최성준; et al, 한국과학기술원, 2024 |
| Dielectric-Engineered High-Speed, Low-Power, Highly Reliable Charge Trap Flash-Based Synaptic Device for Neuromorphic Computing beyond Inference Kim, Joon Pyo; Kim, Seong Kwang; Park, Seohak; Kuk, Song-hyeon; Kim, Taeyoon; Kim, Bong Ho; Ahn, Seong-Hun; et al, NANO LETTERS, v.23, no.2, pp.451 - 461, 2023-01 |
| Effect of Barrier Layer on InAs/GaSb Type- II Superlattice nBn Detector Jang, Ahreum; Lee, Hyun Jin; Kim, Young Ho; Jung, Han; Bidenko, Pavlo; Kim, Sanghyeon, 20th International Conference on Electronics, Information, and Communication (ICEIC), IEEE, 2021-02 |
| Effects of Back Metal on the DC and RF Characteristics of 3D Stacked InGaAs RF Device for Monolithic 3D RF Applications Jeong, Jaeyong; Kim, Seong Kwang; Kim, Jongmin; Geum, Dae-Myeong; Kim, Sanghyeon, IEEE ELECTRON DEVICE LETTERS, v.44, no.4, pp.598 - 601, 2023-04 |
| Electrical Analysis for Wafer-Bonded Interfaces of p(+)GaAs/n(+)InGaAs and p(+)InGaAs/n(+)InGaAs Geum, Dae-Myeong; Kim, Seong Kwang; Lim, Hyeong-Rak; Park, Juhyuk; Jeong, Jaeyong; Han, Jae Hoon; Choi, Won Jun; et al, IEEE ELECTRON DEVICE LETTERS, v.42, no.6, pp.800 - 803, 2021-06 |
| Electrical characterization of wafer-bonded interfaces of p+InGaAs/n+InGaAs and p+GaAs/n+InGaAs Geum, Dae-Myeong; Kim, Seongkwang; Lim, Hyeongrak; Park, Juhyuk; Jeong, Jaeyong; Han, JaeHoon; Choi, WonJun; et al, Global Photovoltaic Conference 2021, Korea Photovoltaic Society (KPVS), 2021-07-07 |
| Experimental demonstration of high-Q MRR based on a germanium-on-insulator platform with an yttria insulator in the mid-IR range Lim, Jinha; Shim, Joonsup; Kim, Inki; Kim, Sanghyeon, PHOTONICS RESEARCH, v.11, no.11, pp.A80 - A87, 2023-11 |
| Fabrication and characterization of 3D stackable broadband photoresponsive InGaAs biristor neuron for neuromorphic visual system = 뉴로모픽 비쥬얼 시스템을 위한 광대역 광반응성 InGaAs 바이리스터 뉴런 소자의 제작 및 분석link Sim, Jaeho; Kim, Sanghyeon; et al, 한국과학기술원, 2022 |
| Free-carrier absorption-assisted photodetection using a waveguide-integrated bolometer with flat spectral response for integrated optical sensors Shim, Joonsup; Lim, Jinha; Geum, Dae-Myeong; You, Jong-Bum; Yoon, Hyeonho; Kim, Joon Pyo; Baek, Woo Jin; et al, Infrared Sensors, Devices, and Applications XII 2022, SPIE, 2022-08-25 |
| Functionalized Bonding Materials and Interfaces for Heterogeneously Layer-Stacked Applications Kim, Sanghyeon; Han, Jae-Hoon; Choi, Won Jun; Song, Jin Dong; Kim, Hyung-jun, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.74, no.2, pp.82 - 87, 2019-01 |
| Grating - Resonance InGaAs Narrowband Photodetector for Multispectral Detection in NIR - SWIR Region Jang, Junho; Shim, Joonsup; Lim, Jinha; Park, Gyeong Cheol; Kim, Jongmin; Geum, Dae-Myeong; Kim, Sanghyeon, 2022 International Electron Devices Meeting, IEDM 2022, pp.1941 - 1944, Institute of Electrical and Electronics Engineers Inc., 2022-12 |
| Grating - Resonance InGaAs Narrowband Photodetector for Multispectral Detection in NIR - SWIR Region Jang, Junho; Shim, Joonsup; Lim, Jinha; Park, Gyeong Cheol; Kim, Jongmin; Geum, Dae-Myeong; Kim, Sanghyeon, 2022 International Electron Devices Meeting, IEDM 2022, pp.1941 - 1944, Institute of Electrical and Electronics Engineers Inc., 2022-12-06 |
| Heat management in monolithic 3D RF platform Jeong, Jaeyong; Kim, Seong Kwang; Kim, Jongmin; Geum, Dae-Myeong; Kim, Sanghyeon, 6th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2022, pp.79 - 81, Institute of Electrical and Electronics Engineers Inc., 2022-03 |
| Heterogeneous 3-D Sequential CFETs With Ge (110) Nanosheet p-FETs on Si (100) Bulk n-FETs Kim, Seong Kwang; Lim, Hyeong-Rak; Jeong, Jaejoong; Lee, Seung Woo; Jeong, Ho Jin; Park, Juhyuk; Kim, Joon Pyo; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.71, no.1, pp.393 - 399, 2024-01 |
| Heterogeneous 3D Sequential CFET with Ge (110) Nanosheet p-FET on Si (100) bulk n-FET by Direct Wafer Bonding Kim, Seong Kwang; Lim, Hyeong-Rak; Jeong, Jaejoong; Lee, Seung Woo; Kim, Joon Pyo; Jeong, Jaeyoung; Kim, Bong Ho; et al, 2022 International Electron Devices Meeting, IEDM 2022, pp.2011 - 2014, Institute of Electrical and Electronics Engineers Inc., 2022-12 |
| Heterogeneous and Monolithic 3D Integration of III-V-Based Radio Frequency Devices on Si CMOS Circuits Jeong, Jaeyong; Kim, Seong Kwang; Kim, Jongmin; Geum, Dae-Myeong; Kim, Duckhyun; Jo, Eunju; Jeong, Hakcheon; et al, ACS NANO, v.16, no.6, pp.9031 - 9040, 2022-06 |
| Heterogeneous integrated quantum dot for wavelength-tunable quantum emitters Lee, Mireu; Song, Jin-Dong; Kim, Je-Hyung; Kim, Sanghyeon; Ko, Young-Ho, 2022 Conference on Lasers and Electro-Optics (CLEO), Optica Publishing Group (formerly OSA), 2022-05 |
Heterogeneously-Integrated Optical Phase Shifters for Next-Generation Modulators and Switches on a Silicon Photonics Platform: A Review Kim, Younghyun; Han, Jae-Hoon; Ahn, Daehwan; Kim, Sanghyeon, MICROMACHINES, v.12, no.6, 2021-06 |
| High-performance InGaAs-On-Insulator HEMTs on Si CMOS for Substrate Coupling Noise-free Monolithic 3D Mixed-Signal IC Jeong, Jaeyong; Kim, Seongkwang; Kim, Jongmin; Geum, Daemyeong; Park Juyeong; Jang, Jae-Hyung; Kim, Sanghyeon, 2021 Symposia on VLSI Technology, IEEE, 2021-06-17 |
| High-sensitivity waveguide-integrated bolometer based on free-carrier absorption for Si photonic sensors Shim, Joonsup; Lim, Jinha; Geum, Dae-Myeong; You, Jong-Bum; Yoon, Hyeonho; Kim, Joon Pyo; Baek, Woo Jin; et al, OPTICS EXPRESS, v.30, no.23, pp.42663 - 42677, 2022-11 |
| Hybrid 3D Sequential CFET with Ge (110) Nanosheet p-FET on Si (100) bulk n-FET by Direct Wafer Bonding Kim, Seong Kwang; Lim, Hyeong-Rak; Jeong, Jaejoong; Lee, Seung Woo; Kim, Joon Pyo; Jeong, Jaeyoung; Kim, Bong Ho; et al, 68th IEEE International Electron Devices Meeting, IEDM 2022, IEEE, 2022-12-03 |
| Impact of Bottom-Gate Biasing on Implant-Free Junctionless Ge-on- Insulator n-MOSFETs Lim, Hyeong-Rak; Kim, Seongkwang; Han, Jae-Hoon; Kim, Hansung; Geum, Dae-Myeong; Lee, Yun-Joong; Ju, Byeong-Kwon; et al, IEEE ELECTRON DEVICE LETTERS, v.40, no.9, pp.1362 - 1365, 2019-09 |
| Improved characteristics of MOS interface between In0.53Ga0.47As and insulator by H-2 annealing with Pt gate electrode Kim, Seong Kwang; Geum, Dae-Myeong; Lim, Hyeong-Rak; Kim, Hansung; Han, Jae-Hoon; Hwang, Do Kyung; Song, Jin Dong; et al, APPLIED PHYSICS LETTERS, v.115, no.14, 2019-09 |
| Influence of Channel Structure on the Subthreshold Swing of InGaAs HEMTs at Cryogenic Temperatures Down to 4 K Jeong, Jaeyong; Kim, Jongmin; Lee, Jisung; Suh, Yoonje; Rheem, Nahyun; Kim, Seongkwang; Park, Juhyuk; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.71, no.5, pp.3390 - 3395, 2024-05 |
| Intrinsic Thermomechanical Properties of Freestanding TEOS-SiO2 Thin Films Depending on Thickness Kim, Hyeongjun; Kim, Dong Jun; Kim, Joon Pyo; Baek, Woo Jin; Kim, Sanghyeon; Kim, Taek-Soo, ACS APPLIED ELECTRONIC MATERIALS, v.6, no.7, pp.5293 - 5300, 2024-07 |
| Investigation on TiOx/Ti/TiOx tri-layer film for integrated optical gas sensing applications Shim, Joonsup; Lim, Jinha; Kim, Sanghyeon, OSA Optical Sensors and Sensing Congress 2021, Optical Society of America, 2021-07 |
| Large Polarization of Hf<sub>0.5</sub>Zr<sub>0.5</sub>O<sub>x</sub> Ferroelectric Film on InGaAs With Electric-Field Cycling and Annealing Temperature Engineering Suh, Yoonje; Jeong, Jaeyong; Kim, Bong Ho; Kuk, Songhyeon; Kim, Seongkwang; Kim, Joon Pyo; Kim, Sanghyeon, IEEE ELECTRON DEVICE LETTERS, v.45, no.5, pp.766 - 769, 2024-05 |
| Logic and Memory Ferroelectric Field-Effect-Transistor Using Reversible and Irreversible Domain Wall Polarization Kuk, Songhyeon; Han, Seungmin; Lee, Dong Hyun; Kim, Bong Ho; Shim, Joonsup; Park, Min Hyuk; Han, Jae-Hoon; et al, IEEE ELECTRON DEVICE LETTERS, v.44, no.1, pp.36 - 39, 2023-01 |
| Low-loss Germanium-on-insulator passive waveguides for mid-infrared photonics platform Lim, Jinha; Shim, Joonsup; Kim, Seong Kwang; Lim, Hyeongrak; Lee, Seung Woo; Geum, Dae-Myeong; Kim, Sanghyeon, OSA Optical Sensors and Sensing Congress 2022, Optical Society of America, 2022-07-11 |
| Micro LED display having multi-color pixel array and method of fabricating the same based on integration with driving circuit thereof Kim, Sanghyeon; Geum, DaeMyeong |
| Monolithic 3D III-V HEMT for future communication and quantum computing Kim, Sanghyeon, International Conference on IC Design and Technology (ICICDT), pp.XXVI, IEEE, 2022-09 |
| Monolithic 3D Integrated InGaAs HEMTs on Si for Next-Generation Communication: Record fMAX and Relaxed Self-Heating of Top Devices by a Novel M3D Structure Jeong, Jaeyong; Kim, Seong Kwang; Kim, Jongmin; Geum, Dae-Myeong; Kim, Sanghyeon, 2021 IEEE International Electron Devices Meeting, IEDM 2021, pp.11.2.1 - 11.2.4, Institute of Electrical and Electronics Engineers Inc., 2021-12 |
| Monolithic 3D sequential integration realizing 1600-PPI red micro-LED display on Si CMOS driver IC Park, Juhyuk; Geum, Dae-Myeong; Baek, Woojin; Shieh, Johnson; Kim, Sanghyeon, 2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022, pp.383 - 384, Institute of Electrical and Electronics Engineers Inc., 2022-06 |
| Monolithic 3D technology for optoelectronic applications Kim, Sanghyeon, The 6th International Conference on Electronic Materials and Nanotechnology for Green Environment, The Korean Institute of Metals and Materials, 2020-11-04 |
| Monolithic GaAs/Si V-groove depletion-type optical phase shifters integrated in a 300 mm Si photonics platform Kim, Younghyun; Yudistira, Didit; Kunert, Bernardette; Baryshnikova, Marina; Alcotte, Reynald; Ozdemir, Cenk Ibrahim; Kim, Sanghyeon; et al, PHOTONICS RESEARCH, v.10, no.6, pp.1509 - 1516, 2022-06 |
| Monolithic integration of GaAs//InGaAs photodetectors for multicolor detection Geum, Dae-myeong; Kim, Sanghyeon; Kim, Seongkwang; Kyhm, JH; Song, JD; Choi, Won Jin, 39th Symposium on VLSI Technology, VLSI Technology 2019, The IEEE Electron Devices Society,The Japan Society of Applied Physics, 2019-06 |
| Numerical Study on Modulation Efficiency Enhancement of SIS Optical Phase Shifter Using Negative Capacitance Effect Han, JH; Bidenko, P; Kim, Sanghyeon; Song, JD, The 8th International Symposium on Photonics and Electronics Convergence (ISPEC), The 8th International Symposium on Photonics and Electronics Convergence (ISPEC), 2018-12 |
| Optical detection element and GOI device for ultra-small on-chip optical sensing, and manufacturing method of the same Kim, Sanghyeon; Lim, Jinha; Shim, Joonsup |
| Proposal of P-Channel FE NAND with High Drain Current and Feasible Disturbance for Next Generation 3D NAND Kuk, Songhyeon; Han, Jae-Hoon; Kim, Bong Ho; Kim, Junpyo; Kim, Sanghyeon, 2023 IEEE International Memory Workshop, IMW 2023, Institute of Electrical and Electronics Engineers Inc., 2023-05 |
| Role of Inter-Layer Dielectric on the Electrical and Heat Dissipation Characteristics in the Heterogeneous 3D Sequential CFETs with Ge pFETs on Si nFETs Kim, Seongkwang; Lim, Hyeong-Rak; SHIM, JOONSUP; Baek, Woo Jin; Kim, Seongho; Park, YoungKeun; Jeong, Jaejoong; et al, 2023 International Electron Devices Meeting (IEDM), Institute of Electrical and Electronics Engineers Inc., 2023-12-11 |
| Simulation Study of a Monolithic III-V/Si V-Groove Carrier Depletion Optical Phase Shifter Kim, Sanghyeon; Kim, Younghyun; Ban, Yoojin; Pantouvaki, Marianna; Van Campenhout, Joris, IEEE JOURNAL OF QUANTUM ELECTRONICS, v.56, no.2, 2020-04 |
| Stackable 3D artificial neural network device and manufacturing method thereof Kim, Sanghyeon; Kim, Seong Kwang |
| Stackable InGaAs-on-Insulator HEMTs for Monolithic 3-D Integration Jeong, Jaeyong; Kim, Seong Kwang; Kim, Jongmin; Geum, Dae-Myeong; Park, Juyeong; Jang, Jae-Hyung; Kim, Sanghyeon, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.68, no.5, pp.2205 - 2211, 2021-05 |
| Strategy for 3D Ferroelectric Transistor: Critical Surface Orientation Dependence of HfZrOx on Si Kuk, Songhyeon; Han, Jae-Hoon; Kim, Bong Ho; Kim, Joon Pyo; Kim, Sanghyeon, 2023 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2023, Institute of Electrical and Electronics Engineers Inc., 2023-06-13 |
| Strategy toward the fabrication of ultrahigh-resolution micro-LED displays by bonding-interface-engineered vertical stacking and surface passivation Geum, Dae-Myeong; Kim, Seong Kwang; Kang, Chang-Mo; Moon, Seung-Hyun; Kyhm, Jihoon; Han, JaeHoon; Lee, Dong-Seon; et al, NANOSCALE, v.11, no.48, pp.23139 - 23148, 2019-12 |
| Study on InGaAs-On-insulator HEMTs on Si CMOS for monolithic 3D integration = 모놀리식 3D 집적을 위해 Si CMOS 위에 구현한 InGaAs-On-insulator HEMTs에 대한 연구link Jeong, Jaeyong; Kim, Sanghyeon; et al, 한국과학기술원, 2021 |
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