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Recent advances in electromagnetic compatibility of 3D-ICS - Part II Sicard, Etienne; Jianfei, Wu; Shen, Rongjun; Li, Er-Ping; Liu, En-Xiao; Kim, Joungho; Cho, Jeong-Hyeon; et al, IEEE Electromagnetic Compatibility Magazine, v.5, no.1, pp.65 - 74, 2016 |
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