Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference
Showing results 6521 to 6540 of 22813
| Design and Analysis of EMI Shielding Method using Intermediate Coil for Train WPT System Lee, Seongsoo; Jeong, Seungtaek; Hong, Seokwoo; Sim, Boogyo; Kim, Joungho, IEEE MTT-S Wireless Power Transfer Conference(WPTC 2018), IEEE MTT-S Wireless Power Transfer Conference(WPTC 2018), 2018-06-05 |
| Design and analysis of flexible interconnects on an extremely thin silicon substate for flexible wearable devices Jeong, Seung Taek; Kim, Subin; Kim, Youngwoo; Park, Shinyoung; Park, Hyunwook; Kim, Joungho; Lee, Jae Hak; et al, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.387 - 390, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Design and Analysis of HDMI 2.1 Connector for Crosstalk Reduction using Tabs and Inverse Tabs Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Park, Gap Yeol; Park, Joonsang; Son, Kyungjune; Sim, BooGyo; et al, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
| Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module Kim, Hyunwoo; Park, Joonsang; Son, Keeyoung; Kim, Joungho; Kim, Haeyeon; Park, Hyunwook; Shin, TaeIn; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, IEEE, 2022-12-13 |
| Design and analysis of high bandwidth memory (HBM) interposer Considering Signal and Power integirty (SI/PI) for terabyte/s bandwidth system Kim, Joungho; Cho, Kyungjun; Lee, Hyunsuk; Kim, Heegon; Kim, Youngwoo; Choi, Sumin; Kim, Subin; et al, DesignCon 2017, DesignCon 2017, 2017-02-01 |
| Design and analysis of high-definition multimedia interface connectors considering signal integrity Kumar, Gaurav; Park, Gapyeol; Park, Hyunwook; Lho, Daehwan; Park, Junyong; Kim, Joungho; Lee, Junho; et al, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Design and Analysis of Hybrid Loop-array for High Efficiency and Low EMF Level in Wireless High Power Transfer System Kim, Joungho; Lee, Seongsoo; Cho, Yeonje; Kim, Hongseok; Song, Chiuk; Jeong, Seungtaek, IEEE Wireless Power Transfer Conference 2017, IEEE Wireless Power Transfer Conference 2017, 2017-05-10 |
| Design and analysis of improved multi-module memory bus using Wilkinson power divider Kim, J.; Song, E.; Kim, J.; Kim, Joungho; Sung, M.; Kim, J.; So, B., IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.642 - 645, IEEE, 2006-08-14 |
| Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Park, Shinyoung; Park, Junyong; Park, Hyunwook; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.159 - 161, IEEE, 2018-10-15 |
| Design and Analysis of LTE MIMO Handset Antenna with Enhanced Isolation using Decoupling Technique Park, SeongOok, 2009 International Symposium on Antennas and Propagation, 2009-10-20 |
| Design and Analysis of Magnetically Coupled Coil Structures for PCB-to-Active Interposer Wireless Power Transfer in 2.5D/3D-IC Kim, Joungho, IEEE Electrical Design of Advanced Packaging & System Symposium, IEEE Electrical Design of Advanced Packaging & System Symposium, 2014-12-15 |
| Design and analysis of on-interposer active power distribution network for an efficient simultaneous switching noise suppression in 2.5D IC Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Kim, Joungho, IEEE International 3D Systems Integration Conference, 3DIC 2016, Institute of Electrical and Electronics Engineers Inc., 2017-11 |
| Design and Analysis of On-interposer Active Power Dsitribution Network for an Efficient Simultaneous Switching Noise Kim, Joungho; Cho, Kyungjun; Song, Jinwook, IEEE International Conference on 3D Systems Integration (3D IC 2016), IEEE International Conference on 3D Systems Integration (3D IC 2016), 2016-11-11 |
| Design and Analysis of On-package Inductor of an Integrated Voltage Regulator for High-Q Factor and EMI Shielding in Active Interposer based 2.5D/3D ICs Kim, Subin; Jeong, Seungtaek; Sim, Boogyo; Lee, Seongsoo; Park, Hyunwook; Kim, Haeyeon; Kim, Joungho, 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, pp.498 - 503, IEEE, 2021-07-26 |
| Design and Analysis of Power Distribution Network (PDN) for High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module Kim, Joungho; Cho, Kyungjun; Kim, Youngwoo; Lee, Hyungsuk; Kim, Heegon; Cho, Sumin; Kim, Subin, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-06-01 |
| Design and Analysis of Receiver Channels of Glass Interposer for Dual Band Wi-Fi Front End Module (FEM) Kim, Joungho; Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Kim, Minsuk; Pulugurtha Markondeya Raj; Venky Sundaram; et al, IEEE International Symposium on Electromagnetic Compatibility, IEEE International Symposium on Electromagnetic Compatibility, 2017-08-09 |
| Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Son, Kyungjune; Park, Hyunwook; Kim, Joungho; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.107 - 109, IEEE, 2018-10-15 |
| Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test Kim, Jonghoon J; Kim, Joungho; Park, Junyong; Kim, Heegon; Bae, Bumhee; Jung, Daniel H; Ha, Dongho; et al, DesignCon 2016, DesignCon 2016, 2016-01-19 |
| Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test Kim, Jonghoon J; Kim, Joungho; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Park, Junyong; et al, 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016, pp.450 - 454, Institute of Electrical and Electronics Engineers Inc, 2016-07-27 |
| Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs Son, Keeyoung; Kim, Subin; Park, Shinyoung; Park, Hyunwook; Kim, Keunwoo; Shin, Taein; Kim, Minsu; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 |
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