Calculation of surface tension and wetting properties of Sn-based solder alloys

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Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Issue Date
1999-01
Language
English
Article Type
Article
Keywords

BINARY-LIQUID ALLOYS; PHASE-DIAGRAM; SYSTEM; CU

Citation

SCRIPTA MATERIALIA, v.40, no.3, pp.297 - 302

ISSN
1359-6462
DOI
10.1016/S1359-6462(98)00417-5
URI
http://hdl.handle.net/10203/1969
Appears in Collection
MS-Journal Papers(저널논문)
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