Investigation of interfacial phenomena of alloyed Au wire bonding
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Hyoung-Joon | ko |
| dc.contributor.author | Song, Min-Seok | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.contributor.author | Moon, Jeong-Tak | ko |
| dc.contributor.author | Song, Jun-Yeob | ko |
| dc.date.accessioned | 2015-03-30T01:53:46Z | - |
| dc.date.available | 2015-03-30T01:53:46Z | - |
| dc.date.created | 2015-01-15 | - |
| dc.date.created | 2015-01-15 | - |
| dc.date.issued | 2013-12-11 | - |
| dc.identifier.citation | 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013, pp.479 - 482 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/194614 | - |
| dc.language | English | - |
| dc.publisher | 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013 | - |
| dc.title | Investigation of interfacial phenomena of alloyed Au wire bonding | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000339820800095 | - |
| dc.identifier.scopusid | 2-s2.0-84897820890 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 479 | - |
| dc.citation.endingpage | 482 | - |
| dc.citation.publicationname | 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013 | - |
| dc.identifier.conferencecountry | SI | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Kim, Hyoung-Joon | - |
| dc.contributor.nonIdAuthor | Song, Min-Seok | - |
| dc.contributor.nonIdAuthor | Moon, Jeong-Tak | - |
| dc.contributor.nonIdAuthor | Song, Jun-Yeob | - |
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