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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Journal Papers(저널논문)

Mott-Schottky analysis of passive films on Cu containing Fe-20Cr-xCu (x=0, 4) alloys

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dc.contributor.authorToor, I. H.ko
dc.contributor.authorEjaz, M.ko
dc.contributor.authorKwon, Hyuk-Sangko
dc.date.accessioned2015-03-27T08:06:24Z-
dc.date.available2015-03-27T08:06:24Z-
dc.date.created2015-01-13-
dc.date.created2015-01-13-
dc.date.issued2014-08-
dc.identifier.citationCORROSION ENGINEERING SCIENCE AND TECHNOLOGY, v.49, no.5, pp.390 - 395-
dc.identifier.issn1478-422X-
dc.identifier.urihttp://hdl.handle.net/10203/194545-
dc.description.abstractEffect of copper on the defect density of Fe-20Cr-xCu (x=0, 4) stainless steel alloys was investigated in deaerated pH 8.5 borate buffer solution at room temperature using Mott-Schottky analysis. Mott-Schottky analysis revealed that the addition of copper increased the acceptor density (N-A, V-Cr(-3)), i.e. decreased the Cr+3 content of the passive film. Also the donor densities, shallow donor (N-D1, V-cr(-3)) and deep donor (N-D2, V-Cr(+6)), of the passive films formed were increased. XPS analysis confirmed the decrease in Cr content and enrichment of copper in the passive film of Cu containing alloys, which ultimately dictated their lower corrosion resistance, i.e. decreased film protectiveness and stability.-
dc.languageEnglish-
dc.publisherMANEY PUBLISHING-
dc.subjectAUSTENITIC STAINLESS-STEEL-
dc.subjectBUFFER SOLUTION-
dc.subjectPHOTOELECTROCHEMICAL ANALYSIS-
dc.subjectSEMICONDUCTING BEHAVIOR-
dc.subjectREPASSIVATION KINETICS-
dc.subjectSCC SUSCEPTIBILITY-
dc.subjectCORROSION-
dc.subjectNICKEL-
dc.subjectIRON-
dc.subjectELECTRODES-
dc.titleMott-Schottky analysis of passive films on Cu containing Fe-20Cr-xCu (x=0, 4) alloys-
dc.typeArticle-
dc.identifier.wosid000346128400011-
dc.identifier.scopusid2-s2.0-84904760962-
dc.type.rimsART-
dc.citation.volume49-
dc.citation.issue5-
dc.citation.beginningpage390-
dc.citation.endingpage395-
dc.citation.publicationnameCORROSION ENGINEERING SCIENCE AND TECHNOLOGY-
dc.identifier.doi10.1179/1743278214Y.0000000154-
dc.contributor.localauthorKwon, Hyuk-Sang-
dc.contributor.nonIdAuthorToor, I. H.-
dc.contributor.nonIdAuthorEjaz, M.-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorFe-Cr alloys-
dc.subject.keywordAuthorCopper-
dc.subject.keywordAuthorSemiconducting properties-
dc.subject.keywordAuthorPassive films-
dc.subject.keywordAuthorMott-Schottky analysis-
dc.subject.keywordAuthorImpedance-
dc.subject.keywordAuthorStainless steel-
dc.subject.keywordAuthorXPS-
dc.subject.keywordPlusAUSTENITIC STAINLESS-STEEL-
dc.subject.keywordPlusBUFFER SOLUTION-
dc.subject.keywordPlusPHOTOELECTROCHEMICAL ANALYSIS-
dc.subject.keywordPlusSEMICONDUCTING BEHAVIOR-
dc.subject.keywordPlusREPASSIVATION KINETICS-
dc.subject.keywordPlusSCC SUSCEPTIBILITY-
dc.subject.keywordPlusCORROSION-
dc.subject.keywordPlusNICKEL-
dc.subject.keywordPlusIRON-
dc.subject.keywordPlusELECTRODES-
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