(A) study on Fine Pitch Flex-on-Flex (FOF) assembly using nanofiber/solder anisotropic conductive film (acf) and ultrasonic bonding method = 나노파이버/솔더 이방성 전도필름과 초음파 접합 공정을 이용한 미세피치 FOF 어셈블리에 대한 연구

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Advisors
Paik, Kyung-Wookresearcher백경욱
Description
한국과학기술원 : 신소재공학과,
Publisher
한국과학기술원
Issue Date
2012
Identifier
487430/325007  / 020104385
Language
eng
Description

학위논문(석사) - 한국과학기술원 : 신소재공학과, 2012.2, [ iv, 52 p. ]

Keywords

Solder; Nanofiber; Anisotropic Conductive Film (ACF); Flex-on-Flex (FOF); 나노파이버; 솔더; 이방성 전도 필름; FOF; 초음파 접합 공정; Ultrasonic bonding

URI
http://hdl.handle.net/10203/182027
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=487430&flag=dissertation
Appears in Collection
MS-Theses_Master(석사논문)
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