(A) study on Fine Pitch Flex-on-Flex (FOF) assembly using nanofiber/solder anisotropic conductive film (acf) and ultrasonic bonding method나노파이버/솔더 이방성 전도필름과 초음파 접합 공정을 이용한 미세피치 FOF 어셈블리에 대한 연구
- Advisors
- Paik, Kyung-Wookresearcher; 백경욱
- Description
- 한국과학기술원 : 신소재공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2012
- Identifier
- 487430/325007 / 020104385
- Language
- eng
- Description
학위논문(석사) - 한국과학기술원 : 신소재공학과, 2012.2, [ iv, 52 p. ]
- Keywords
Solder; Nanofiber; Anisotropic Conductive Film (ACF); Flex-on-Flex (FOF); 나노파이버; 솔더; 이방성 전도 필름; FOF; 초음파 접합 공정; Ultrasonic bonding
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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