DSpace at KOASAS: (A) Study on room temperature ultrasonic (US) bonding method for high-density Flex-On-Board assembly using anisotropic conductive films (ACFs)

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Theses_Ph.D.(박사논문)

(A) Study on room temperature ultrasonic (US) bonding method for high-density Flex-On-Board assembly using anisotropic conductive films (ACFs)이방성 전도 필름을 이용한 고밀도 Flex-On-Board 실장용 상온 초음파 접합 방법에 대한 연구

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Lee, Ki-Won / 이기원

Advisors: Paik, Kyung-Wook researcher; 백경욱

Description: 한국과학기술원 : 신소재공학과,

Publisher: 한국과학기술원

Issue Date: 2012

Identifier: 487110/325007 / 020075120

Language: eng

Description: 학위논문(박사) - 한국과학기술원 : 신소재공학과, 2012.2, [ iv, 86 p. ]

Keywords: Adhesive; Solder; Ultrasonic; Flex-On-Board; 솔더; 접착제; 초음파; 플렉스-온-보드; 접속; Interconnection

URI: http://hdl.handle.net/10203/181950

Link: http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=487110&flag=dissertation

Appears in Collection: MS-Theses_Ph.D.(박사논문)

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(A) Study on room temperature ultrasonic (US) bonding method for high-density Flex-On-Board assembly using anisotropic conductive films (ACFs)이방성 전도 필름을 이용한 고밀도 Flex-On-Board 실장용 상온 초음파 접합 방법에 대한 연구

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