(A) Study on room temperature ultrasonic (US) bonding method for high-density Flex-On-Board assembly using anisotropic conductive films (ACFs) = 이방성 전도 필름을 이용한 고밀도 Flex-On-Board 실장용 상온 초음파 접합 방법에 대한 연구

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Advisors
Paik, Kyung-Wookresearcher백경욱
Description
한국과학기술원 : 신소재공학과,
Publisher
한국과학기술원
Issue Date
2012
Identifier
487110/325007  / 020075120
Language
eng
Description

학위논문(박사) - 한국과학기술원 : 신소재공학과, 2012.2, [ iv, 86 p. ]

Keywords

Adhesive; Solder; Ultrasonic; Flex-On-Board; 솔더; 접착제; 초음파; 플렉스-온-보드; 접속; Interconnection

URI
http://hdl.handle.net/10203/181950
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=487110&flag=dissertation
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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