Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Conference
Showing results 41 to 60 of 7308
| 3D 프린팅 용 현무암섬유 강화 PLA 복합소재 필라멘트의 제조 및 특성연구 유시원; 황준연; 홍순형, 춘계복합재료학회, 한국복합재료학회, 2016-05-19 |
| 3D-TSV Vertical Interconnection Method using Cu/SnAg Double Bumps and B-stage Non-Conductive Adhesives (NCAs) Choi, Yongwon; Shin, Jiwon; Paik, Kyung-Wook, The 62nd Electronic Components and Technology Conference, ECTC, 2012-05 |
| 3D-TSV Vertical Interconnection Using Cu/SnAg Double Bumps and Non-Conductive Films (NCFs) Paik, Kyung-Wook; Choi, Yongwon; Shin, Jiwon, 2013 Pan Pacific Microelectronics Symposium, 2013 Pan Pacific Microelectronics Symposium, 2013-01-23 |
| 3rd INTERNATIONAL SYMPOSIUM ON SiAlONs AND NON-OXIDES Lee, Hyeon-Keun; Kim, Do Kyung, 3rd INTERNATIONAL SYMPOSIUM ON SiAlONs AND NON-OXIDES, Turkish Ceramic Society, 2010-06-03 |
| 3차원 세라믹 나노건축재료 기반 고경도, 고유연 하이브리드 나노 복합체 제작 및 유연보호필름 응용 배광민; 전석우, 2021 한국세라믹학회 추계학술대회, 한국세라믹학회, 2021-11-03 |
| 3차원 이산화티타늄을 이용한 전자기파 투광성 조절 전석우; 안창의; 박준용, 2013 스텔스기술 학술대회, 국방과학연구소, 2013-02-19 |
| 3차원 증착형상 예측을 위한 Computer Simulation 이원종; 권의희, 한국재료학회 춘계학술발표대회, pp.0 - 0, 2000-05-01 |
| 409L 스테인레스강 제조공정 중 안정화원소의 석출거동분석 정준호; 박중근; 이윤용; 채동철; 김태형, 대한금속·재료학회 춘계 학술대회, 대한금속·재료학회, 2008-04 |
| 475 ℃ 시효처리된 초이상 스테인리스강의 기계적 성질과 부식특성에 미치는 Mo와 W의 역할 권혁상; 박찬진, 한국부식학회 추계학술발표회, 1998 |
| 475 ℃ 시효처리와 W첨가가 이상 스테인리스강의 기계적 성질 및 부식특성에 미치는 영향 권혁상; 박찬진, 대한금속학회 춘계학술발표회, 대한금속학회, 1999 |
| 59. Effects of Hydrogen on the Dielectric and Electrical Properties of TiO2 Film 변수일, Korean Corros. Sci. Soc., pp.20 - 20, 1988 |
| 80. “Interface Faceting and Non-stationary Grain Growth in Polycrystals,” Kang, Suk-Joong L, International Workshop on Interfaces in Functional Materials: From Theory to Experiments, International Workshop on Interfaces in Functional Materials, 2006-10-10 |
| 9-12 Cr 강의 크리프 파단강도에 미치는 합금원소의 영향 Yu, Jin, pp.349 - 358, 1998-01-01 |
| A 3-D Graphene foam-mediated uniform lithium plating/stripping for stable lithium metal batteries Ponraj, Rubha; Kim, Do Kyung; Yun, Jong Hyuk; Moorthy, Brindha, ECS Prime 2020, The Electrochemical Society, 2020-10-09 |
| A 3-D Micro Porous Co-Fe-P catalyst for Oxygen and hydrogen Evolution Reaction in Alkaline Water Electrolysis KIM, HYOWON; Oh, SeKwon; Kwon, Hyuk-Sang; Cho, Eun Ae, ICE 2017, DTU Energy, 2017-06 |
| A 3-D Structured Micro-column for Efficient Gas Chromatography Qin, Caiyan; 전석우, 2021년도 대한금속재료학회 춘계학술대회, 대한금속재료학회, 2021-04-28 |
| A 3-dimensional model for step coverage by atomic layer deposition in a patterned structure Kim J.-Y.; Kim J.-H.; Ahn J.-H.; Kang S.-W., 208th Meeting of The Electrochemical Society, pp.917 -, 2005-10-16 |
| A Block Copolymer with a Huge Block-to-Block Interaction for the Significant Reduction of Line-Edge Fluctuations in Self-Assembled Patterns Kim, Jong Min; Jung, Yeon Sik, 제23회 한국 반도체 학술대회, 한국반도체학회, 2016-02-24 |
| A Combined Analysis of Moisture Diffusion with Interface Fracture Mechanics on the Interface Delamination in the Plastic IC Packages during Reflow Soldering Yu, Jin, Pro. Mat. Res. Soc., pp.31 - 36, MRS, 1998-01-01 |
| A comparative study of ENIG and Cu OSP surface finishes on the mechanical reliability of Sn-3.0Ag-0.5Cu and Sn-36.8Pb-0.4Ag solders Jee, YK; Sohn, YC; Yu, Jin; Lee, TY; Seo, HN; Kim, KH; Ahn, JH; et al, 2006 International Conference on Electronic Materials and Packaging, EMAP, pp.571 - 579, 2006-12-11 |
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