Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Conference
Showing results 5541 to 5560 of 7308
| Studies on Ni-Sn Intermetallic Compound and P-rich Ni Layer at the Electroless Nickel (NiP)-Solder Interface and Their Effects on Flip Chip Solder Joint Reliability 전영두; 백경욱, 한국 마이크로 전자 및 패키징학회 추계 기술심포지움, pp.67 - 71, 한국 마이크로 전자 및 패키징학회, 2000-11-01 |
| Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, 51st Electronic Components and Technology Conference, pp.1326 - 1332, IEEE, 2001-05-29 |
| Studies On PVA-PVDF Based Solid Polymer Blend Electrolytes Lee, Jai Young, 6th International Conference on New Energy Systems and Conversions, 2003 |
| Studies on the High Temperatute Superconductor (HTS)/Metal/Polymer Dielectric Interconnect Structure for Packaging Applications Paik, Kyung-Wook; Mogro-Campero, A; Turner, L, 44th ECTC Proceeding, pp.326 - 336, 1994-03-01 |
| Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.740 - 746, IEEE, 2002-05-28 |
| Studies on the Microvoids at the Interface of Direct Bonded Silicon Wafers Sang-Won Kang, ESC Proc. of the 1st Interanational Conf. on Semiconductor Wafer Bonding, Science, Technology and Application, pp.102 -, 1991 |
| Studies on the Surface Morphology of BCB films by Plasma Ions Paik, Kyung-Wook; Saia, RJ; Chera, JJ, Proc. Mat. Res. Soc. Symp, pp.303 - 308, 1991-03-01 |
| Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis Son H.-Y.; Kim I.; Park J.-H.; Lee S.-B.; Jung G.-J.; Park B.-J.; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.2035 - 2043, 2008-05-27 |
| Studies on thin film integral passive components for mixed mode multichip module (MCM) applications Paik, Kyung-Wook, Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology, pp.365 - 368, 1995-12-04 |
| Studies on various 2-metal chip-on-flex (COF) packaging methods Suk, KL; Kim, JS; Paik, Kyung-Wook, 60th Electronic Components and Technology Conference, ECTC 2010, pp.1125 - 1131, ECTC, 2010-06-01 |
| Study by Thermal Analysis and Atmosphere Effect of Bi-Sr-Ca-Cu-O system by Electrical Conductivity 김호기, The Korean Ceramic Society, fall meeting, Seoul Univ., 1988 |
| Study of deformation texture of equal-channel angular pressed CP-titanium Liu, SM; Chon, SH; Park, Joong Keun, 5th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2006, pp.3466 - 3471, 123, 2006-07-04 |
| Study of drop-performance improved lead-free solder by PCB pad finish Lee, YW; Lee, JH; Moon, JT; Park, YS; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.668 - 672, 2009-12-09 |
| Study of Effects of Ammonia for Synthesis of Nano-sized BaTiO3 Powders via X-ray Photoelectron Spectroscopy 문산; 이현욱; 김도경, 2011년 한국세라믹학회 춘계총회 및 연구발표회, 한국세라믹학회, 2011-04-21 |
| Study of Effects of Ethylene Glycol for Growth of One-dimensional BaTiO3 Nanoparticles Prepared by Hydrothermal Reaction 박영태; 왕지은; 백창연; 김도경, 2017년 한국세라믹학회 춘계학술대회 및 총회, 한국세라믹학회, 2017-04-21 |
| Study of factors associated with biaxial texturing of cu tapes for ybco coated conductors No, Kwangsoo; Kim, YH; Sung, TH; Han, SC; Han, YH; Jeong, NH; Kim, CJ, ISS 2006, v.0, no.0, pp.0 - 0, ISS 2006, 2006-11-01 |
| Study of Growth Mechanism of doped Graphene on SiC Substrate using XeCl Excimer Laser Choi, Insung; Jung, Dae Yool; Choi, Sung-Yool; Lee, KeonJae, 2013 MRS Fall Meeting & Exhibit, Materials Research Society, 2013-12-05 |
| Study of Magnetic Microstructure of L10 FePt Epitaxial thin film Grown on MgO Substrate using Electron Holography 이완희; 유정호; 양준모; 박중근, 2013 대한금속재료학회 춘계학술대회, 대한금속재료학회, 2013-04-26 |
| Study of Mechanism and Real Time Simulation of Ammonia (NH3) Nitridation with a DFT Calculation and a KMC Simulation Yeo, Sang Chul; Lee, Hyuck Mo, 2014 TMS annual meeting (143rd), The Minerals, Metals & Materials Society, 2014-02-18 |
| Study of spalling behavior of Intel-metallic compounds during the reaction between electroless Ni-P metallization and lead-free solders Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, 2004 Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.75 - 81, 2004-06-01 |
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