Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Conference
Showing results 3161 to 3180 of 7308
| High Precision Embedded Capacitor Films for Build-Up Substrates Applications 백경욱, 한국 마이크로 전자 및 패키징학회 2002년도 SMT PCB 기술세미나, pp.65 - 99, 한국 마이크로 전자 및 패키징학회, 2002-03 |
| High Productivity and Damage-free Ultrasonic Anisotropic Conductive Film (ACF) Bonding for Touch Screen Panel (TSP) Assemblies Kim, Seung-Ho; Kim, Young-Jae; Park, Ho Joon; Paik, Kyung-Wook, The 62nd Electronic Components and Technology Conference, IEEE, 2012-05 |
| High pulling rate defect-free crystals with axially asymmetric characteristics due to controlled melt convection Cho, HJ; Lee, BY; Lee, SH; Lee, Jeong Yong, High Purity Silicon 9 - 210th Electrochemical Society Meeting, pp.31 - 39, 2006-10-29 |
| High rate carbon coated LiNi0.5Mn1.5O4 as a positive electrode for Li-ion batteries Nisar, Umair; Jung, Young Hwa; Moon, San; Kim, Do Kyung, 2012년 한국전지학회 추계학술대회, 한국전지학회, 2012-10-19 |
| High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications Yim, MJ; Hwang, JS; Kwon, WS; Jang, KW; Paik, Kyung-Wook, 2002 Electronic Components & Technology Conference , pp.1385 - 1389, 2002 Electronic Components & Technology Conference, 2002-05-28 |
| High Reliable Nong-Conductive Adhesives for Flip Chip Interconnections Kwon, WS; Jang, KW; Paik, Kyung-Wook, 3rd International Symposium on Electronic Materials and Packagings 2001, pp.34 - 38, 2001-11 |
| High Resolution Transmission Electron Microscopy of Partial States of Oxygen Order in YBa2CuO7-x Ahn, Byung Tae, MRS Symposium Proc., 183, pp.369 - 374, 1990 |
| High speed touch screen panels (TSPs) assembly using anisotropic conductive adhesives (ACAs) vertical ultrasonic bonding method Kim, SH; Lee, K; Paik, Kyung-Wook, 60th Electronic Components and Technology Conference, ECTC 2010, pp.1964 - 1967, ECTC, 2010-06-01 |
| High Strain Rate Superplasticity in 2124 Al Alloy and SiC Reinforced 2124 Al Composite Hong, Soon-Hyung, pp.333 - 338, 2000-01-01 |
| High Strain Rate Superplasticity in SiCw/2024Al Metal Matrix Composite Hong, Soon-Hyung, pp.989 - 996, 1993-01-01 |
| High Strain-Rate Deformation Behavior of NiAl/Ni Micro-Laminated Composites Hong, Soon Hyung; Kim, HY; Kim, JY; Jeong, DS; Enoki, M, The Korean Society for Composite Materials, pp.237 - 240, 복합재료학회, 2004 |
| High Strength and Thermal Conductivity of Low Temperature Sintered Aluminum Nitride Ceramics with CaZrO3 Additive Lee, Hyun Min; Kim, Do-Kyung, Materials Science & Technology 2013, The Ameican Ceramic Society, Association for iron & steel, The Materials Information Society, The Minerals, Metals & Materials Society, 2013-10-28 |
| High Strength of Low Temperature Sintered Aluminum Nitride Ceramics via Grain Boundary Pinning Effect 이현민; 김도경, 2013년 한국세라믹학회 추계총회 및 연구발표회, 한국세라믹학회, 2013-10-17 |
| High Strength with High Thermal Conductivity AlN Ceramics by Low Temperature Sintering Lee, Hyun Min; Lee, Ji Seoc; Kim, Do Kyung, 7th International Symposium on Nitrides, Sciences Chimiques de Rennes, 2012-06 |
| High Temperature Characteristics of Si3N4/BN Fibrous Monolithic Ceramics Kim, Do Kyung, Annual Cocoa Beach Conference and Exposition, pp.481 - 486, 1997 |
| High Temperature Creep Behavior of Discontinuously Reinforced SiC/2124Al Metal Matrix Composites Hong, Soon Hyung, Fall Meeting of the Korean Society for Composite Materials, 한국복합재료학회, 1998-01-01 |
| High Temperature Deformation Behavior and Flow Softening Mechanism of TiAl Intermetallic Compound Hong, Soon Hyung, 151, 1998-01-01 |
| High Temperature Deformation Behavior of Mechanically Alloyed Al-10Ti-xSi Alloy. Park, Joong Keun; Frose, F.H.; Chellman, D.J.; Cho, S.S., '97 TMS annual meeting, pp.93 - 100, TMS Annual Meeting, 1997-02 |
| High Temperature Deformation Behavior of SiCp/2124Al Metal Matrix Composites Hong, Soon Hyung, 한국복합재료학회 2002년도 춘계학술발표대회, pp.69 - 72, 한국복합재료학회, 2002-01-01 |
| High Temperature Deformation Behavior of Ti-47Al-2Cr-4nb Intermetallic Compound Hong, Soon-Hyung, , 1995-01-01 |
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