Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Article
Showing results 5921 to 5940 of 7205
| Studies of electroless nickel under bump metallurgy-solder interfacial reactions and their effects on flip chip solder joint reliability Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.520 - 528, 2002-05 |
| Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability Jeon, Young Doo; Paik, Kyung Wook; Bok, Kyoung Soon; Choi, Woo Suk; Cho, Chul Lae, Journal of Electronic Materials v.31 n.5, 520-528, 2000-01 |
| Studies of Superconducting Oxides with a Solid-State Ionic Technique Ahn, Byung Tae; Gur, TM; Huggins, RA; Beyers, R; Engler, EM; Grant, PM; Parkin, SSP; et al, PHYSICA C, v.153, pp.590 - 593, 1989-01 |
| Studies on Cu2ZnSnS4 (CZTS) absorber layer using different stacking orders in precursor thin films Shin, Seung Wook; Pawar, S. M.; Park, Chan Young; Yun, Jae Ho; Moon, Jong-Ha; Kim, Jin Hyeok; Lee, JeongYong, SOLAR ENERGY MATERIALS AND SOLAR CELLS, v.95, no.12, pp.3202 - 3206, 2011-12 |
| STUDIES ON METAL BENZOCYCLOBUTENE (BCB) INTERFACE AND ADHESION Paik, Kyung-Wook; Cole, Herbert S; Saia, Richard J; Chera, John J, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.7, no.5, pp.403 - 415, 1993 |
| Studies on Microvoids at the Interface of Direct Bonded Silicon Wafers Yun, Sun-Jin; Ahn, Kun-Young; Yi, Kyoung-Soo; Kang, Sang-Won, Journal of The Electrochemical Society, 139(8), 2326-2330, 1992-08 |
| STUDIES ON MICROVOIDS AT THE INTERFACE OF DIRECT BONDED SILICON-WAFERS Yun, Sun-Jin; Ahn, Kun-Young; Yi, Kyoung-Soo; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.139, no.8, pp.2326 - 2330, 1992-08 |
| Studies on the Controlling of the Microstructural and Morphological Properties of Al Doped ZnO Thin Films Prepared by Hydrothermal Method Gang, Myeng Gil; Shin, Seung Wook; Gurav, K. V.; Wang, YinBo; Agawane, G. L.; Lee, JeongYong; Moon, Jong-Ha; et al, JAPANESE JOURNAL OF APPLIED PHYSICS, v.52, no.10, 2013-10 |
| STUDIES ON THE HIGH-TEMPERATURE SUPERCONDUCTOR (HTS)/METAL/POLYMER DIELECTRIC INTERCONNECT STRUCTURE FOR PACKAGING APPLICATIONS Paik, Kyung-Wook; Mogrocampero, A, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, v.17, no.3, pp.435 - 441, 1994-08 |
| Studies on the Polymer Adhesive Wafer Bonding Method Using Photo-Patternable Materials for MEMS Motion Sensors Applications Kim, Jong-Hyun; Kim, Il; Choi, Yong-Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.7, pp.1118 - 1127, 2012-07 |
| Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) with an Embedded Die Yu, Seon-Young; Kwon, Yong-Min; Kim, Jin-Su; Jeong, Tae-Sung; Choi, Seog-Moon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.4, pp.625 - 633, 2012-04 |
| Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs) Suk, Kyoung-Lim; Choo, Kyo-Sung; Kim, Sung-Jin; Kim, Jong-Soo; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1182 - 1188, 2012-06 |
| Study of Band Structure at the Zn(S,O,OH)/Cu(In,Ga)Se-2 Interface via Rapid Thermal Annealing and Their Effect on the Photovoltaic Properties Shin, Dong Hyeop; Kim, Seung Tae; Kim, Ji Hye; Kang, Hee Jae; Ahn, Byung Tae; Kwon, Hyuk-Sang, ACS APPLIED MATERIALS & INTERFACES, v.5, no.24, pp.12921 - 12927, 2013-12 |
| A Study of Cu Metal Deposition on Amorphous Si Film from Cu solution for Low-Temperature Crystallization of Amorphous Si Films Sohn, Dong-Hyun; Lee, Jeong No; Kang, Sang-Won; Ahn, Byung Tae, Journal of The Electrochemical Society, vol.144, no.10, pp.3592-3596, 1997-07-01 |
| Study of deformation texture of equal-channel angular pressed CP-titanium Liu, S.M.; Chon, S.H.; Park, Joong Keun, MATERIALS SCIENCE FORUM, v.539-543, no.PART 4, pp.3466 - 3471, 2007-05 |
| Study of deformation-induced phase transformation in plain low carbon steel at low strain rate Chung, Jun-Ho; Park, Joong-Keun; Kim, Tae-Hyung; Kim, K. H.; Ok, S. Y., MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.527, no.20, pp.5072 - 5077, 2010-07 |
| Study of domain stability on (Pb0.76Ca0.24)TiO3 thin films using piezoresponse microscopy Guo, HY; Xu, JB; Wilson, IH; Xie, Z; Luo, EZ; Hong, SB; Yan, H, APPLIED PHYSICS LETTERS, v.81, no.4, pp.715 - 717, 2002-07 |
| Study of Interaction between Incident Silicon and Germanium Fluxes and SiO2 Layer Using Solid-Source Molecular Beam Epitaxy Yun, Sun-Jin; Lee, Seung-Chang; Kim, Bo-Woo; Kang, Sang-Won, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, v.12, no.2, pp.1167 - 1169, 1994-03 |
| Study of orientation effect on nanoscale polarization in BaTiO3 thin films using piezoresponse force microscopy Kim, Il-Doo; Avrahami, Y; Tuller, HL; Park, YB; Dicken, MJ; Atwater, HA, APPLIED PHYSICS LETTERS, v.86, no.19, 2005-05 |
| Study of relaxor behavior in a lead-free (Na0.5Bi0.5)TiO3-SrTiO3-BaTiO3 ternary solid solution system Praharaj, S; Rout, D; Subramanian, V; Kang, Suk-Joong L, CERAMICS INTERNATIONAL, v.42, no.11, pp.12663 - 12671, 2016-08 |
Discover
Open Access
Date issued
- 2,028 2020 - 2024
- 6,675 2010 - 2019
- 5,357 2000 - 2009
- 3,582 1990 - 1999
- 982 1980 - 1989