Showing results 14801 to 14820 of 19220
The Electrode Characteristics of Ti-Zr-V-Mn-Ni Metal Hydride Alloy Lee, Jai Young, Gordon Research Conf. on Hydrogen-Metal System, 1995 |
The Electrode Characterstics of Ti1.0Mn1.0V0.5 Alloy with Surface Modifications Lee, Jai Young, The 3rd Korean-Japan Joint Symposium '95 Hydrogen Energy, 1995 |
The electronic energy loss of 100 keV heavy ions in medium energy ion scattering analysis of a Ta2O5 ultrathin film Moon, DW; Kim, HK; Kim, YP; Ha, YH; Choi, Si-Kyung; Kim, Sehun, NUCLEAR INSTRUMENTS METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, v.125, no.1-4, pp.120 - 123, 1997-04 |
The electronic structure and band gap of LiFePO4 and LiMnPO4 Zhou F; Kang KS; Maxisch T; Ceder G; Morgan D, SOLID STATE COMMUNICATIONS, v.132, no.3-4, pp.181 - 186, 2004-10 |
The electronic structures for the optical absorption of Hf-O-N thin films Kim, Sung Kwan; Kim, Yang-Soo; Jeon, Young-Ah; Choi, Jongwan; No, Kwangsoo, JOURNAL OF ELECTROCERAMICS, v.17, no.2-4, pp.197 - 203, 2006-12 |
The electronic structures of epitaxial CrSi2 film prepared on Si(111) substrate Kim, KH; Kang, JS; Choi, CK; Lee, JeongYong; Olson, CG, APPLIED SURFACE SCIENCE, v.150, no.1-4, pp.8 - 12, 1999-08 |
The encapsulation of an organic light-emitting diode using organic-inorganic hybrid materials and MgO Han, Yun-Cheol; Jang, Cheol; Kim, Kuk-Joo; Choi, Kyung-Cheol; Jung, Kyung-Ho; Bae, Byeong-Soo, ORGANIC ELECTRONICS, v.12, no.4, pp.609 - 613, 2011-04 |
The Enhanced Photocurrent of Organic Photovoltaics with Doped Carbon Nanotubes Kim, Sang Ouk, 2010 MRS Spring Meeting, Materials Research Society, 2010-04-05 |
The estimation of the crystalline behavior and electrical property of nominal-composition Ge2Sb2Te5 thin films for phase change random access memory Choi, Si-Kyung; Kim, HJ, 2005 GIST/KAIST/Kyoto University/Tohoku University Joint Symposium on Advanced Materials, 2005 |
THE EVOLUTION OF INTERFACE MICROSTRUCTURES IN A ZRO2/AG-CU-AL-TI SYSTEM Lee, Young Min; Yu, Jin, SCRIPTA METALLURGICA ET MATERIALIA, v.29, no.3, pp.371 - 376, 1993-08 |
The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu solders during high temperature aging Seo, Sun-Kyoung; Kang, Sung K.; Shih, Da-Yuan; Lee, HyuckMo, MICROELECTRONICS RELIABILITY, v.49, no.3, pp.288 - 295, 2009-03 |
The experimental and theoretical approaches of contraction stress build-up of anisotropic conductive adhesives for flip chip interconnection Kwon, WS; Yang, SY; Lee, Soon-Bok; Paik, Kyung-Wook, 55th Electronic Components and Technology Conference, ECTC, pp.1468 - 1474, IEEE, 2005-05-31 |
The Fabrication of CdS/Cu(In1-x,Gax)3Se5 Solar Cells with Ordered Vacancy Compound Ahn, Byung Tae, IUMRS-ICA-2006, 2006-09-01 |
The fabrication of poly-Si plate by vacuum casting and the reaction with mold 이진형, 한국주조공학회, 2000 |
The Fabrication of the ZrO2 Thin Film by Chemical Vapor Deposition and the Effect of the Reaction Parameters on the Deposition Characteristics J.H. Choi; H.G. Kim, 요업학회지, v.28, no.1, pp.1 - 10, 1991 |
The fabrication of thin film cathode for solid-state microbattery by sol-gel method Kim, Ho Gi; Kim M.-K., ASIAN CERAMIC SCIENCE FOR ELECTRONICS I, v.214-2, pp.209 - 214, 2002 |
The fabrication process and mechanical properties of SiCp/Al-Si metal matrix composites for automobile air-conditioner compressor pistons Lee, HS; Yeo, JS; Hong, Soon-Hyung; Yoon, DJ; Na, KH, 5th Asia Pacific Conference on Materials Processing, v.113, no.40546, pp.202 - 208, 2001-06-25 |
The fabrication process and mechanical properties of SiCp/Al-Si metal matrix composites for automobile air-conditioner compressor pistons Lee, HS; Yeo, JS; Hong, Soon-Hyung; Yoon, DJ; Na, KH, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.113, no.1-3, pp.202 - 208, 2001-06 |
The Fabrication Process, Microstructures, and Mechanical Properties of Alumina Fabricated from Amorphous Powders by Spark Plasma Sintering(SPS) Process Hong, Soon-Hyung; Lee, KT; Cha, SI; Kim, KT, International Symposium on Powder Materials and Processing, pp.86 -, 2004 |
The finite element analysis of internal stresses during sequential build-up of lamination-based thick-film multilayer substrates Kim, JS; Paik, Kyung-Wook; Kim, BK; Lim, JH, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.11, no.1, pp.45 - 56, 2000-02 |
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