Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Title
Showing results 1461 to 1480 of 19214
| Analytical approach to evaluate shear stress in flip chip interconnection using NCA/ACF Yang, SY; Kwon, WS; Lee, SB; Paik Kyung-Wook, 5th International Symposium on Electronic Materials and Packagings 2003, 2003-11 |
| Analytical Characterization of Al Matrix Composites Reinforced with 3D Orthogonal Carbon Textile Preforms Hong, Soon-Hyung, 3rd Japan-Korea Joint Symposium on Composite Materials, pp.15 - 16, 2002-10-01 |
| Analytical Characterization of Carbon Fiber Textile Reinforced Al Matrix Composites Hong, Soon Hyung, pp.71 - 74, 2002-11-01 |
| Analytical Model for Thermal Expansion Coefficients of Plain Woven Fabric Composites Hong, Soon-Hyung; Lee, SK; Byun, JH, Proceeding of the 3rd International Symposium on Textile Composites in Building Construction, pp.177 - 186, 1996 |
| Analytical Model for Thermal Expansion Composites in Building Construction Hong, Soon-Hyung, 177, 1996-01-01 |
| Analytical Modeling of IGZO Thin-Film Transistors Based on the Exponential Distribution of Deep and Tail States Shin, Jae-Heon; Hwang, Chi-Sun; Cheong, Woo-Seok; Park, Sang-Hee Ko; Cho, Doo-Hee; Ryu, Minki; Yoon, Sung-Min; et al, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.54, no.1, pp.527 - 530, 2009-01 |
| Analytical modeling to calculate the hardness of ultra-fine WC-Co cemented carbides Cha, Seung I; Lee, Kyong Ho; Ryu, Ho Jin; Hong, Soon-Hyung, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.489, no.1-2, pp.234 - 244, 2008-08 |
| Analytical study on the 3D-printed structure and mechanical properties of basalt fiber-reinforced PLA composites using X-ray microscopy Yu, Siwon; Hwang, Yun Hyeong; Hwang, Jun Yeon; Hong, Soon Hyung, COMPOSITES SCIENCE AND TECHNOLOGY, v.175, pp.18 - 27, 2019-05 |
| Analytical Transmission Electron Microscopy Study on the Oxygen Defect Formation of Ti Oxide Thin Films Sandwiched between Al Electrodes Lee, Jeong Yong, 2007 Materials Research Society Spring Meeting, 2007-04-09 |
| Anisotropic Conductive Adhesives Flip Chip Technology Paik, Kyung-Wook, Asymtek & Tsinghua University Workshop, pp.0 - 0, 2001-05-01 |
| Anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and method of connecting electronic parts using the same Paik, Kyung-Wook; Park, Jae-Hyeong |
| Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications Yim, MJ; Kim, HJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.1165 - 1171, 2005-08 |
| Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications Yim, MJ; Hwang, JS; Kim, JG; Kim, HJ; Kwon, W; Jang, KW; Paik, Kyung-Wook, Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.159 - 164, IEEE, 2004-06-01 |
| Anisotropic conductive film (ACF) interconnection for display packaging applications Yim, Myung-Jin; Paik, Kyung-Wook; Kim, Tae-Sung; Kim, Yang-Kook, Proceedings of the 1998 48th Electronic Components & Technology Conference, pp.1036 - 1041, Electronic Components & Technology Conference, 1998-05-25 |
| Anisotropic Conductive Film and Method of Fabricating the same for Ultra-Fine Pitch COG Application Paik, Kyung-Wook; Yim, Myung-Jin, 2003-04-04 |
| Anisotropic Conductive Film for Fine Pitch COG (Chip-on-Glass) Technology Application Yim, MJ; Kwon, WS; Paik, Kyung-Wook, The 5th Korea-Japan International Symposium on Liquid Crystalline Materials and Devices, pp.64 - 65, 2001-05-01 |
| Anisotropic Conductive Films (ACFs) for ultra-fine Pitch Chip-On-Glass (COG) applications Yim, MJ; Hwang, J; Paik, Kyung-Wook, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.181 - 186, 2005-03-16 |
| Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications Yim, MJ; Hwang, J; Paik, Kyung-Wook, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.27, pp.77 - 84, 2007-01 |
| Anisotropic Conductive Films with Area-arrayed Conducting Microbumps Paik, Kyung-Wook, International Conference on Electronic Materials, pp.139 - 139, 1998-03-01 |
| Anisotropic dielectric metamaterial slab as a single-material large-acceptance-angle anti-reflection layer for high-temperature applications Seo, Ilsung; Kim, Hyowook; Shin, Jonghwa, 9th International Congress on Advanced Electromagnetic Materials in Microwaves and Optics, METAMATERIALS 2015, pp.484 - 486, Institute of Electrical and Electronics Engineers Inc., 2015-09 |
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