Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Pan, Yan
Showing results 3 to 4 of 4
| Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly Kim, Tae-Wan; Lee, Tae-Ik; Pan, Yan; Kim, Wansun; Zhang, Shuye; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.9, 2016-09 |
| Interface Adhesion Effect of Anchoring Polymer Layer Anisotropic Conductive Films on the Bending Reliability for Ultra-fine Pitch Wearable Chip-on-Flex Packages Pan, Yan; Peng, Xiaohui; Zhu, Pengli; Sun, Rong; Paik, Kyung-Wook, 23rd International Conference on Electronic Packaging Technology, ICEPT 2022, Institute of Electrical and Electronics Engineers Inc., 2022-08 |
Discover
Open Access
Date issued
- 2,030 2020 - 2024
- 6,675 2010 - 2019
- 5,357 2000 - 2009
- 3,582 1990 - 1999
- 982 1980 - 1989