Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Pan, Yan

Showing results 1 to 4 of 4

1
A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films

Pan, Yan; Oh, Seung-Jin; Kim, Ji-Hye; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.6, pp.941 - 948, 2020-06

2
(A) study on the 50μm Fine Pitch Flex-on-Flex (FOF) assembly using conventional and nanofiber Anisotropic Conductive Films (ACFs) = 기존 및 나노파이버 이방성 전도필름을 이용한 50 μm 미세피치 Flex-on-Lex 접합에 대한 연구link

Pan, Yan; Paik, Kyoung-Wook; et al, 한국과학기술원, 2017

3
Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly

Kim, Tae-Wan; Lee, Tae-Ik; Pan, Yan; Kim, Wansun; Zhang, Shuye; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.9, 2016-09

4
Interface Adhesion Effect of Anchoring Polymer Layer Anisotropic Conductive Films on the Bending Reliability for Ultra-fine Pitch Wearable Chip-on-Flex Packages

Pan, Yan; Peng, Xiaohui; Zhu, Pengli; Sun, Rong; Paik, Kyung-Wook, 23rd International Conference on Electronic Packaging Technology, ICEPT 2022, Institute of Electrical and Electronics Engineers Inc., 2022-08

rss_1.0 rss_2.0 atom_1.0