Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author 1052
Showing results 76 to 135 of 151
| LCD 패키징용 이방성 도전필름의 경화거동과 전기전도에 관한 연구 백경욱; 임명진; 김태성; 김도현, 한국재료학회 추계학술대회, pp.0 - 0, 한국재료학회, 1997-10-01 |
| Low temperature oxidation of Cu-base leadframe and Cu/EMC interface adhesion Cho, Soon-Jin; Paik, Kyung-Wook, Proceedings of the 1996 MRS Fall Symposium, v.445, pp.275 - 280, Materials Research Society, 1996-12-03 |
| Low temperature processing for integrated magnetics Lok, BK; Paik, Kyung-Wook; Wai, LL; Fan, W; Lu, ACW; Pramoda, KP, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0 - 0, 2007-11-19 |
| Low Tolerance Epoxy/BaTiO3 Composite Embedded Capacitor Films(ECFs) Paik, Kyung-Wook; Cho, SD; Lee, JY; Hyun, JG, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2002, pp.341 - 347, 2002-12 |
| Low-Cost & High-Reliability MCM-D Substrate Unit Process Development Paik, Kyung-Wook, International Conference on Electronic Materials, pp.96 - 96, 1998-03-01 |
| Microwave characterization and comparison of adhesive flip chip interconnects Kwon, WS; Jeon, YD; Lee, JH; Nah, JW; Yim, MJ; Paik, Kyung-Wook, Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.273 - 278, 2001-07-08 |
| Microwave Modeling and Characterization of Anisotropic conductive Adhesive Flip-Chip Interconnection 김정호; 백경욱, 제6회 한국반도체 학술대회, pp.621 - 622, 한국반도체 학술대회, 1999-02 |
| Multi-functional epoxy/SrTiO3 ceramic powder Embedded Capacitor Films(ECFs) for organic substrates Lee, S; Hyun, JG; Chung, CK; Paik, Kyung-Wook, 2006 8th Electronics Packaging Technology Conference, EPTC, pp.549 - 552, 2006-12-06 |
| Nanofiber Anisotropic Conductive Adhesives (Nanofiber ACAs) for next generation display electronics Suk, Kyung-Kim; Paik, Kyung-Wook, 10th Nano Korea Symposium, 10th Nano Korea Symposium, 2012-08-16 |
| Nanofiber Anisotropic Conductive Film (ACF) Containing Insulated Conductive Particle (ICP) for Improving Insulation Property of Fine Pitch Chip-on-Glass (COG) Assembly Lee, Sang Hoon; Suk, Kyoung-Lim; Paik, Kyung-Wook, EMAP 2013 (15th International Conference on Electronic Materials and Packaging), EMAP 2013 (15th International Conference on Electronic Materials and Packaging), 2013-10-06 |
| Nanofiber Incorporated Anisotropic Conductive Adhesives (ACAs) for Fine Pitch Electronic Packaging Applications Suk, Kyoung-Lim; Paik, Kyung-Wook, Electrospin 2012, 2012-05 |
| Novel 3-Dimensional Memory Stack Package Using Polymer Insulated Sidewall Paik, Kyung-Wook, International Conference on Electronic Materials, pp.97 - 97, 1998-03-01 |
| Novel Anistropic Conductive Adhesives Flip Chip on Organic Substrates For High Frequency Applications Paik, Kyung-Wook; Yim, MJ; Kwon,WS, Proceeding of 2001 Korea-Japan Joint Workshop on Advanced semiconductor Processes and Equipments, pp.0 - 0, 2001-05-01 |
| Novel epoxy/BaTiO3 composite embedded capacitor films embedded in organic substrates Paik, Kyung-Wook; Cho, S; Hyun, JG, Proceedings of 2004 International IEEE Conference on Asian Green Electronics (AGEC), pp.68 - 73, 2004-01-05 |
| Novel Nanofiber Anisotropic Conductive Films (ACFs) for Ultra Fine Pitch Electronic Package Application Suk, Kyoung-Lim; Paik, Kyung-Wook, Nano Korea Symposium, 2011-08 |
| Novel Nanofiber Anisotropic Conductive Films (ACFs) with coupled conductive particles for Ultra Fine Pitch Electronic Packaging Applications Suk, Kyoung-Lim; Paik, Kyung-Wook, TechConnect World presents Nanotech 2011, 2011-06 |
| Novel Wafer Level Packages Using Anisotropic Conductive Pastes (ACPs) and NCPs Paik, Kyung-Wook; Kim, Il; Son, Ho-Young; Chung, Chang-Kyu, Novel Wafer Level Packages Using Anisotropic Conductive Pastes (ACPs) and NCPs, pp.0 - 0, 2008 |
| Oxygen Reactive Ion Beam Etching on Polyimide to Enhance Copper Film Adhesion Paik, Kyung-Wook, Proc. Mat. Res. Soc. Symp, pp.271 - 276, 1988-03-01 |
| Patterning of wafer level applied non-conductive adhesives (NCAs) for camera image sensor (CIS) modules Kim, I; Son, HY; Paik, Kyung-Wook, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.1806 - 1810, 2009-05-26 |
| PCB pads 솔더 범프 형성 기술에 관한 연구 나재웅; 손호영; 김형준; 백경욱; 이금로; 허귀록, The Microelectronics and Packaging Society, IMAPS-Korea Workshop 2001, pp.79 - 79, The Microelectronics and Packaging Society, 2001-10-26 |
| Pd-Free Bumping Technology and UBM (Under Bump Metallurgy) Jang, SY; Paik, Kyung-Wook; Wolf, J; Reichl, H, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001, pp.121 - 128, 2001-11-01 |
| PWB 기판용 Embedded Capacitor 필름 제작에 관한 연구(Study on the Fabrication of Embedded Capacitor Films for PWB substrate) 이주연; 조성동; 백경욱, 한국 마이크로 전자 및 패키징 학회 2001년도 추계 기술심포지움, pp.21 - 28, 한국 마이크로 전자 및 패키징 학회, 2001-11-09 |
| RBS Studies on Ti, Ni and Zr Diffusion in Polyimide Paik, Kyung-Wook, Proc. Mat. Res. Soc. Symp, pp.143 - 148, 1989-02-01 |
| Reliability enhancement of embedded capacitors in printed circuit boards using b-stage epoxy/batio3 composite embedded capacitor films (ECFS) Lee, S; Jang, JM; Lee, WS; Paik, Kyung-Wook, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.771 - 776, 2009-05-26 |
| Reliability Studies on GE High Density Interconnect(HDI) Modules Paik, Kyung-Wook, Proc. Mat. Res. Soc. Symp, pp.71 - 76, MRS, 1994-03-01 |
| Reliable Anisotropic Conductive Adhesives Flip Chip Technology on Organic Substrates for High Frequency Applications Paik, Kyung-Wook; Yim, MJ; Kwon, WS, The 6th International Symposium on Microelectronics and Packaging, pp.0 - 0, 2001-04-01 |
| Solder Droplet Jetting 방법을 이용한 Pb/63Sn 솔더 범프의 형성에 관한 연구 손호영; 백경욱, 한국 마이크로 전자 및 패키징 학회 2003년도 추계 기술심포지움, pp.122 - 127, 한국 마이크로 전자 및 패키징 학회, 2003-11 |
| Solder Reflow Process Induced Residual Warpage Measurement and Its Influence on Reliability of Flip-Chip Electronic Packages 백경욱; 양세영; 전영두; 이순복, 한국 마이크로 전자 및 패키징 학회 2004년도 추계기술 심포지움, pp.0 - 0, 한국 마이크로 전자 및 패키징 학회, 2004-11-12 |
| Studies of PQ-100(TM) Polyquinoline Film for Multichip Module(MCM) Applications Paik, Kyung-Wook; Cole, HS; Hendricks, NH, 1992 MRS Spring Meeting, pp.161 - 166, MRS, 1992-03-01 |
| Studies on double-layered metal bumps for fine pitch flip chip applications Son, HY; Yeo, YW; Jung, GJ; Lee, JK; Choi, JY; Park, CJ; Suh, MS; et al, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.95 - 100, 2005-12-11 |
| Studies on Ni-Sn Intermetallic Compound and P-rich Ni Layer at the Electroless Nickel (NiP)-Solder Interface and Their Effects on Flip Chip Solder Joint Reliability 전영두; 백경욱, 한국 마이크로 전자 및 패키징학회 추계 기술심포지움, pp.67 - 71, 한국 마이크로 전자 및 패키징학회, 2000-11-01 |
| Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, 51st Electronic Components and Technology Conference, pp.1326 - 1332, IEEE, 2001-05-29 |
| Studies on the High Temperatute Superconductor (HTS)/Metal/Polymer Dielectric Interconnect Structure for Packaging Applications Paik, Kyung-Wook; Mogro-Campero, A; Turner, L, 44th ECTC Proceeding, pp.326 - 336, 1994-03-01 |
| Studies on the Surface Morphology of BCB films by Plasma Ions Paik, Kyung-Wook; Saia, RJ; Chera, JJ, Proc. Mat. Res. Soc. Symp, pp.303 - 308, 1991-03-01 |
| Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis Son H.-Y.; Kim I.; Park J.-H.; Lee S.-B.; Jung G.-J.; Park B.-J.; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.2035 - 2043, 2008-05-27 |
| Studies on thin film integral passive components for mixed mode multichip module (MCM) applications Paik, Kyung-Wook, Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology, pp.365 - 368, 1995-12-04 |
| Study of drop-performance improved lead-free solder by PCB pad finish Lee, YW; Lee, JH; Moon, JT; Park, YS; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.668 - 672, 2009-12-09 |
| Study on Coined Solder Bumps on PCB Pads Paik, Kyung-Wook; Nah, JW; Kim, WH; Hur, KR, Proceedings of the 7th Pan Pacific Microelectronics Symposium, pp.79 - 85, 2002-02 |
| Study on the properties of Epoxy/BaTiO3 Composite Embedded Capacitor Films for Organic Substrate Cho, SD; Hyun, JG; Paik, Kyung-Wook, 5th International Conference on Electronic Materials and Packaging, pp.20 - 26, 2003-11 |
| Study on the reactive ion etching for via opening in multi-layer MCM-D substrate fabrication processes 백경욱, 한국재료학회 추계학술대회, pp.13 - 13, 한국재료학회, 1998-11-01 |
| Study on the Under Bump Metallutgy(UBM) for electro-plated Eutectic Pb/Sn Soder Bumps on Organic Substrates Paik, Kyung-Wook; Jang, SY, Pan Pacific Microelectronics Symposium, pp.173 - 179, 1999-02-01 |
| Study on thermal cycling reliability and delamination of anisotropic conductives adhesives flip chip on organic substrates with emphasis on the thermal deformation Kwon, WS; Paik, Kyung-Wook, 3rd International IEEE Conference on Polymers and Adhesives In Microelectronics and Photonics, 2003-10 |
| Surface Morphological Changes of PI with Oxygen Reactive Ion Beam Etching(RIBE) Paik, Kyung-Wook, Proc. Mat. Res. Soc. Symp, pp.495 - 500, 1989-01-01 |
| The Effect of Alumina powder filled Polyimide Adhesive on the Thermo-Mechanical Stress of Lead-On-Chip Package Paik, Kyung-Wook, 3rd Pan Pacific Microelectronics Sym., pp.429 - 434, 1998-02-01 |
| The Effect of Cu leadframe oxidation on Cu/EMC adhesion Paik, Kyung-Wook, The 3rd VLSI Packaging Workshop of Japan, pp.57 - 58, 1996-12-01 |
| The Effect of Cu-base Leadframe Oxidation on the Cu/EMC Adhesion Paik, Kyung-Wook, 2nd Pan Pacific Microelectronics Symposium, pp.233 - 239, 1997-02-01 |
| Thermo-Mechanical Stress Analysis of Lamination Based MCM-D Substrate 백경욱, 제6회 한국반도체 학술대회, pp.269 - 272, 한국반도체 학술대회, 1999-02-01 |
| Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates Paik, KW; Kim, JS; Oh, SH; Seo, HS, 제5회 한국반도체 학술대회, pp.587 - 588, 한국반도체 학술대회, 1998-02-01 |
| Thermo-Mechanical Stresses in Lamination Based Si Monolithic MCM-D Substrates Paik, Kyung-Wook, Materials Research Society Spring Meeting, pp.192 - 192, 1998-05-01 |
| Thermomechanical stress analysis of Multilayer PCBs consisting of metals and viscoelastic polymers Paik, Kyung-Wook; Lim, JH; Kim, JS; Earmme, YY, International Conference on Fracture & Strength of Solids 2000, pp.0 - 0, 2000-12-01 |
| Thin film integral capacitor fabricated on a polymer dielectric for high density interconnect (HDI) applications Paik, Kyung-Wook; Lu, Toh-Ming, Proceedings of the Spring Meeting on MRS, v.390, pp.33 - 38, 1995-04-17 |
| Ultra low temperature curable Anisotropic Conductive Films (ACFs) with photo latent curing behavior (PLC-ACFs) Kim, Il; Paik, Kyung-Wook, 2011 13th Electronics Packaging Technology Conference, 2011-12 |
| Understanding of Anisotropic Conductive Films(ACFs)/Adhesives(ACAs) for Packaging Applications Paik, Kyung-Wook, Pan Pacific Microelectronics Symposium, pp.0 - 0, 1999-02-01 |
| Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs) Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wook, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01 |
| Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27 |
| 고 전류 스트레싱이 금 스터드 범프를 이용한 ACF 플립칩 파괴기구에 미치는 영향 김형준; 권운성; 백경욱, 한국 마이크로 전자 및 패키징 학회 2003년도 추계기술심포지움, pp.195 - 202, 한국 마이크로 전자 및 패키징 학회, 2003-11 |
| 고전류 스트레싱하에서의 ACF 플립칩의 신뢰성 해석에 관한 연구 권운성; 백경욱, 한국 마이크로 전자 및 패키징학회 2002년도 춘계 기술심포지움, pp.247 - 251, 한국 마이크로 전자 및 패키징학회, 2002-05 |
| 금 와이어에 첨가되는 팔라듐이 금 스터드 범프와 알루미늄 패드간의 계면반응 및 접합 신뢰성에 미치는 영향 김형준; 백경욱; 조종수; 박용진; 이진, 한국 마이크로 전자 및 패키징 학회 2004년도 추계 기술 심포지움, 한국 마이크로 전자 및 패키징 학회, 2004-11-12 |
| 레이저 간섭계(ESPI)를 이용한 Sn/Pb 솔더 접합부의 열사이클에 따른 열변형 형태 평가 장우순; 김동원; 권동일; 나재웅; 백경욱, 대한 금속재료학회 2001년도 춘계학술대회, pp.80 - 80, 대한 금속재료학회, 2001-04-27 |
| 멀티칩 모듈 기술 백경욱, 재료 및 파괴부문 학술대회, pp.74 - 81, 재료 및 파괴부문 학술대회, 1996-08-01 |
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