Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author 1052
Showing results 1 to 60 of 151
| 20 µm-pitch complaint-bump-bonded chip-on-flex by pre-applied wafer level adhesives Chuang, CC; Lu, ST; Chang, TC; Suk, KL; Paik, Kyung-Wook, IMPACT Conference 2009 International 3D IC Conference, pp.56 - 59, 2009-10-21 |
| A Study on Copper-to-Copper Contacts in NMBITM(Neo-Manthattna Bump Interconnection Structure) Kim, HJ; Paik, Kyung-Wook; Lee, SG; Han, JW; Hwang, JH; Lee, SM, 6th International Conference on Electronic Materials and Packaging, pp.0 - 0, 2004-12-01 |
| A Study on the Double layer Non Conductive Films (D-NCFs) For Highly Reliable Fine Pitch Flip ChipInterconnection Lee, Seyong; Paik, Kyung Wook, 15th International Symposium on Microelectronics and Packaging (ISMP 2016), The Korean Microelectronics and Packaging Society, 2016-10-25 |
| A Study on the Electrical Conduction Mechanism of Anisotropically Conductive Film (ACF) for LCD Packaging Applications 백경욱; 임명진, 97 1st ISHMIEEECPMT Joint Symposium, pp.25 - 32, 1997-04-01 |
| A Study on the Electrical Conduction Mechanism of Anisotropically Conductive Film(ACF) for LCD Packaging Applications Paik, Kyung-Wook; Yim, MJ; Kim, YK; Hwang, HN, InterPACK'97, pp.65 - 72, 1997-06-01 |
| Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage Shin, JW; Song, MS; Park, YS; Kwon, YM; Moon, JT; Cho, JS; Yoo, KA; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.942 - 946, 2009-12-09 |
| Analytical Approach to Evaluate Shear Stress in flip Chip Interconnection using NCA/ACF Lee, Soon-Bok; Paik, Kyung-Wook; Kwom, WS; Yang, SY, 5th International Symposium on Electronic Materials and Packagings 2003, pp.204 - 209, 2002 |
| Analytical approach to evaluate shear stress in flip chip interconnection using NCA/ACF Yang, SY; Kwon, WS; Lee, SB; Paik Kyung-Wook, 5th International Symposium on Electronic Materials and Packagings 2003, 2003-11 |
| Anisotropic Conductive Adhesives Flip Chip Technology Paik, Kyung-Wook, Asymtek & Tsinghua University Workshop, pp.0 - 0, 2001-05-01 |
| Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications Yim, MJ; Hwang, JS; Kim, JG; Kim, HJ; Kwon, W; Jang, KW; Paik, Kyung-Wook, Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.159 - 164, IEEE, 2004-06-01 |
| Anisotropic Conductive Film for Fine Pitch COG (Chip-on-Glass) Technology Application Yim, MJ; Kwon, WS; Paik, Kyung-Wook, The 5th Korea-Japan International Symposium on Liquid Crystalline Materials and Devices, pp.64 - 65, 2001-05-01 |
| Anisotropic Conductive Films (ACFs) for ultra-fine Pitch Chip-On-Glass (COG) applications Yim, MJ; Hwang, J; Paik, Kyung-Wook, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.181 - 186, 2005-03-16 |
| Anisotropic Conductive Films with Area-arrayed Conducting Microbumps Paik, Kyung-Wook, International Conference on Electronic Materials, pp.139 - 139, 1998-03-01 |
| Applications of Ni and Cu electroless plating techniques for flip chip bumping and under bump metallurgy (UBM) Paik, Kyung-Wook; Jeon, YD; Nah, JW, Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.177 - 184, 2001-07-08 |
| Assembly yield enhancement of electroless Ni-P UBM/Pb-free solder joints Kwon, YM; Jeon, YD; Paik, Kyung-Wook; Kim, JD; Lee, JW, 7th Electronics Packaging Technology Conference, EPTC 2005, v.1, pp.287 - 291, 2005-12-07 |
| Au wire와 AI pad간의 계면 반응과 접합신뢰성에 있어서의 첨가원소 Pd과 Cu의 영향 백경욱; 감상아; 김형준; 조종수; 김성훈; 박용진, 한국 마이크로 전자 및 패키징 학회 (IMASPS-Korea) 2005년도 추계기술심포지움, pp.196 - 201, 2005 |
| Bubbles formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on ACFs joints reliability Kim, HJ; Hong, SM; Jang, SY; Moon, YJ; Paik, Kyung-Wook, 7th Electronics Packaging Technology Conference, 2005, v.2, pp.734 - 739, 2005-12-07 |
| Bumpless ball grid array (BBGA) package using a solder resist cavity Kwon, YM; Kang, JS; Kweon, YD; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, 2009, pp.1552 - 1556, 2009-05-26 |
| Characteization of Polymer die-Attach Adhesives on Au and Al surfaces Paik, Kyung-Wook; krishnamurthy; Lester, D, Proceedings of the 1992 Internationl Symposium on Hybrid Mecroelectronics (ISHM) Conference, pp.719 - 724, 1992 |
| Comparison of Ni-filled Balls and Au-coated Polymer Balls in High-frequency Application of ACF flip-chip Joint Paik, Kyung-Wook; Ahn, Seung Young; Rhu, Woong Hwan; Yim, Myung-Jin; Lee, Jun Ho; Jeon, Young-Doo; Kim, Woo Poung; et al, APACK'99 Symposium on Advances in Packaging, pp.353 - 356, 1999-12-01 |
| Conduction mechanism of Anisotropic Conductive Adhesives (ACAs): Conductor ball deformation and build-up of contraction stresses Kwon, WS; Paik, Kyung-Wook, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.214 - 220, 2005-03-16 |
| Cu pad 위에 무전해 도금된 플립칩 UBM 과 비솔더 범프에 관한 연구 백경욱, The Microelectronics and Packaging Society, IMAPS-Korea Workshop 2001, pp.95 - 99, The Microelectronics and Packaging Society, 2001-07-01 |
| Cu/Al 금속간화합물 형성이 구리와이어의 본딩신뢰성에 미치는 영향 김형준; 이주연; 나재웅; 백경욱, 대한금속 재료학회 2001년도 추계학술대회, pp.73 - 73, 대한금속 재료학회, 2001-10-01 |
| Design and understanding of anisotropic conductive films (ACFs) for LCD packaging Yim, Myung-Jin; Paik, Kyung-Wook, Proceedings of the 1997 1st IEEE International Symposium on Polymeric Electronics Packaging, PEP'97, pp.233 - 242, 1997-10-26 |
| Determination of Stress-Strain Curve for Microelectronic Solder Joint by ESPI Measurement and FE Analaysis Lee, BW; Jeong, JH; Jang, WS; Kim, JY; Kim, DW; Kwon, DI; Nah, JW; et al, The Third International Conference On Advanced Materials Development and Performance, Kyungpook National University, 2002-10 |
| Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis Lee, BW; Jeong, JH; Jang, W; Kim, JY; Kim, DW; Kwon, D; Nah, JW; et al, The Third International Conference On Advanced Materials Development and Performance, v.17, pp.1983 - 1988, The Third International Conference On Advanced Materials Development and Performance, 2003 |
| Development of New 3-Dimensional (3-D) Memory Die Stacking Package 백경욱, 제6회 한국반도체 학술대회, pp.271 - 272, 한국반도체 학술대회, 1999-02-01 |
| Development of New Ion Beam Modification Techniques to Enhance Copper and Polyimide Adhesion in Multilevel Electronic Packaging Paik, Kyung-Wook, Proc. Mat. Res. Soc. Symp, pp.21 - 26, 1989-03-01 |
| Development of Uranium-Silicide and U-Mo Alloy Fuels by Centruifugal Atomization Paik, Kyung-Wook, Technical Committee on Research fo Fuel Aimed by Low Fission Gas Release, pp.0 - 0, 1996-10-01 |
| Effect of compressive stresses in Anisotropic Conductive Films (ACFs) on contact resistance of flip chip joint Paik, Kyung-Wook; Kwon, WS, 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.141 - 147, 2004-09-12 |
| Effects of BaTiO3 Composite Films and Pastes for High Dielectric Constant and Low Tolerance Embedded Capacitor Fabrication in Organic Substrates Cho, Sung-Dong; Jang, Kyung-Woon; Hyun, Jin-Gul; Paik, Kyung-Wook, 2004 Pan Pacific Microelectronics, pp.109 - 115, 2004 |
| Effects of BaTiO3 content and size on the viscosity and curing behavior of B-stage Epoxy/BaTiO3 composite Embedded Capacitor Films (ECFs) Jang, Jong Min; Lee, Sangyong; Paik, Kyung-Wook, The 11th International Conference on Electronic Materials and Packaging, 2009-12 |
| Effects of Conductive Particles on the Power Handling Capability of ACFs Interconnection for Flex-On-Board Applications Zhang, Shuye; Park, Jae Hyeong; Paik, Kyung Wook, 15th International Symposium on Microelectronics and Packaging (ISMP 2016), The Korean Microelectronics and Packaging Society, 2016-10-25 |
| Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature Nah, JW; Suh, JO; Paik, Kyung-Wook; Tu, KN, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.50 - 53, 2005-03-16 |
| Effects of Electrical Current on the Failure Mechanisms of Au stud bumps/ACF Flip Chip Joints under High Current Stressing Condition Kim, HJ; Kwon, WS; Paik, Kyung-Wook, 5th International Conference on Electronic Materials and Packaging, pp.203 - 208, 2003-11 |
| Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability Park, YS; Kwon, YM; Moon, JT; Lee, YW; Lee, JH; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.321 - 324, 2009-12-09 |
| Effects of heating rate during ACFs curing process on material properties and thermal cycling reliability of flip chip assembly Jang, KW; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference, 2007, pp.1725 - 1730, IEEE, 2007-05-29 |
| Effects of Humidity Cycling on Polymer Overlaid High Density Interconnects Paik, Kyung-Wook; Li, X; Pecht, M; Bernard, E, Proceeding of IEEE-CHMT VLSI packaging workshop, pp.11 - 13, 1993-10-01 |
| Effects of the functional groups of non-conductive films (NCFs) on materials properties and reliability of NCF flip-chip-on-organic boards Chung, CK; Kwon, WS; Park, JH; Lee, Soon-Bok; Paik, Kyung-Wook, International Symposium on Electronics Materials and Packaging, 2005, v.2005, pp.156 - 161, 2005-12-11 |
| Effects of the polymer residues on via contact resistance after reactive ion etching Ko, HS; Nah, JW; Paik, Kyung-Wook; Park, Y, 20th North American Conference on Molecular Beam Epitaxy, v.20, no.3, pp.1000 - 1007, 2001-10-01 |
| Electrical conducting behavior of hybrid nanocomposites containing carbon nanotubes and carbon black Ma, PC; Zhang, H; Wang, SQ; Wong, YK; Tang, BZ; Hong, SH; Paik, Kyung-Wook; et al, The 9th International Conference on Electronic Materials and Packaging, EMAP 2007, pp.0 - 0, 2007-11-19 |
| Electroless Ni Bumped Flip Chip Interconnection on an Organic Substrate using Anisotropic Conductive Adhesives/Films (ACAs/ACFs) Paik, Kyung-Wook, Int. Advanced Tech. Workshop on Flip Chip Technology, pp.0 - 0, 1999-03-01 |
| Electroless Ni-PUBM과 Sn-based 무연솔더의 계면반응에 미치는 Bi 합금원소의 영향 조문기; 전영두; 백경욱; 김중도; 김용남, 한국 마이크로 전자 및 패키징 학회 2003년도 추계 기술심포지움, 한국 마이크로 전자 및 패키징 학회, 2003-11-14 |
| Electroplating을 이용한 Eutectic Pb/Sn Solder Bump 제작과 Solder/UBM (Under Bump Metallurgy)간 계면 연구 Paik, Kyung Wook, 제5회 한국반도체 학술대회, pp.589 - 590, 한국반도체 학술대회, 1998-02-01 |
| Embedded chip-in-flex (cif) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs) Suk, KL; Son, HY; Chung, CK; Kim, JD; Lee, JW; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, ECTC 2009, pp.1741 - 1748, 2009-05-26 |
| Epoxy/BaTiO (SrTiO3) Composite Films and Pastes for High Dielectric Constant and Low Tolerance Embedded Capacitors in Organic Substrates Paik, Kyung-Wook; Hyun, JG; Lee, S; Jang, KW, Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2006-01 |
| Epoxy/BaTiO3 (SrTi03) composite films and pastes for high dielectric constant and low tolerance embedded capacitors in organic substrates Paik, Kyung-Wook; Hyun, JG; Lee, S; Jang, KW, ESTC 2006 - 1st Electronics Systemintegration Technology Conference, pp.794 - 801, 2006-09-05 |
| Epoxy/BaTio3 (SrTiO3) Composite Films and Pastes for Organic Substrates Applications Paik, Kyung-Wook, UKC 2006 (US-Korea Conference on Science, Technology, and Entrepreneurship), pp.0 - 0, 2006-08-01 |
| Epoxy/BaTiO3 (SrTiO3) composite films for high dielectric constant and low tolerance embedded capacitors fabrication in organic substrates Paik, Kyung-Wook; Cho, SD; Hyun, JG; Lee, S; Kim, H; Kim, J, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.227 - 232, 2005-03-16 |
| Epoxy/BaTiO3 Composite Embedded Capacitor Films (ECFs) for Organic Substrate Applications Cho, S; Hyun, JG; Paik, Kyung-Wook, 2003 International Electronic Packaging Technical Conference and Exhibition, v.2, pp.719 - 725, 2003-07-06 |
| Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low tolerance embedded capacitors fabrication in organic substrates Hyun, JG; Jang, KW; Cho, SD; Paik, Kyung-Wook; Kim, HS; Kim, JH, 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.105 - 111, 2004-09-12 |
| Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low tolerance embedded capacitors fabrication in organic substrates, 백경욱; 현진걸; 장경운, 한국 마이크로 전자 및 패키징 학회 2004년도 추계기술 심포지움, pp.9 - 10, 한국 마이크로 전자 및 패키징 학회, 2004-11-01 |
| ESPI를 이용한 플립칩 패키지의 열적 전단변형률 평가 장우순; 이백우; 김동원; 나재웅; 백경욱; 권동일, 대한용접학회 2001년도 추계학술대회, pp.0 - 0, 대한용접학회, 2001-10-25 |
| ESPI와 유한요소해석을 이용한 플립칩 솔더볼의 유동특성 평가 이백우; 정증현; 김주영; 나재웅; 백경욱; 권동일, 대한용접학회 2002년도 춘계학술발표대회, pp.278 - 281, 대한용접학회, 2002-05 |
| Eutectic Pb/Sn Solder Bump and Under Bump Metallurgy(UBM) Interfacial Reaction and Adhesion Paik, Kyung-Wook, 2nd electronic Packaging Technology Conference, pp.69 - 75, 1998-03-01 |
| Evaluation of Aluminum Nitride(AlN) Substrate Material for High Density Interconnect(HDI) Applications Paik, Kyung-Wook, Proceedings of the 1992 International Symposium on Hybrid Microelectronics (ISHM) conference, pp.555 - 560, 1992-03-01 |
| Evaluation of Thermal Shear Strains in Flips-chip Package by Electronic Speckle Pattern Interferometry (ESPI) Jang, W; Lee, BW; Kim, DW; Nah, JW; Paik, Kyung-Wook; Kwon, D, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001, pp.310 - 314, 2001-11 |
| Experimental Analysis of Compressive Stresses in ACF Flip Chip Joint and Its Influence on ACF Joint Reliability Kwon, WS; Paik, Kyung-Wook, 2003 International Electronic Packaging Technical Conference and Exhibition, v.1, pp.131 - 136, 2003-07-06 |
| Fabrication and characterization of embedded capacitors in printed circuit boards using B-stage epoxy/BaTiO3 composite embedded capacitor films (ECFs) Lee, S; Hyun, JG; Pak, JS; Lee, H; Jeon, HS; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.742 - 746, 2008-05-27 |
| Fabrication and characterization of epoxy/bari0 composite embedded capacitor for high frequency behaviors Hyun, JG; Paik, Kyung-Wook; Pak, JS, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.124 - 128, 2008-10-22 |
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