Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Zhang, Shuye
Showing results 1 to 35 of 35
| A Study on Polyvinylidene Difluoride (PVDF) Anchoring Polymer Layer (APL) Solder Anisotropic Conductive Films (ACFs) for Fine-Pitch Flex-on-Flex (FOF) Interconnection Song, Lu; Yoon, Dal-Jin; Zhang, Shuye; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.3, pp.368 - 377, 2020-03 |
| A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn-58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications Zhang, Shuye; Lin, Tiesong; He, Peng; Zhao, Ning; Huang, Mingliang; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.12, pp.2087 - 2094, 2017-12 |
| A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling Zhang, Shuye; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.216 - 223, 2016-02 |
| A study on the high frequency performance of solder ACFs joints for flex-on-board applications using coplanar waveguide Zhang, Shuye; Lin, Tiesong; He, Peng; Park, Junyong; Park, Gap Yeol; Song, Huijin; Kim, Joungho; et al, 68th IEEE Electronic Components and Technology Conference, ECTC 2018, pp.2404 - 2409, Institute of Electrical and Electronics Engineers Inc., 2018-05 |
| A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 degrees C Bonding Temperature Zhang, Shuye; Yang, Ming; Wu, Yang; Du, Jikun; Lin, Tiesong; He, Peng; Huang, Mingliang; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.3, pp.383 - 391, 2018-03 |
| A Study on the Oxygen Plasma Treatment on the Peel Adhesion Strength and Solder Wettability of SnBi58 based Anisotropic Conductive Films Zhang, Shuye; Huang, Mingliang; Wu, Yang; Yang, Ming; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.2022 - 2028, IEEE, 2019-05 |
| A Study on the Preparation and Properties of Conductive Adhesive Filled with Multi-component Fillers for Green Packaging Zhang, Shuye; Yang, Ming; Zhang, Yanxin; Wang, Qian; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, 20th International Conference on Electronic Materials and Packaging (EMAP), IEEE, 2018-12 |
| A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives Zhang, Shuye; Qi, Xiaoquan; Yang, Ming; Cao, Yang; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.10, pp.9171 - 9183, 2019-05 |
| A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding Zhang, Shuye; Kim, Seung-Ho; Kim, Tae-Wan; Kim, Yoo Sun; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.1, pp.9 - 14, 2015-01 |
| A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection Zhang, Shuye; Park, Junyong; Park, Gapyeol; Kim, Joungho; Paik, Kyung-Wook; He, Peng, JOURNAL OF ADVANCED JOINING PROCESSES, v.5, 2022-06 |
| (A) study on the electrical performances and reliability of flex-on-board interconnection using solder anisotropic conductive films = 솔더 ACFs를 사용한 FOB 접속의 전기적 특성과 신뢰성에 대한 연구link Zhang, Shuye; Kyung-Wook Paik; et al, 한국과학기술원, 2017 |
| Crack mechanism correlated with Sn grain orientations on Ni metal surface subjected to 1000 thermal shocks Jing, Xinyi; Luo, Keyu; Paik, Kyung-Wook; He, Peng; Zhang, Shuye, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.26, pp.1663 - 1668, 2023-09 |
| Cu-Cu joining using citrate coated ultra-small nano-silver pastes Zhang, Shuye; Wang, Qian; Lin, Tiesong; Zhang, Pengzhe; He, Peng; Paik, Kyung-Wook, JOURNAL OF MANUFACTURING PROCESSES, v.62, pp.546 - 554, 2021-02 |
| Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly Kim, Tae-Wan; Lee, Tae-Ik; Pan, Yan; Kim, Wansun; Zhang, Shuye; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.9, 2016-09 |
| Effects of acrylic adhesives property and optimized bonding parameters on Sn-58Bi solder joint morphology for flex-on-board assembly Zhang, Shuye; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.78, pp.181 - 189, 2017-11 |
| Effects of Conductive Particles on the Power Handling Capability of ACFs Interconnection for Flex-On-Board Applications Zhang, Shuye; Park, Jae Hyeong; Paik, Kyung Wook, 15th International Symposium on Microelectronics and Packaging (ISMP 2016), The Korean Microelectronics and Packaging Society, 2016-10-25 |
| Effects of Cooling Processes and Silica Filler Contents of Solder ACFs (Anisotropic Conductive Films) on the Joints Reliability Zhang, Shuye; Paik, Kyung Wook, IEEE 66th Electronic Components and Technology Conference, pp.737 - 742, IEEE 66th Electronic Components and Technology Conference, 2016-06-02 |
| Effects of Polymer Ball Size and Polyvinylidene Fluoride Nanofiber on the Ball Capture Rate for 100-mu m-Pitch Flex-on-Flex Assembly Using Anisotropic Conductive Films and Ultrasonic Bonding Method Park, Jae-Hyeong; Kim, Tae Wan; Zhang, Shuye; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.7, pp.1127 - 1134, 2016-07 |
| Effects of Polymer Rebound on Crack-Free Acrylic based SnBi58 ACFs (Anisotropic Conductive Films) Joints during a Thermal-Compression Bonding Method Zhang, Shuye; Paik, Kyung-Wook, 2017 IEEE 67th Electronic Components and Technology Conference, IEEE-CPMT, 2017-05-31 |
| Effects of Sn-3Ag-0.5Cu solder ball size and content on the solder anisotropic conductive film (ACF) joint properties for flex-on-board assembly using ultrasonic bonding method = Sn-3Ag-0.5Cu 솔더볼의 크기와 함량이 초음파 본딩을 이용한 유기-경성기판 조립 용 솔더 이방성 전도성 필름에 미치는 영향에 대한 연구link Zhang, Shuye; 장슈예; et al, 한국과학기술원, 2014 |
| Effects of the citrate-coated nanosized Ag pastes on joining reliable Cu-Cu joints for Current 3D ICs Zhang, Shuye; Duan, Xiaokang; Li, Zhenfeng; Xu, Jiaohao; Wang, Dayin; Zhang, Shang; He, Peng; et al, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), pp.1957 - 1962, IEEE, 2021-06 |
| Equilibrium phase diagram design and structural optimization of SAC/ Sn-Pb composite structure solder joint for preferable stress distribution Xu, Sunwu; Jing, Xinyi; Zhu, Pengyu; Jin, Haoran; Paik, Kyung-Wook; He, Peng; Zhang, Shuye, MATERIALS CHARACTERIZATION, v.206, 2023-12 |
Highly mechanical and high-temperature properties of Cu–Cu joints using citrate-coated nanosized Ag paste in air Wang, Qian; Zhang, Shuye; Lin, Tiesong; Zhang, Pengzhe; He, Peng; Paik, Kyung-Wook, PROGRESS IN NATURAL SCIENCE-MATERIALS INTERNATIONAL, v.31, no.1, pp.129 - 140, 2021-02 |
| In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects Liu, Jinhong; Xu, Jianhao; Paik, Kyung-Wook; He, Peng; Zhang, Shuye, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.169, pp.42 - 52, 2024-01 |
| Joint Morphologies and Failure Mechanisms of Anisotropic Conductive Films (ACFs) During a Power Handling Capability Test for Flex-On-Board Applications Zhang, Shuye; Park, Jae-Hyeong; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.12, pp.1820 - 1826, 2016-12 |
| Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers Zhang, Shuye; Yang, Ming; Jin, Ming Liang; Huang, Wen-Can; Lin, Tiesong; He, Peng; Lin, Panpan; et al, METALS, v.8, no.1, 2018-01 |
| Numerical Analysis of 3D CSP MEMS Under Thermal Cycle-Impact Coupled Multiphysics Loads Zhang, Shuye; Sun, Mingjia; Yang, Jianqun; Li, Xingji; He, Peng; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.1, pp.26 - 33, 2023-01 |
| Preparation and characterization of Sn-3.0Ag-0.5Cu nano-solder paste and assessment of the reliability of joints fabricated by microwave hybrid heating Zhang, Shuai; Zhang, Shuye; Zhou, Hongzhi; Paik, Kyung-Wook; Ding, Tianran; Long, Weimin; Zhong, Sujuan; et al, MATERIALS CHARACTERIZATION, v.207, 2024-01 |
| Reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads Zhang, Shuye; Xu, Jianhao; Zhang, Shang; He, Peng; Sun, Mingjia; Yang, Jianqun; Li, Xingji; et al, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), IEEE, 2021-06 |
| Shear performance and accelerated reliability of solder interconnects for fan-out wafer-level package Zhang, Shuye; Duan, Ran; Xu, Sunwu; Xue, Panfei; Wang, Chengqian; Chen, Jieshi; Paik, Kyung-Wook; et al, JOURNAL OF ADVANCED JOINING PROCESSES, v.5, 2022-06 |
| Strength dependence of epoxy composites on the average filler size of non-oxidized graphene flake Kim, Jin; Kim, Jungmo; Song, Sungho; Zhang, Shuye; Cha, Jaemin; Kim, Kisun; Yoon, Hyewon; et al, CARBON, v.113, pp.379 - 386, 2017-03 |
| The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface Wang, Shaoan; Chen, Xiangyu; Luo, Keyu; Zhou, Hongzhi; Li, Rongqing; He, Peng; Paik, Kyung-Wook; et al, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.5332 - 5339, 2023-11 |
| The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates Zhang, Shuye; Wang, Shaoan; Zhang, Shang; Chen, Xiangyu; Zeng, Chen; Paik, Kyung-Wook; He, Peng, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.7094 - 7099, 2023-11 |
| The Effect of Polymer Rebound on SnBi58 Solder ACFs Joints Cracks during a Thermo-Compression Bonding Zhang, Shuye; Paik, Kyung-Wook, 67th IEEE Electronic Components and Technology Conference, ECTC 2017, pp.2047 - 2053, Institute of Electrical and Electronics Engineers Inc., 2017-05 |
| Wettability and interfacial morphology of Sn-3.0Ag-0.5Cu solder on electroless nickel plated ZnS transparent ceramic Zhang, Shuye; Zhu, Bingxuan; Zhou, Xiang; Wang, Xingxing; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.19, pp.17972 - 17985, 2019-10 |
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