Browse "Dept. of Materials Science and Engineering(신소재공학과)" byAuthorYan, Pan

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ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics

Yoon, Dal-Jin; Malik, Muhammad-Hassan; Yan, Pan; Paik, Kyung-Wookresearcher; Roshanghias, Ali, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.32, no.2, pp.2283 - 2292, 2021-01

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