Browse "Dept. of Materials Science and Engineering(신소재공학과)" byAuthorYan, L

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Development of low temperature bonding using in-based solders

Choi, WK; Yu, D; Lee, C; Yan, L; Yu, A; Yoon, SW; Lau, JH; et al, 2008 58th Electronic Components and Technology Conference, ECTC, pp.1294 - 1299, 2008-05-27

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