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Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability

Kim, HJ; Lee, YJ; Paik, Kyung-Wook; Koh, KW; Woon, JH; Choi, SH; Lee, J; et al, Proceeding of the 3rd International Symposium on Electronic Matericals and Packaging 2001, pp.44 - 51, International Symposium on Electronic Matericals and Packaging, 2001-11

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