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Effects of Cu/AI intermetallic compound (IMC) on copper wire and aluminum pad bondability Kim, HJ; Lee, JY; Paik, Kyung-Wook; KOh, KW; Won, J; Choe, S; Lee, J; et al, IEEE TRANSACTIONS ON COMPONENETS PACKAGING AND MANUFACTURING TECHNOLOGY, v.26, no.2, pp.367 - 374, 2003-06 |
Effects of polyamidoamine dendrimers on the catalytic layers of a membrane electrode assembly in fuel cells Lee, JH; Won, J; Oh, IH; Ha, HY; Cho, EunAe; Kang, YS, MACROMOLECULAR RESEARCH, v.14, no.1, pp.101 - 106, 2006-02 |
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