Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Song, JY
Showing results 1 to 18 of 18
| Analyses of the practical adhesion strengths of the metal/polymer interfaces in electronic packaging Yu, Jin; Song, JY; Park, IS, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.12, pp.1347 - 1352, 2002-12 |
| Analysis of phase transformation kinetics by intrinsic stress evolutions during the isothermal aging of amorphous Ni(P) and Sn/Ni(P) films Song, JY; Yu, Jin; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.4, pp.1257 - 1264, 2004-04 |
| Analysis of the T-peel strength in a Cu/Cr/polyimide system Song, JY; Yu, Jin, ACTA MATERIALIA, v.50, no.16, pp.3985 - 3994, 2002-09 |
| Effect of phosphorous content on phase transformation induced stress in Sn/Ni(P) thin films Song, JY; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.21, no.9, pp.2261 - 2269, 2006-09 |
| Effects of reactive diffusion on stress evolution in Cu-Sn films Song, JY; Yu, Jin; Lee, TY, SCRIPTA MATERIALIA, v.51, no.2, pp.167 - 170, 2004-07 |
| Enhancement of electrical properties in the cuprous oxide films doped with single wall carbon nanotubes Yoo, JJ; Song, JY; Yu, Jin, 60th Electronic Components and Technology Conference, ECTC 2010, pp.1335 - 1338, ECTC, 2010-06-01 |
| Estimation of the interfacial fracture energy of metal/polymer system in microelectronic packaging Song, JY; Yu, Jin, 2001 MRS Spring Meeting, v.682, pp.150 - 155, 2001-04-16 |
| Fabrication of multiwall carbon nanotube-nanocrystalline copper nanocomposite film by electrochemical deposition Yoo, JJ; Song, JY; Yu, Jin, Nanophase and Nanocomposite Materials V, pp.179 - 183, 2007-11-26 |
| Lattice deformation of Sn nanowires for the application to nano-interconnection technology Shin, HS; Song, JY; Yu, Jin, 60th Electronic Components and Technology Conference, ECTC 2010, pp.1861 - 1865, ECTC, 2010-06-01 |
| Measurement of Metal/Polymer Interfacial Fracture energy in Microelectron in Packaging Yu, Jin; Song, JY, 3rd Electronics.Packaging Technology Conference(EPTC2000), pp.246 - 250, 2000-12-01 |
| Multi-walled carbon nanotube/nanocrystalline copper nanocomposite film as an interconnect material Yoo, JJ; Song, JY; Yu, Jin; Lyeo, HK; Lee, S; Hahn, JH, 2008 58th Electronic Components and Technology Conference, ECTC, pp.1282 - 1286, 2008-05-27 |
| Phase transformation and residual stress evolution in electroless Ni-P UBM used in low cost flip chip technology Song, JY; Yu, Jin, 2002 International Symposium on Microelectronics, v.4931, pp.261 - 266, 2002-09-04 |
| Relationship between mechanical properties and microstructure of ultra-fine gold bonding wires Kim, KS; Song, JY; Chung, EK; Park, JK; Hong, Soon-Hyung, MECHANICS OF MATERIALS, v.38, pp.119 - 127, 2006-01 |
| Residual stress measurements in electroless plated Ni-P films Song, JY; Yu, Jin, THIN SOLID FILMS, v.415, no.1-2, pp.167 - 172, 2002-08 |
| Sn(or SnAg)/Ni(P)와 Sn/Cu 다층박막의 열사이클 동안 발생하는 잔류응력 과 미세구조의 변화 유진; Song, JY, 한국 마이크로전자 및 패키징학회, pp.265 - 269, 2003 |
| T Peel 테스트에 의한 Cu/Cr/Polyimide계의 계면파괴에너지 평가(Estimation of Interfacial Fracture Energy of Cu/Cr/Polyimide System by T Peel Test) 유진; Song, JY, IMAPS Korea 2000 , Fall Symp. Dankuk Uni pp.107 - 111, 2000 |
| Transition characteristics of sound speed and elastic modulus of EPDM materials with temperature Hong, Soon Hyung; Kim, KS; Lee, KI; Yoon, SW; Sohn, MS; Song, JY, Summer Meeting of Acoustic Society for Korea, pp.479 - 482, 한국음향학회, 2003-07-01 |
| 전자 패키지에 사용되는 Cu/Cr/폴리이미드 테이프의 T-필 테스트에ㅡ대한 연구 유진; Song, JY, 제 15회 강도 심포지엄, pp.341 - 355, 2001 |
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