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ADHESION ENHANCEMENT OF POLYIMIDE ON COPPER BY AR ION-BEAM ETCHING OF COPPER Paik, Kyung-Wook; Ruoff, AL, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.2, no.1, pp.245 - 253, 1988 |
ADHESION ENHANCEMENT OF THIN COPPER FILM ON POLYIMIDE MODIFIED BY OXYGEN REACTIVE ION-BEAM ETCHING Paik, Kyung-Wook; Ruoff, AL, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.4, no.1, pp.465 - 474, 1990 |
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