Showing results 1 to 5 of 5
Characteristics of indium bump for flip-chip bonding used in polymeric-waveguide-integrated optical interconnection systems Chu, KM; Lee, JS; Cho, HS; Rho, BS; Park, HyoHoon; Jeon, DukYoung, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.43, no.8B, pp.5922 - 5927, 2004-08 |
Compositional Effect on Phase Stability and Hardness of Al66Mn9(Ti,Zr)25 Intermetallic Compounds Lee, Hyuck Mo; Han, SZ; Rho, BS, Second Pacific Rim International Conference on Advanced Materials and Processing, pp.2477 - 2482, 1995-06-18 |
Effect of alloyed Ti:Zr ratio on phase stability of Al66Mn9(Ti,Zr)(25) intermetallic compounds Han, SZ; Rho, BS; Lee, HyuckMo; Choi, Si-Kyung, INTERMETALLICS, v.4, no.3, pp.245 - 249, 1996-04 |
Investigation of the phase equilibria in the Sn-Bi-In alloy system Yoon, SW; Rho, BS; Lee, HyuckMo; Kim, CU; Lee, BJ, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.30, no.6, pp.1503 - 1515, 1999-06 |
Phase Equilibria of the Low-Temperature Pb-Free Solder, Sn-In and Sn-In-Bi Systems Lee, Hyuck Mo; Rho, BS; Lee, BJ, Third IUMRS International Conference in Asia (IUMRS-ICA-95), pp.911 - 916, 1995-10-17 |
Discover