Browse "Dept. of Materials Science and Engineering(신소재공학과)" byAuthorPan, Yan

Showing results 1 to 3 of 3

1
A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films

Pan, Yan; Oh, Seung-Jin; Kim, Ji-Hye; Kim, Taek-Sooresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.6, pp.941 - 948, 2020-06

2
(A) study on the 50μm Fine Pitch Flex-on-Flex (FOF) assembly using conventional and nanofiber Anisotropic Conductive Films (ACFs) = 기존 및 나노파이버 이방성 전도필름을 이용한 50 μm 미세피치 Flex-on-Lex 접합에 대한 연구link

Pan, Yan; Paik, Kyoung-Wook; et al, 한국과학기술원, 2017

3
Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly

Kim, Tae-Wan; Lee, Tae-Ik; Pan, Yan; Kim, Wansun; Zhang, Shuye; Kim, Taek-Sooresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.9, 2016-09

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