Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Oh, TS
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| Development and evaluation of 3-D SiP with vertically interconnected Through Silicon Vias (TSV) Jang, DM; Ryu, C; Lee, KY; Cho, BH; Kim, Joungho; Oh, TS; Lee, Won-Jong; et al, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.847 - 852, IEEE, 2007-05-29 |
| Low temperature and ultra fine pitch joints using non-conductive adhesive for flip chip technology Kim, SY; Oh, TS; Lee, Won-Jong; Kim, YH, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, 2006-08-26 |
| Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package Jee, YK; Park, KW; Oh, TS; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.5, pp.685 - 690, 2009-05 |
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