Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Lee, Soon-Bok

Showing results 1 to 20 of 20

1
A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moire Interferometry

Park, Jin-Hyoung; Jang, Kyung-Woon; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.33, no.1, pp.215 - 221, 2010-03

2
A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages

Jang, Kyung-Woon; Park, Jin-Hyoung; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1174 - 1181, 2012-06

3
Analytical Approach to Evaluate Shear Stress in flip Chip Interconnection using NCA/ACF

Lee, Soon-Bok; Paik, Kyung-Wook; Kwom, WS; Yang, SY, 5th International Symposium on Electronic Materials and Packagings 2003, pp.204 - 209, 2002

4
Chip warpage damage model for ACA film type electronic packages

Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005

5
Contraction stresses development of anisotropic conductive films (ACFs) flip chip interconnection: Prediction and measurement

Kwon, Woon-Seong; Yang, Se-Young; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.29, no.3, pp.688 - 695, 2006-09

6
Effect of high glass transition temperature on reliability of Non-Conductive Film (NCF)

Park, J.-H.; Chung, C.-K.; Paik, Kyung-Wook; Lee, Soon-Bok, KEY ENGINEERING MATERIALS, v.326-328, no.0, pp.517 - 520, 2006

7
Effects of Conductive Particles on the Electrical Stability and Reliability of Anisotropic Conductive Film Chip-On-Board Interconnections

Chung, Chang-Kyu; Sim, Gidong; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.3, pp.359 - 366, 2012-03

8
Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints

Lee, K. O.; Yu, Jin; Park, T. S.; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF FATIGUE, v.48, pp.1 - 8, 2013-03

9
Effects of the functional groups of non-conductive films (NCFs) on materials properties and reliability of NCF flip-chip-on-organic boards

Chung, CK; Kwon, WS; Park, JH; Lee, Soon-Bok; Paik, Kyung-Wook, International Symposium on Electronics Materials and Packaging, 2005, v.2005, pp.156 - 161, 2005-12-11

10
Effects of the functional groups of nonconductive films (NCFs) on material properties and reliability of NCF flip-chip-on-organic boards

Chung, Chang-Kyu; Kwon, Woon-Seong; Jang, Kyung-Woon; Park, Jin-Flyoung; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.30, no.3, pp.464 - 471, 2007

11
In-situ moiré measurement of adhesive flip-chip bonded assembly under thermal cycling condition

Ham, SJ; Kwon, WS; Paik, Kyung-Wook; Lee, Soon-Bok, 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.63 - 67, IEEE, 2002-06

12
Low-cycle fatigue characteristics of Sn-based solder joints

Lee, KO; Yu, Jin; Park, TS; Lee, Soon-Bok, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.4, pp.249 - 257, 2004-04

13
Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages

Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.834 - 840, 2012-05

14
Moisture induced interface weakening in ACF package

Sim, Gidong; Chung, Chang-Kyu; Paik, Kyung-Wook; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.528, no.2, pp.698 - 705, 2010-12

15
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages

Yang, SY; Jeon, YD; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, pp.512 - 522, 2006-02

16
The effect of Tg on thermo-mechanical deformation and reliability of adhesive flip chip assemblies during temperature cycling

Kwon, WS; Yang, SY; Lee, Soon-Bok; Paik, Kyung-Wook, Proceedings - 54th Electronic Components and Technology Conference, pp.1731 - 1737, IEEE, 2004-06-01

17
The experimental and theoretical approaches of contraction stress build-up of anisotropic conductive adhesives for flip chip interconnection

Kwon, WS; Yang, SY; Lee, Soon-Bok; Paik, Kyung-Wook, 55th Electronic Components and Technology Conference, ECTC, pp.1468 - 1474, IEEE, 2005-05-31

18
Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation

Kwon, WS; Yim, MJ; Paik, Kyung-Wook; Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06

19
Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 mu m pitch applications

Son, Ho-Young; Kim, Ilho; Lee, Soon-Bok; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook, JOURNAL OF APPLIED PHYSICS, v.105, no.1, 2009-01

20
Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition

Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07

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