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Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Kim, Chang-Gyu

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Showing results 1 to 6 of 6

1
3-D Packaging 용 Through-Si Via/Trench의 충진에 관한 연구 = Filling of through-Si Via/Trench for 3-D packaginglink

김창규; Kim, Chang-Gyu; et al, 한국과학기술원, 2012

2
An angular distribution function for the sputter-depositing atoms and general equations describing the initial thickness profile of a thin film deposited inside a via and trench by sputtering

Kim, Chang-Gyu; Lee, Won-Jong, THIN SOLID FILMS, v.519, no.1, pp.74 - 80, 2010-10

3
Quantitative study on the enhancement of sidewall coverage of sputter-deposited film by partially tapering the sidewall of via holes

Kim, Chang-Gyu; Lee, Won-Jong, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, v.29, no.2, pp.020604-1 - 020604-6, 2011-03

4
Simulation Study on the Etching Mechanism of the Bosch Process

Kim, Chang-Gyu; Moon, Jae-Seung; Lee, Won-Jong, KOREAN JOURNAL OF METALS AND MATERIALS, v.49, no.10, pp.797 - 804, 2011-10

5
Simulation study on the thickness uniformity of thin film deposited on a large-size substrate in multi-source evaporation system

Kim, Chang-Gyu; Lee, Won-Jong, KOREAN JOURNAL OF MATERIALS RESEARCH, v.21, no.1, pp.56 - 66, 2011-01

6
Study on the Mechanism and Modeling for Super-filling of High-Aspect-Ratio Features with Copper by Catalyst Enhanced Chemical Vapor Deposition Coupled with Plasma Treatment

Kim, Chang-Gyu; Lee, Do-Seon; Lee, Won-Jong, KOREAN JOURNAL OF METALS AND MATERIALS, v.49, no.4, pp.334 - 341, 2011-04

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