Browse "Dept. of Materials Science and Engineering(신소재공학과)" byAuthorGignac, L

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Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

Kang, SK; Leonard, D; Shih, DY; Gignac, L; Henderson, DW; Cho, S; Yu, Jinresearcher, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.3, pp.479 - 485, 2006-03

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