Browse "Dept. of Materials Science and Engineering(신소재공학과)" byAuthorGam, SA

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1
Effects of Cu and Pd addition on au bonding wire/Al pad interfacial reactions and bond reliability

Gam, SA; Kim, HJ; Cho, JS; Park, YJ; Kim,SH; Moon, JT; Paik, Kyung-Wookresearcher, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.2048 - 2055, 2006-11

2
Formation of Pb/63Sn Solder Bumps using a Solder Droplet Jetting Method

Son, HY; Gam, SA; Paik, Kyung-Wookresearcher, Formation of Pb/63Sn Solder Bumps using a Solder Droplet Jetting Method, pp.147 - 152, 2004-12

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