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Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Engelmann, G

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Showing results 1 to 4 of 4

1
Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging

Jurenka, C; Kim, JY; Wolf, MJ; Engelmann, G; Ehrmann, O; Yu, Jin; Reichl, H, 55th Electronic Components and Technology Conference, ECTC 2005, v.1, pp.89 - 93, 2005-05-31

2
Effects of Variation of Cu UBM Thickness in Electrodeposited Pure Tin Solder Microbumps

Yu, Jin; Kim, JY; Jurenka, C; Wolf, J; Engelmann, G; Herbert Reichl, EMAP 2004 Proceedings, pp.373 - 378, 2004

3
Multiple Flip-chip Assembly for Hybrid Compact Optoelectronic Modules using Electroplated AuSn Solder Bumps

Jeon, Duk Young; Chu, KM; Lee, JS; Oppermann, H; Engelmann, G; Wolf, J; Reichl, H, IMAPS 2006 (39th International Symposium on Microelectronics 2006), pp.653 -, 2006

4
Successive Multiple Flip-chip Assembly using Gold-tin Solder Bump for a Compact Optoelectronic Module

Jeon, Duk Young; Chu, KM; Lee, JS; Oppermann, H; Engelmann, G; Wolf, J; Reichl, H, 2006 Microoptics Conference (The Joint International Conference on Plastic Optical Fiber and Microoptics 2006), pp.78 -, 2006

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