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Effects of Humidity Cycling on Polymer Overlaid High Density Interconnects Paik, Kyung-Wook; Li, X; Pecht, M; Bernard, E, Proceeding of IEEE-CHMT VLSI packaging workshop, pp.11 - 13, 1993-10-01 |
Relative humidity cycle testing on GE-HDI Li, M; Wu, X; Pecht, M; Paik, Kyung-Wook; Bernard, E, INTERNATIONAL JOURNAL OF MICROELECTRONIC PACKAGING, v.1, no.1, pp.13 - 34, 1995-01 |
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